TYPICAL OPERATING CIRCUIT
ADM211
SD
GND
10
25
RS-232
INPUTS**
*INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT
**INTERNAL 5k
PULL-DOWN RESISTOR ON EACH RS-232 INPUT
T1
IN
RS-232
OUTPUTS
TTL/CMOS
INPUTS*
T1
OUT
T2 I
N
T4 I
N
T2
OUT
T4
OUT
7
6
3
2
T2
T1
+5V TO +10V
VOLTAGE
DOUBLER
+10V TO 10V
VOLTAGE
INVERTER
17
0.1
F
16V
13
0.1
F
6.3V
+5V INPUT
V
CC
V+
V
C1+
C1
C2+
C2
0.1
F
16V
11
0.1
F
14
12
0.1
F
16V
16
15
T3
IN
T3
OUT
20
1
T3
21
28
T4
TTL/CMOS
OUTPUTS
R3
IN
R4
IN
R3
OUT
R4
OUT
R4
R3
24
EN
27
23
22
26
R1
IN
R2
IN
R1
OUT
R2
OUT
R2
R1
9
4
5
8
R5
IN
R5
OUT
R5
18
19
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
a
0.1 F, +5 V Powered
CMOS RS-232 Drivers/Receivers
ADM205ADM211/ADM213
FEATURES
0.1 F to 10 F Capacitors
120 kB/s Data Rate
2 Receivers Active in Shutdown (ADM213)
On-Board DC-DC Converters
9 V Output Swing with +5 V Supply
Low Power (15 mW)
Low Power Shutdown
5 W
30 V Receiver Input Levels
Latch-Up FREE
Plug-In Upgrade for MAX205-211/213
APPLICATIONS
Computers
Peripherals
Modems
Printers
Instruments
Analog Devices, Inc., 1994
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700
Fax: 617/326-8703
GENERAL DESCRIPTION
The ADM2xx family of line drivers/receivers is intended for all
EIA-232-E and V.28 communications interfaces, especially in
applications where
12 V is not available. The ADM205,
ADM206, ADM211 and ADM213 feature a low power shut-
down mode which reduces power dissipation to less than 5
W
making them ideally suited for battery powered equipment. The
ADM205 does not require any external components and is par-
ticularly useful in applications where printed circuit board space
is critical. The ADM213 has an active-low shutdown and an
active-high receiver enable control. Two receivers of the
ADM213 remain active during shutdown. This feature is useful
for ring indicator monitoring.
All members of the ADM2xx family, except the ADM209, in-
clude two internal charge pump voltage converters which allow
operation from a single +5 V supply. These converters convert
the +5 V input power to the
10 V required for RS-232 output
levels. The ADM209 is designed to operate from +5 V and
+12 V supplies. An internal +12 V to 12 V charge pump volt-
age converter generates the 12 V supply.
Table I. Selection Table
No. of
No. of
Low Power
TTL
No. of Receivers
Part
Power
RS-232
RS-232
External
Shutdown
Three-State
Active in
Number
Supply Voltage
Drivers
Receivers
Capacitors
(SD)
EN
Shutdown
ADM205
+5 V
5
5
None
Yes
Yes
0
ADM206
+5 V
4
3
4
Yes
Yes
0
ADM207
+5 V
5
3
4
No
No
0
ADM208
+5 V
4
4
4
No
No
0
ADM209
+5 V & +9 V to +13.2 V
3
5
2
No
Yes
0
ADM211
+5 V
4
5
4
Yes
Yes
0
ADM213
+5 V
4
5
4
Yes (SD)
Yes (EN)
2
ADM205ADM211/ADM213SPECIFICATIONS
Parameter
Min
Typ
Max
Units
Test Conditions/Comments
Output Voltage Swing
5
9
Volts
All Transmitter Outputs Loaded with 3 k
to
Ground
V
CC
Power Supply Current
3
7
mA
No Load, ADM206, ADM211, ADM213
5
9
mA
No Load, ADM205, ADM207, ADM208
0.4
1
mA
No Load, ADM209
V+ Power Supply Current
3.5
5
mA
No Load, V+ = 12 V ADM209 Only
Shutdown Supply Current
1
5
A
Input Logic Threshold Low, V
INL
0.8
V
T
IN
, EN, SD, EN, SD
Input Logic Threshold High, V
INH
2.0
V
T
IN
, EN, SD, EN, SD
Logic Pull-Up Current
10
25
A
T
IN
= 0 V
RS-232 Input Voltage Range
30
+30
V
RS-232 Input Threshold Low
0.8
1.2
V
RS-232 Input Threshold High
1.7
2.4
V
RS-232 Input Hysteresis
0.2
0.5
1.0
V
RS-232 Input Resistance
3
5
7
k
TTL/CMOS Output Voltage Low, V
OL
0.4
V
I
OUT
= 1.6 mA
TTL/CMOS Output Voltage High, V
OH
3.5
V
I
OUT
= 1.0 mA
TTL/CMOS Output Leakage Current
0.05
5
A
EN
= V
CC
, EN = 0 V, 0 V
R
OUT
V
CC
Output Enable Time (T
EN
)
115
ns
ADM205, ADM206, ADM209, ADM211
(Figure 25. C
L
= 150 pF)
Output Disable Time (T
DIS
)
165
ns
ADM205, ADM206, ADM209, ADM211
(Figure 25. R
L
= 1 k
)
Propagation Delay
0.5
5
s
RS-232 to TTL
Instantaneous Slew Rate
l
25
30
V/
s
C
L
= 10 pF, R
L
= 3-7 k
, T
A
= +25
C
Transition Region Slew Rate
3
6
V/
s
R
L
= 3 k
, C
L
= 2500 pF
Measured from +3 V to 3 V or 3 V to +3 V
Output Resistance
300
V
CC
= V+ = V = 0 V, V
OUT
=
2 V
RS-232 Output Short Circuit Current
12
60
mA
NOTE
1
Sample tested to ensure compliance.
Specifications subject to change without notice.
(V
CC
= +5 V 10% (206, 207, 208, 2O9,
211, 213); V
CC
= +5 V 5% (ADM205);
V+ = +9 V to +13.2 V (ADM209); C1C4 = 0.1 F Ceramic. All Specifications T
MIN
to T
MAX
unless otherwise noted.)
REV. 0
2
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25
C unless otherwise noted)
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +6 V
V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V
CC
0.3 V) to +14 V
V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to 14 V
Input Voltages
T
IN
. . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to (V
CC
+ 0.3 V)
R
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
30 V
Output Voltages
T
OUT
. . . . . . . . . . . . . . . . . . . (V+, + 0.3 V) to (V, 0.3 V)
R
OUT
. . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to (V
CC
+ 0.3 V)
Short Circuit Duration
T
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Power Dissipation
N-24 DIP (Derate 13.5 mW/
C above +70
C) . . . 1000 mW
N-24A DIP (Derate 13.5 mW/
C above +70
C) . . 500 mW
R-24 SOIC (Derate 12 mW/
C above +70
C) . . . . . 850 mW
R-28 SOIC (Derate 12.5 mW/
C above +70
C) . . 900 mW
RS-28 SSOP (Derate 10 mW/
C above +70
C) . . . . 900 mW
Q-24 Cerdip (Derate 12.5 mW/
C above +70
C) . 1000 mW
D-24 Ceramic (Derate 20 mW/
C above +70
C) . . 1000 mW
Thermal Impedance,
JA
N-24 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
C/W
N-24A DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
C/W
R-24 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
C/W
R-28 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
C/W
RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
C/W
Q-14 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
C/W
Q-16 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
C/W
Q-20 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
C/W
Q-24 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
C/W
D-24 Ceramic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
C/W
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . . . -40
C to +85
C
Storage Temperature Range . . . . . . . . . . . . . 65
C to +150
C
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . . +300
C
Vapour Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220
C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . > 2000 V
*This is a stress rating only and functional operation of the device at these or any
other conditions above those indicated in the operation sections of this specifica-
tion is not implied. Exposure to absolute maximum rating conditions for extended
periods of time may affect reliability.
ADM205ADM211/ADM213
REV. 0
3
ORDERING GUIDE
Temperature
Package
Temperature
Package
Temperature
Package
Model
Range
Option*
Model
Range
Option*
Model
Range
Option*
ADM205
ADM206
ADM207
ADM205AN
40
C to +85
C
N-24A
ADM206AN
40
C to +85
C
N-24
ADM207AN
40
C to +85
C
N-24
ADM206AR
40
C to +85
C
R-24
ADM207AR
40
C to +85
C
R-24
ADM206ARS 40
C to +85
C
RS-24
ADM207ARS 40
C to +85
C
RS-24
ADM208
ADM209
ADM211
ADM208AN
40
C to +85
C
N-24
ADM209AN
40
C to +85
C
N-24
ADM211AR
40
C to +85
C
R-28
ADM208AR
40
C to +85
C
R-24
ADM209AR
40
C to +85
C
R-24
ADM211ARS 40
C to +85
C
RS-28
ADM208ARS 40
C to +85
C
RS-24
ADM209ARS 40
C to +85
C
RS-24
ADM213
ADM213AR
40
C to +85
C
R-28
ADM213ARS 40
C to +85
C
RS-28
*N = Plastic DIP; R = Small Outline IC (SOIC); RS = Small Shrink Outline Package (SSOP).
1
2
3
7
24
23
22
18
8
9
10
17
16
15
11
12
14
13
4
5
21
20
6
19
Top View
(Not to Scale)
ADM205
T1
IN
T2
IN
T3
IN
T4
IN
T5
IN
T1
OUT
T2
OUT
T3
OUT
T4
OUT
T5
OUT
V
CC
GND
SD
EN
R3
IN
R4
IN
R5
IN
R1
IN
R2
IN
R2
OUT
R1
OUT
R3
OUT
R4
OUT
R5
OUT
Figure 1. ADM205 DIP Pin Configuration
ADM205
0.1
F
T1
IN
SD
RS-232
OUTPUTS
TTL/CMOS
INPUTS
*
T1
OUT
GND
11
T2
IN
T3
IN
T4
IN
T5
IN
T2
OUT
T3
OUT
T4
OUT
T5
OUT
T3
22
16
7
8
15
21
19
4
2
3
1
T4
T2
T1
T5
RS-232
INPUTS
**
TTL/CMOS
OUTPUTS
R1
OUT
R1
IN
R2
IN
R3
IN
R4
IN
R5
IN
R2
OUT
R3
OUT
R4
OUT
R5
OUT
R1
R5
R4
R3
R2
20
*
INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT
**INTERNAL 5k
PULL-DOWN RESISTOR ON EACH RS-232 INPUT
EN
13
5
24
10
18
14
17
6
9
23
12
+5V INPUT
V
CC
Figure 2. ADM205 Typical Operating Circuit
ADM205ADM211/ADM213
REV. 0
4
1
2
3
7
24
23
22
18
8
9
10
17
16
15
11
12
14
13
4
5
21
20
6
19
Top View
(Not to Scale)
ADM206
T1
IN
T2
IN
T1
OUT
T2
OUT
T3
OUT
V
CC
GND
SD
EN
R3
IN
R1
IN
R2
IN
R2
OUT
R1
OUT
R3
OUT
T3
IN
T4
IN
T4
OUT
V+
V
C1+
C1
C2+
C2
Figure 3. ADM206 DIP/SOIC/SSOP Pin Configuration
TTL/CMOS
INPUTS
*
TTL/CMOS
OUTPUTS
T1
IN
ADM206
SD
RS-232
OUTPUTS
T1
OUT
GND
8
T2
IN
T3
IN
T4
IN
T2
OUT
T3
OUT
T4
OUT
T3
19
6
7
18
21
3
1
2
24
T4
T2
T1
RS-232
INPUTS
**
R1
IN
R2
IN
R3
IN
R1
OUT
R2
OUT
R3
OUT
R3
R2
R1
20
*
INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT
**INTERNAL 5k
PULL-DOWN RESISTOR ON EACH RS-232 INPUT
EN
16
4
23
17
22
5
+5V TO +10V
VOLTAGE
DOUBLER
+10V TO 10V
VOLTAGE
INVERTER
14
13
12
10
15
11
0.1
F
6.3V
+5V INPUT
V
CC
V+
V
C1+
C1
C2+
C2
0.1
F
6.3V
0.1
F
16V
0.1
F
16V
9
0.1
F
Figure 4. ADM206 Typical Operating Circuit
1
2
3
7
24
23
22
18
8
9
10
17
16
15
11
12
14
13
4
5
21
20
6
19
Top View
(Not to Scale)
ADM207
T1
IN
T2
IN
T1
OUT
T2
OUT
T3
OUT
V
CC
GND
R3
IN
R1
IN
R2
IN
R2
OUT
R1
OUT
R3
OUT
T3
IN
T4
IN
T4
OUT
V+
V
C1+
C1
C2+
C2
T5
IN
T5
OUT
Figure 5. ADM207 DIP/SOIC/SSOP Pin Configuration
T1
IN
ADM207
RS-232
OUTPUTS
TTL/CMOS
INPUTS
*
T1
OUT
GND
8
T2
IN
T3
IN
T4
IN
T2
OUT
T3
OUT
T4
OUT
T3
19
6
7
18
3
1
2
24
T4
T2
T1
RS-232
INPUTS
**
TTL/CMOS
OUTPUTS
R1
IN
R2
IN
R3
IN
R1
OUT
R2
OUT
R3
OUT
R3
R2
R1
*
INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT
**INTERNAL 5k
PULL-DOWN RESISTOR ON EACH RS-232 INPUT
16
4
23
17
22
5
+5V TO +10V
VOLTAGE
DOUBLER
+10V TO 10V
VOLTAGE
INVERTER
14
13
12
10
15
0.1
F
16V
11
0.1
F
6.3V
+5V INPUT
V
CC
V+
V
C1+
C1
C2+
C2
0.1
F
6.3V
0.1
F
16V
T5
IN
T5
OUT
21
20
T5
9
0.1
F
Figure 6. ADM207 Typical Operating Circuit
ADM205ADM211/ADM213
REV. 0
5
1
2
3
7
24
23
22
18
8
9
10
17
16
15
11
12
14
13
4
5
21
20
6
19
Top View
(Not to Scale)
ADM209
R4
IN
R5
IN
R1
IN
R4
OUT
R1
OUT
V
CC
GND
T3
IN
T2
IN
R2
OUT
R5
OUT
R3
OUT
R3
IN
T1
OUT
T1
IN
V+
NC
C+
C
T3
OUT
R2
IN
T2
OUT
V
EN
NC = NO CONNECT
Figure 9. ADM209 DIP/SOIC/SSOP Pin Configuration
T1
IN
ADM209
NC
RS-232
OUTPUTS
TTL/CMOS
INPUTS
*
T1
OUT
GND
3
T2
IN
T3
IN
T2
OUT
T3
OUT
T3
23
24
16
15
20
13
19
T2
T1
RS-232
INPUTS
**
TTL/CMOS
OUTPUTS
R3
IN
R4
IN
R5
IN
R3
OUT
R4
OUT
R5
OUT
R5
R4
R3
14
*
INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT
**INTERNAL 5k
PULL-DOWN RESISTOR ON EACH RS-232 INPUT
EN
9
18
12
10
11
17
+12V TO 12V
VOLTAGE
INVERTER
7
6
8
0.1
F
16V
5
+5V INPUT
V
CC
V+
V
C1+
C1
0.1
F
16V
4
+9V TO +13.2V
INPUT
R1
IN
R2
IN
R1
OUT
R2
OUT
R2
R1
2
21
22
1
0.1
F
Figure 10. ADM209 Typical Operating Circuit
1
2
3
7
24
23
22
18
8
9
10
17
16
15
11
12
14
13
4
5
21
20
6
19
Top View
(Not to Scale)
ADM208
T1
IN
R1
IN
T1
OUT
R2
OUT
T2
OUT
V
CC
GND
R4
IN
R2
IN
R3
IN
R3
OUT
R1
OUT
R4
OUT
T2
IN
T3
IN
T3
OUT
V+
V
C1+
C1
C2+
C2
T4
IN
T4
OUT
Figure 7. ADM208 DIP/SOIC/SSOP Pin Configuration
T1
IN
ADM208
RS-232
OUTPUTS
TTL/CMOS
INPUTS
*
T1
OUT
GND
8
T2
IN
T3
IN
T4
IN
T2
OUT
T3
OUT
T4
OUT
T3
19
5
18
1
2
24
T4
T2
T1
RS-232
INPUTS
**
TTL/CMOS
OUTPUTS
R1
IN
R2
IN
R3
IN
R1
OUT
R2
OUT
R3
OUT
R3
R2
R1
*
INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT
**INTERNAL 5k
PULL-DOWN RESISTOR ON EACH RS-232 INPUT
3
7
23
4
22
6
+5V TO +10V
VOLTAGE
DOUBLER
+10V TO 10V
VOLTAGE
INVERTER
14
13
12
10
15
0.1
F
16V
11
0.1
F
6.3V
+5V INPUT
V
CC
V+
V
C1+
C1
C2+
C2
0.1
F
6.3V
0.1
F
16V
21
20
9
R4
IN
R4
OUT
R3
16
17
0.1
F
Figure 8. ADM208 Typical Operating Circuit
ADM205ADM211/ADM213
REV. 0
6
1
2
3
7
28
27
26
22
8
9
10
21
20
19
11
12
18
17
4
5
25
24
6
23
Top View
(Not to Scale)
13
14
16
15
ADM211
R2
OUT
R2
IN
R5
IN
T4
IN
R3
IN
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R5
OUT
V+
V
V
CC
C1+
C1
C2+
C2
GND
SD
R3
OUT
EN
T3
IN
R4
IN
R4
OUT
R1
IN
R1
OUT
T1
IN
T2
IN
Figure 11. ADM211 SOIC/SSOP Pin Configuration
ADM211
GND
10
SD
25
RS-232
INPUTS
**
TTL/CMOS
OUTPUTS
24
*
INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT
**INTERNAL 5k
PULL-DOWN RESISTOR ON EACH RS-232 INPUT
EN
R5
IN
R5
OUT
R5
18
19
R4
IN
R4
OUT
R4
23
22
R1
IN
R1
OUT
R1
R3
IN
R3
OUT
R3
27
26
9
R2
IN
R2
OUT
R2
4
5
8
T1
IN
RS-232
OUTPUTS
TTL/CMOS
INPUTS
*
T1
OUT
T3
IN
T3
OUT
T3
20
7
2
1
T1
+5V TO +10V
VOLTAGE
DOUBLER
+10V TO 10V
VOLTAGE
INVERTER
16
15
14
12
17
0.1
F
16V
13
0.1
F
6.3V
+5V INPUT
V
CC
V+
V
C1+
C1
C2+
C2
0.1
F
16V
0.1
F
16V
T4
IN
T4
OUT
T4
21
28
11
0.1
F
T2
IN
T2
OUT
6
3
T2
Figure 12. ADM211 Typical Operating Circuit
1
2
3
7
28
27
26
22
8
9
10
21
20
19
11
12
18
17
4
5
25
24
6
23
Top View
(Not to Scale)
13
14
16
15
ADM213
R2
OUT
R2
IN
R5
IN
*
T4
IN
R3
IN
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R5
OUT
*
V+
V
V
CC
C1+
C1
C2+
C2
GND
SD
R3
OUT
EN
T3
IN
R4
IN
*
R4
OUT
*
R1
IN
R1
OUT
T1
IN
T2
IN
* ACTIVE IN SHUTDOWN
Figure 13. ADM213 SOIC/SSOP Pin Configuration
ADM213
GND
10
SD
25
RS-232
INPUTS
**
TTL/CMOS
OUTPUTS
24
*
INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT
** INTERNAL 5k
PULL-DOWN RESISTOR ON EACH RS-232 INPUT
*** ACTIVE IN SHUTDOWN
EN
R5
IN
***
R5
OUT
***
R5
18
19
R4
IN
***
R4
OUT
***
R4
23
22
R1
IN
R1
OUT
R1
R3
IN
R3
OUT
R3
27
26
9
R2
IN
R2
OUT
R2
4
5
8
T1
IN
RS-232
OUTPUTS
TTL/CMOS
INPUTS
*
T1
OUT
T3
IN
T3
OUT
T3
20
7
2
1
T1
+5V TO +10V
VOLTAGE
DOUBLER
+10V TO 10V
VOLTAGE
INVERTER
16
15
14
12
17
0.1
F
16V
13
0.1
F
6.3V
+5V INPUT
V
CC
V+
V
C1+
C1
C2+
C2
0.1
F
16V
0.1
F
16V
T4
IN
T4
OUT
T4
21
28
11
0.1
F
T2
IN
T2
OUT
6
3
T2
Figure 14. ADM213 Typical Operating Circuit
ADM205ADM211/ADM213
REV. 0
7
PIN FUNCTION DESCRIPTION
Mnemonic
Function
V
CC
Power Supply Input 5 V
10% (+5 V
5% ADM205).
V+
Internally generated positive supply (+10 V nominal) on all parts except ADM209.
ADM209 requires external 9 V to 13.2 V supply.
V
Internally generated negative supply (10 V nominal).
GND
Ground pin. Must be connected to 0 V.
C+
(ADM209 only) External capacitor (+ terminal) is connected to this pin.
C
(ADM209 only) External capacitor ( terminal) is connected to this pin.
C1+
(ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (+ terminal) is connected to this pin.
C1
(ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor ( terminal) is connected to this pin.
C2+
(ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (+ terminal) is connected to this pin.
C2
(ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor ( terminal) is connected to this pin.
T
IN
Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 k
pull-up resistor to Vcc is
connected on each input.
T
OUT
Transmitter (Driver) Outputs. These are RS-232 levels (typically
10 V).
R
IN
Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 k
pull-down resistor to GND is con-
nected on each input.
R
OUT
Receiver Outputs. These are TTL/CMOS levels.
EN
/EN
Enable Input. Active low on ADM205, ADM206, ADM209, ADM211. Active high on ADM213. This input is
used to enable/disable the receiver outputs. With EN = Low (EN = High ADM213), the receiver outputs are en-
abled. With EN =High (EN = low ADM213), the outputs are placed in a high impedance state. This facility is
useful for connecting to microprocessor systems.
SD/SD
Shutdown Input. Active high on ADM205, ADM206, ADM211. Active low on ADM213. With SD = high on the
ADM205, ADM206, ADM211, the charge pump is disabled, the receiver outputs are placed in a high impedance
state and the driver outputs are turned off. With SD low on the ADM213, the charge pump is disabled, the driver
outputs are turned off and all receivers except R4 and R5 are placed in a high impedance state. In shutdown, the
power consumption reduces to 5
W.
NC
No Connect. No connections are required to this pin.
Table II. ADM205, ADM206, ADM211 Truth Table
SD
EN
Status
Transmitters T1T5
Receivers R1R5
0
0
Normal Operation
Enabled
Enabled
0
1
Normal Operation
Enabled
Disabled
1
0
Shutdown
Disabled
Disabled
Table III. ADM213 Truth Table
SD
EN
Status
Transmitters T1-T4
Receivers R1-R3
Receivers R4, R5
0
0
Shutdown
Disabled
Disabled
Disabled
0
1
Shutdown
Disabled
Disabled
Enabled
1
0
Normal Operation
Enabled
Disabled
Disabled
1
1
Normal Operation
Enabled
Enabled
Enabled
0
40
2
0
6
4
8
10
30
20
10
| V |
V
OUT
-- Volts
I
OUT
-- mA
V+
Figure 15. Charge Pump V+, V vs. Current
18
4
2500
10
6
8
0
16
12
14
2000
1500
1000
500
CAPACITIVE LOAD pF
SLEW RATE V/
s
Figure 16. Transmitter Slew Rate vs. Load Capacitance
4
5.0
6
3.0
10
8
4.0
V
CC
V
V
OUT
V
V
OUT
(1 O/P LOADED)
V
OUT
(ALL O/Ps LOADED)
Figure 17. Transmitter Output Voltage vs. V
CC
12
0
8
2
0
6
4
8
10
6
4
2
T
OUT
V
T
OUT
HIGH
T
OUT
LOW
I
OUT
mA
Figure 18. Transmitter Output Voltage vs. Current
0
5
100
3
300
200
4
V
CC
V
V+, V IMPEDANCE
V (LOADED)
V (UNLOADED)
V+ (UNLOADED)
V+ (LOADED)
Figure 19. Charge Pump Impedance vs. V
CC
8
REV. 0
ADM205ADM211/ADM213Typical Performance Characteristics
ADM205ADM211/ADM213
REV. 0
9
10
90
100
0%
5V
0.8 V
A3
5V
5
B
Lw
1Ms
H
O
Figure 20. Charge Pump, V+, V Exiting Shutdown
10
90
100
0%
5V
0.8 V
A3
5
B
Lw
5
s
H
O
Figure 21. Transmitter Output Loaded Slew Rate
10
90
100
0%
5V
0.8 V
A3
5
B
Lw
1
s
H
O
Figure 22. Transmitter Output Unloaded Slew Rate
GENERAL INFORMATION
The ADM205-ADM211 and ADM213 family of RS-232 driv-
ers/receivers are designed to solve interface problems by meeting
the EIA-232-E specifications while using a single digital +5 V
supply. The EIA-232-E standard requires transmitters which
will deliver
5 V minimum on the transmission channel and re-
ceivers which can accept signal levels down to
3 V. The
ADM205-ADM211 and ADM213 meet these requirements by
integrating step up voltage converters and level shifting trans-
mitters and receivers onto the same chip. CMOS technology is
used to keep the power dissipation to an absolute minimum. A
comprehensive range of transmitter/receiver combinations is
available to cover most communications needs. The ADM205
ADM211 and ADM213 are modifications, enhancements and
improvements to the AD230AD241 family and derivatives
thereof. They are essentially plug-in compatible and do not have
materially different applications.
The ADM205, ADM206, ADM211, and ADM213 are particu-
larly useful in battery powered systems as they feature a low
power shutdown mode which reduces power dissipation to less
than 5
W.
The ADM205 is designed for applications where space saving is
important as the charge pump capacitors are molded into the
package.
The ADM209 includes only a negative charge pump converter
and are intended for applications where a positive 12 V is available.
To facilitate sharing a common line or for connection to a mi-
croprocessor data bus the ADM205, ADM206, ADM209,
ADM211 and ADM213 feature an enable (EN) function. When
disabled, the receiver outputs are placed in a high impedance
state.
CIRCUIT DESCRIPTION
The internal circuitry in the ADM205-ADM211 and ADM213
consists of three main sections. These are:
(a) A charge pump voltage converter
(b) RS-232 to TTL/CMOS receivers
(c) TTL/CMOS to RS-232 transmitters
Charge Pump DC-DC Voltage Converter
The charge pump voltage converter consists of an oscillator and
a switching matrix. The converter generates a
10 V supply
from the input 5 V level. This is done in two stages using a
switched capacitor technique as illustrated in Figures 23 and 24.
First, the 5 V input supply is doubled to 10 V using capacitor
C1 as the charge storage element. The 10 V level is then in-
verted to generate 10 V using C2 as the storage element.
S1
S3
V+ = 2V
CC
S2
S4
INTERNAL
OSCILLATOR
C1
C3
V
CC
GND
V
CC
Figure 23. Charge-Pump Voltage Doubler
S1
S3
S2
S4
INTERNAL
OSCILLATOR
C2
C4
V = (V+)
GND
V+
GND
FROM
VOLTAGE
DOUBLER
Figure 24. Charge-Pump Voltage Inverter
Capacitors C3 and C4 are used to reduce the output ripple.
Their values are not critical and can be reduced if higher levels
of ripple are acceptable. The charge pump capacitors C1 and
C2 may also be reduced at the expense of higher output imped-
ance on the V+ and V supplies.
The V+ and V supplies may also be used to power external cir-
cuitry if the current requirements are small.
ADM205ADM211/ADM213
REV. 0
10
Transmitter (Driver) Section
The drivers convert TTL/CMOS input levels into EIA-232-E
output levels. With V
CC
= +5 V and driving a typical EIA-232-E
load, the output voltage swing is
9 V. Even under worst case
conditions the drivers are guaranteed to meet the
5 V EIA-232-E
minimum requirement.
The input threshold levels are both TTL and CMOS compat-
ible with the switching threshold set at V
CC
/4. With a nominal
V
CC
= 5 V the switching threshold is 1.25 V typical. Unused in-
puts may be left unconnected, as an internal 400 k
pull-up re-
sistor pulls them high forcing the outputs into a low state.
As required by the EIA-232-E standard, the slew rate is limited
to less than 30 V/
s without the need for an external slew limit-
ing capacitor and the output impedance in the power-off state is
greater than 300
.
Receiver Section
The receivers are inverting level shifters which accept EIA-232-E
input levels (
5 V to
15 V) and translate them into 5 V TTL/
CMOS levels. The inputs have internal 5 k
pull-down resistors
to ground and are also protected against overvoltages of up to
30 V. The guaranteed switching thresholds are 0.8 V mini-
mum and 2.4 V maximum which are well within the
3 V
EIA-232-E requirement. The low level threshold is deliberately
positive as it ensures that an unconnected input will be inter-
preted as a low level.
The receivers have Schmitt trigger inputs with a hysteresis level
of 0.5 V. This ensures error-free reception for both noisy inputs
and for inputs with slow transition times.
Shutdown (SD)
The ADM205, ADM206, ADM211 and ADM213 feature a
control input which may be used to disable the part and reduce
the power consumption to less than 5
W. This is very useful in
battery operated systems. During shutdown the charge pump is
turned off, the transmitters are disabled and all receivers except
R4 and R5 on the ADM213 are put into a high-impedance dis-
abled state. Receivers R4 and R5 on the ADM213 remain en-
abled during shutdown. This feature allows monitoring external
activity such as ring indicator monitoring while the device is in a
low power shutdown mode. The shutdown control input is ac-
tive high on all parts except the ADM213 where it is active low.
Refer to Tables II and III.
Enable Input
The ADM205, ADM209, ADM211, and ADM213 feature an
enable input used to enable or disable the receiver outputs. The
enable input is active low on the ADM205, ADM209, ADM211
and active-high on the ADM213. Refer to Tables II and III.
When disabled, all receiver outputs are placed in a high imped-
ance state. This function allows the outputs to be connected di-
rectly to a microprocessor data bus. It can also be used to allow
receivers from different devices to share a common data line.
The timing diagram for the enable function is shown in Figure
25.
T
EN
T
DIS
3V
0V
R
OUT
3.5V
0.8V
V
OH
0.1V
V
VOL
+ 0.1V
EN
*
* POLARITY OF EN IS REVERSED FOR ADM213
Figure 25. Enable Timing
APPLICATION HINTS
Driving Long Cables
In accordance with the EIA-232-E standard, long cables are
permissible provided that the total load capacitance does not ex-
ceed 2500 pF. For longer cables which do exceed this, then it is
possible to trade off baud rate vs. cable length. Large load ca-
pacitances cause a reduction in slew rate, and hence the maximum
transmission baud rate is decreased. The ADM205ADM211 and
ADM213 are designed so that the slew rate reduction with in-
creasing load capacitance is minimized.
For the receivers, it is important that a high level of noise immu-
nity be inbuilt so that slow rise and fall times do not cause mul-
tiple output transitions as the signal passes slowly through the
transition region. The ADM205ADM211 and ADM213 have
0.5 V of hysteresis to guard against this. This ensures that, even
in noisy environments, error-free reception can be achieved.
High Baud Rate Operation
The ADM205ADM211 and ADM213 feature high slew rates
permitting data transmission at rates well in excess of the
EIA-232-E specification. The drivers maintain
5 V signal
levels at data rates up to 120-kB/s under worst-case loading
conditions.
ADM205ADM211/ADM213
REV. 0
11
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Lead Plastic DIP (N-24)
PIN 1
0.260
0.001
(6.61
0.03)
24
1
13
12
0.32 (8.128)
0.30 (7.62)
0.011 (0.28)
0.009 (0.23)
15
0
0.02 (0.5)
0.016 (0.41)
0.130 (3.30)
0.128 (3.25)
0.07 (1.78)
0.05 (1.27)
SEATING
PLANE
1.228 (31.19)
1.226 (31.14)
0.11 (2.79)
0.09 (2.28)
NOTES
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Cerdip (Q-24)
PIN 1
1
24
12
13
1
24
12
13
0.295 (7.493)
MAX
0.225
(5.715)
MAX
0.125
(3.175)
MIN
0.070 (1.778)
0.020 (0.508)
0.180
(4.572)
MAX
SEATING
PLANE
1.290 (32.77) MAX
0.021 (0.533)
0.015 (0.381)
TYP
0.065 (1.651)
0.055 (1.397)
TYP
0.110 (2.794)
0.090 (2.286)
TYP
0.320 (8.128)
0.290 (7.366)
15
0
0.012 (0.305)
0.008 (0.203)
TYP
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH.
2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Plastic DIP (N-24A)
PIN 1
0.55 (13.97)
0.53 (13.47)
24
1
13
12
0.606 (15.4)
0.594 (15.09)
0.012 (0.305)
0.008 (0.203)
15
0
0.16 (4.07)
0.14 (3.56)
0.2
(5.08)
MAX
0.065 (1.66)
0.045 (1.15)
0.105 (2.67)
0.095 (2.42)
1.25 (31.75)
1.24 (31.5)
0.02 (0.508)
0.015 (0.381)
0.175 (4.45)
0.12 (3.05)
SEATING
PLANE
28-Lead SOIC (R-28)
0.013 (0.32)
0.009 (0.23)
0.042 (1.067)
0.018 (0.447)
6
0
0.03 (0.76)
0.02 (0.51)
PIN 1
0.299 (7.6)
0.291 (7.39)
0.414 (10.52)
0.398 (10.10)
13
12
1
24
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
0.019 (0.49)
0.014 (0.35)
0.05 (1.27)
BSC
0.096 (2.44)
0.089 (2.26)
0.608 (15.45)
0.596 (15.13)
0.01 (0.254)
0.006 (0.15)
28-Lead SSOP (RS-28)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
0.009 (0.229)
0.005 (0.127)
0.037 (0.94)
0.022 (0.559)
8
0
0.0256 (0.65)
BSC
0.07 (1.78)
0.066 (1.67)
0.328 (8.33)
0.318 (8.08)
0.008 (0.203)
0.002 (0.050)
PIN 1
0.311 (7.9)
0.301 (7.64)
0.212 (5.38)
0.205 (5.207)
1
24
13
12
ADM205ADM211/ADM213
REV. 0
12
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
C1897184/94
PRINTED IN U.S.A.
28-Lead SOIC (R-28)
0.019 (0.49)
0.014 (0.35)
0.05 (1.27)
BSC
0.708 (18.02)
0.696 (17.67)
0.01 (0.254)
0.006 (0.15)
0.096 (2.44)
0.089 (2.26)
0.013 (0.32)
0.009 (0.23)
0.042 (1.067)
0.018 (0.457)
6
0
0.03 (0.76)
0.02 (0.51)
PIN 1
0.299 (7.6)
0.291 (7.39)
0.414 (10.52)
0.398 (10.10)
15
14
1
28
1. LEAD NO. IDENTIFIED BY A DOT.
2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
28-Lead SSOP (RS-28)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
0.009 (0.229)
0.005 (0.127)
0.037 (0.94)
0.022 (0.559)
8
0
0.0256 (0.65)
BSC
0.407 (10.34)
0.397 (10.08)
0.008 (0.203)
0.002 (0.050)
0.07 (1.78)
0.066 (1.67)
PIN 1
15
14
1
28
0.311 (7.9)
0.301 (7.64)
0.212 (5.38)
0.205 (5.207)
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