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Электронный компонент: HCPL-0721

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Functional Diagram
* Pin 3 is the anode of the internal LED and must be left unconnected for
guaranteed data sheet performance. Pin 7 is not connected internally.
**A 0.1
F bypass capacitor must be connected between pins 1 and 4, and
5 and 8.
Description
Available in either an 8-pin DIP or
SO-8 package style respectively, the
HCPL-772X or HCPL-072X
optocouplers utilize the latest
CMOS IC technology to achieve
outstanding performance with very
low power consumption. The
HCPL-772X/072X require only two
bypass capacitors for complete
CMOS compatability.
Agilent
HCPL-0720/7720 and HCPL-0721/7721
40 ns Propagation Delay,
CMOS Optocoupler
Data Sheet
Features
+5 V CMOS compatibility
20 ns maximum prop. delay skew
High speed: 25 MBd
40 ns max. prop. delay
10 kV/
s minimum common mode
rejection
40 to 85
C temperature range
Safety and regulatory approvals
UL recognized
3750 V rms for 1 min. per
UL 1577
CSA component acceptance
notice #5
IEC/EN/DIN EN 60747-5-2
V
IORM
= 630 Vpeak for
HCPL-772X option 060
V
IORM
= 560 Vpeak for
HCPL-072X option 060
Applications
Digital fieldbus isolation: CC-Link,
DeviceNet, Profibus, SDS
AC plasma display panel level
shifting
Multiplexed data transmission
Computer peripheral interface
Microprocessor system interface
Basic building blocks of the
HCPL-772X/072X are a CMOS
LED driver IC, a high speed LED
and a CMOS detector IC. A CMOS
logic input signal controls the
LED driver IC which supplies
current to the LED. The detector
IC incorporates an integrated
photodiode, a high-speed
transimpedance amplifier, and a
voltage comparator with an
output driver.
8
7
6
1
3
SHIELD
5
2
4
**VDD1
VI
*
GND1
VDD2**
VO
GND2
VI, INPUT
LED1
H
L
OFF
ON
TRUTH TABLE
(POSITIVE LOGIC)
NC*
IO
LED1
VO, OUTPUT
H
L
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
2
Package Outline Drawing
HCPL-772X 8-Pin DIP Package
Selection Guide
8-Pin DIP
Small Outline
(300 Mil)
SO-8
Data Rate
PWD
HCPL-7721
HCPL-0721
25 MB
6 ns
HCPL-7720
HCPL-0720
25 MB
8 ns
9.65 0.25
(0.380 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXV
YYWW
DATE CODE
1.080 0.320
(0.043 0.013)
2.54 0.25
(0.100 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
5
6
7
8
4
3
2
1
5 TYP.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 0.25
(0.300 0.010)
6.35 0.25
(0.250 0.010)
TYPE NUMBER
*OPTION 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
OPTION 060 CODE*
3.56 0.13
(0.140 0.005)
Ordering Information
Specify Part Number followed by Option Number (if desired)
Example
HCPL-7720#XXXX
060 = IEC/EN/DIN EN 60747-5-2 Option.
300 = Gull Wing Surface Mount Option (HCPL-7720 only).
500 = Tape and Reel Packaging Option.
XXXE = Lead Free Option.
No Option and Option 300 contain 50 units (HCPL-772X), 100 units (HCPL-072X) per tube.
Option 500 contain 1000 units (HCPL-772X), 1500 units (HCPL-072X) per reel.
Option data sheets available. Contact Agilent sales representative or authorized distributor.
Remarks: The notation "#" is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use ""
3
Package Outline Drawing
HCPL-772X Package with Gull Wing Surface Mount Option 300
Package Outline Drawing
HCPL-072X Outline Drawing (Small Outline SO-8 Package)
0.635 0.25
(0.025 0.010)
12 NOM.
9.65 0.25
(0.380 0.010)
0.635 0.130
(0.025 0.005)
7.62 0.25
(0.300 0.010)
5
6
7
8
4
3
2
1
9.65 0.25
(0.380 0.010)
6.350 0.25
(0.250 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 0.320
(0.043 0.013)
3.56 0.13
(0.140 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
XXXV
YWW
8
7
6
5
4
3
2
1
5.994 0.203
(0.236 0.008)
3.937 0.127
(0.155 0.005)
0.406 0.076
(0.016 0.003)
1.270
(0.050)
BSC
5.080 0.127
(0.200 0.005)
3.175 0.127
(0.125 0.005)
1.524
(0.060)
45 X
0.432
(0.017)
0.228 0.025
(0.009 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)
MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 0.254 (0.205 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.203 0.102
(0.008 0.004)
7
PIN ONE
0 ~ 7
*
*
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
4
Regulatory Information
The HCPL-772X/072X have been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
Solder Reflow Thermal Profile
Pb-Free IR Profile
0
TIME (SECONDS)
TEMPERATURE (

C)
200
100
50
150
100
200
250
300
0
30
SEC.
50 SEC.
30
SEC.
160C
140C
150C
PEAK
TEMP.
245C
PEAK
TEMP.
240C
PEAK
TEMP.
230C
SOLDERING
TIME
200C
PREHEATING TIME
150C, 90 + 30 SEC.
2.5C 0.5C/SEC.
3C + 1C/0.5C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3C + 1C/0.5C/SEC.
REFLOW HEATING RATE 2.5C 0.5C/SEC.
217 C
RAMP-DOWN
6 C/SEC. MAX.
RAMP-UP
3 C/SEC. MAX.
150 - 200 C
260 +0/-5 C
t 25 C to PEAK
60 to 150 SEC.
15 SEC.
TIME WITHIN 5 C of ACTUAL
PEAK TEMPERATURE
tp
ts
PREHEAT
60 to 180 SEC.
tL
TL
Tsmax
Tsmin
25
Tp
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 C, Tsmin = 150 C
5
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements. However, once
mounted on a printed circuit
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
There are recommended
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.
Insulation and Safety Related Specifications
Value
Parameter
Symbol
772X
072X
Units
Conditions
Minimum External Air
L(I01)
7.1
4.9
mm
Measured from input terminals to output
Gap (Clearance)
terminals, shortest distance through air.
Minimum External
L(I02)
7.4
4.8
mm
Measured from input terminals to output
Tracking (Creepage)
terminals, shortest distance path along body.
Minimum Internal Plastic
0.08
0.08
mm
Insulation thickness between emitter and
Gap (Internal Clearance)
detector; also known as distance through
insulation.
Tracking Resistance
CTI
175
175
Volts
DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking
Index)
Isolation Group
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89,
Table 1)