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Электронный компонент: HCPL-0531

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Dual Channel, High Speed
Optocouplers
Technical Data
HCPL-2530
HCPL-0530
HCPL-2531
HCPL-0531
HCPL-4534
HCPL-0534
Features
15 kV/
s Minimum Common
Mode Transient Immunity at
V
CM
= 1500 V
(HCPL-4534/0534)
High Speed: 1 Mb/s
TTL Compatible
Available in 8 Pin DIP, SO-8,
and 8 Pin DIP Gull Wing
Surface Mount (Option 020)
Packages
High Density Packaging
3 MHz Bandwidth
Open Collector Outputs
Guaranteed Performance
from 0
C to 70
C
Safety Approval
UL Recognized 2500 V rms
for 1 minute (5000 V rms for
1 minute for Option 020) per
UL1577
CSA Approved
Single Channel Version
Available (4502/3, 0452/3)
MIL-STD-1772 Version
Available (55XX/65XX/4N55)
Functional Diagram
Applications
Line Receivers High
Common Mode Transient
Immunity (>1000 V/
s) and
Low Input-Output Capacitance
(0.6 pF)
High Speed Logic Ground
Isolation TTL/TTL, TTL/
LTTL, TTL/CMOS, TTL/LSTTL
Replace Pulse Transformers
Save Board Space and Weight
Analog Signal Ground
Isolation Integrated Photon
Detector Provides Improved
Linearity over Phototransistor
Type
Polarity Sensing
Isolated Analog Amplifier
Dual Channel Packaging
Enhances Thermal Tracking
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
A 0.1
F bypass capacitor between pins 5 and 8 is recommended.
7
1
2
3
4
5
6
8
ANODE 1
CATHODE 1
CATHODE 2
ANODE 2
VCC
VO1
VO2
GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
VO
LOW
HIGH
Description
These dual channel optocouplers
contain a pair of light emitting
diodes and integrated photodetec-
tors with electrical insulation
between input and output.
Separate connection for the
photodiode bias and output
transistor collectors increase the
speed up to a hundred times that
of a conventional phototransistor
coupler by reducing the base-
collector capacitance.
2
These dual channel optocouplers
are available in an 8 Pin DIP and
in an industry standard SO-8
package. The following is a cross
reference table listing the 8 Pin
DIP part number and the
electrically equivalent SO-8 part
number.
SO-8
8 Pin DIP
Package
HCPL-2530
HCPL-0530
HCPL-2531
HCPL-0531
HCPL-4534
HCPL-0534
The SO-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCPL-2530/0530 is for use in
TTL/CMOS, TTL/LSTTL or wide
bandwidth analog applications.
Current transfer ratio (CTR) for
the HCPL-2530/0530 is 7%
minimum at I
F
= 16 mA.
The HCPL-2531/0531 is designed
for high speed TTL/TTL
applications. A standard 16 mA
TTL sink current through the
input LED will provide enough
output current for 1 TTL load and
a 5.6 k
pull-up resistor. CTR of
the HCPL-2531/0531 is 19%
minimum at I
F
= 16 mA.
The HCPL-4534/0534 is an
HCPL-2531/0531 with increased
common mode transient immunity
of 15,000 V/
s minimum at
V
CM
= 1500 V guaranteed.
Selection Guide
Widebody
Minimum CMR
8-pin DIP (300 Mil)
Small-Outline SO-8
(400 Mil)
Hermetic
Current
Dual
Single
Dual
Single
Single
Single and
dV/dt
V
CM
Transfer
Channel
Channel
Channel
Channel
Channel
Dual Channel
(V/
s)
(V)
Ratio (%)
Package
Package*
Package
Package*
Package*
Packages*
1,000
10
7
HCPL-2530
6N135
HCPL-0530
HCPL-0500
HCNW135
19
HCPL-2531
6N136
HCPL-0531
HCPL-0501
HCNW136
HCPL-4502
HCPL-0452
HCNW4502
15,000
1500
19
HCPL-4534
HCPL-4503
HCPL-0534
HCPL-0453
HCNW4503
1,000
10
9
HCPL-55XX
HCPL-65XX
4N55
*Technical data for these products are on separate HP publications.
3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2531#XXX
020 = UL 5000 V rms/1 Minute Option*
300 = Gull Wing Surface Mount Option
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
*For HCPL-2530/1 and HCPL-4534 only.
Gull wing surface mount option applies to through hole parts only.
Schematic
IF1
HCPL-4534/0534 SHIELD
8
7
VCC
+
2
VO1
ICC
VF1
I O1
1
IF2
6
5
GND
4
VO2
VF2
I O2
3
+
USE OF A 0.1 F BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED.
4
Package Outline Drawings
8-Pin DIP Package (HCPL-2530/2531/4534)
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2530/2531/4534)
0.635 0.25
(0.025 0.010)
12 NOM.
9.65 0.25
(0.380 0.010)
0.635 0.130
(0.025 0.005)
7.62 0.25
(0.300 0.010)
5
6
7
8
4
3
2
1
9.65 0.25
(0.380 0.010)
6.350 0.25
(0.250 0.010)
1.016 (0.040)
1.194 (0.047)
1.194 (0.047)
1.778 (0.070)
9.398 (0.370)
9.906 (0.390)
4.826
(0.190)
TYP.
0.381 (0.015)
0.635 (0.025)
PAD LOCATION (FOR REFERENCE ONLY)
1.080 0.320
(0.043 0.013)
4.19
(0.165)
MAX.
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
9.65 0.25
(0.380 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
HP XXXXZ
YYWW
DATE CODE
1.080 0.320
(0.043 0.013)
2.54 0.25
(0.100 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
5
6
7
8
4
3
2
1
5 TYP.
OPTION CODE*
UL
RECOGNITION
UR
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 0.25
(0.300 0.010)
6.35 0.25
(0.250 0.010)
TYPE NUMBER
* MARKING CODE LETTER FOR OPTION NUMBERS.
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
5
Small Outline SO-8 Package (HCPL-0530/0531/0534)
Note: Use of nonchlorine activiated fluxes is highly recommended.
240
T = 115C, 0.3C/SEC
0
T = 100C, 1.5C/SEC
T = 145C, 1C/SEC
TIME MINUTES
TEMPERATURE C
220
200
180
160
140
120
100
80
60
40
20
0
260
1
2
3
4
5
6
7
8
9
10
11
12
Solder Reflow Temperature Profile (HCPL-0530/0531/0534 and Gull Wing Surface
Mount Option Parts)
Regulatory Information
The devices contained in this data
sheet have been approved by the
following organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
XXX
YWW
8
7
6
5
4
3
2
1
5.994 0.203
(0.236 0.008)
3.937 0.127
(0.155 0.005)
0.406 0.076
(0.016 0.003)
1.270
(0.050)
BSG
5.080 0.127
(0.200 0.005)
3.175 0.127
(0.125 0.005)
1.524
(0.060)
45 X
0.432
(0.017)
0.228 0.025
(0.009 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)
MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 0.254 (0.205 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 0.102
(0.008 0.004)
7
PIN ONE
0 ~ 7
*
*