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Электронный компонент: HCPL-560K

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Features
Dual Marked with Device
Part Number and DSCC
Drawing Number
Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Five Hermetically Sealed
Package Configurations
Performance Guaranteed
over -55
C to +125
C
High Speed: 10 M Bit/s
CMR: > 10,000 V/
s Typical
1500 Vdc Withstand Test
Voltage
2500 Vdc Withstand Test
Voltage for HCPL-565X
High Radiation Immunity
6N137, HCPL-2601, HCPL-
2630/-31 Function
Compatibility
Reliability Data
TTL Circuit Compatibility
Applications
Military and Space
High Reliability Systems
Transportation, Medical, and
Life Critical Systems
Line Receiver
Voltage Level Shifting
Isolated Input Line Receiver
Isolated Output Line Driver
Logic Ground Isolation
Harsh Industrial
Environments
Isolation for Computer,
Communication, and Test
Equipment Systems
Description
These units are single, dual and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level H
or K testing or from the appropri-
ate DSCC Drawing. All devices are
manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DSCC Quali-
fied Manufacturers List QML-
38534 for Hybrid Microcircuits.
Quad channel devices are
available by special order in the
16 pin DIP through hole
packages.
Truth Table
(Positive Logic)
Multichannel Devices
Input
Output
On (H)
L
Off (L)
H
Functional Diagram
Multiple Channel Devices
Available
Single Channel DIP
Input
Enable
Output
On (H)
H
L
Off (L)
H
H
On (H)
L
H
Off (L)
L
H
*See matrix for available extensions.
Hermetically Sealed, High Speed,
High CMR, Logic Gate
Optocouplers
Technical Data
6N134*
81028
HCPL-563X
HCPL-663X
HCPL-565X
5962-98001
HCPL-268K
HCPL-665X
5962-90855
HCPL-560X
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
VCC
VOUT
VE
GND
The connection of a 0.1
F bypass capacitor between V
CC
and GND is recommended.
2
Selection GuidePackage Styles and Lead Configuration Options
Package
16 Pin DIP
8 Pin DIP
8 Pin DIP
8 Pin DIP
16 Pin Flat Pack 20 Pad LCCC
Lead Style
Through Hole Through Hole Through Hole Through Hole
Unformed Leads
Surface Mount
Channels
2
1
2
2
4
2
Common Channel
V
CC
, GND
None
V
CC
, GND
V
CC
, GND
V
CC
, GND
None
Wiring
Withstand Test Voltage
1500 Vdc
1500 Vdc
1500 Vdc
2500 Vdc
1500 Vdc
1500 Vdc
Agilent Part # & Options
Commercial
6N134*
HCPL-5600
HCPL-5630
HCPL-5650
HCPL-6650
HCPL-6630
MIL-PRF-38534, Class H
6N134/883B
HCPL-5601
HCPL-5631
HCPL-5651
HCPL-6651
HCPL-6631
MIL-PRF-38534, Class K
HCPL-268K
HCPL-560K
HCPL-563K
HCPL-665K
HCPL-663K
Standard Lead Finish
Gold Plate
Gold Plate
Gold Plate
Gold Plate
Gold Plate
Solder Pads
Solder Dipped
Option #200
Option #200
Option #200
Option #200
Butt Cut/Gold Plate
Option #100
Option #100
Option #100
Gull Wing/Soldered
Option #300
Option #300
Option #300
Class H SMD Part #
Prescript for all below
None
5962-
None
None
None
None
Either Gold or Solder
8102801EX
9085501HPX
8102802PX
8102805PX
8102804FX
81028032X
Gold Plate
8102801EC
9085501HPC
8102802PC
8102805PC
8102804FC
Solder Dipped
8102801EA
9085501HPA
8102802PA
8102805PA
81028032A
Butt Cut/Gold Plate
8102801UC
9085501HYC
8102802YC
Butt Cut/Soldered
8102801UA
9085501HYA
8102802YA
Gull Wing/Soldered
8102801TA
9085501HXA
8102802ZA
Class K SMD Part #
Prescript for all below
5962-
5962-
5962-
5962-
5962-
Either Gold or Solder
9800101KEX 9085501KPX
9800102KPX
9800104KFX
9800103K2X
Gold Plate
9800101KEC 9085501KPC
9800102KPC
9800104KFC
Solder Dipped
9800101KEA 9085501KPA
9800102KPA
9800103K2A
Butt Cut/Gold Plate
9800101KUC 9085501KYC
9800102KYC
Butt Cut/Soldered
9800101KUA 9085501KYA
9800102KYA
Gull Wing/Soldered
9800101KTA
9085501KXA
9800102KZA
*JEDEC registered part.
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
high speed photon detector. The
output of the detector is an open
collector Schottky clamped
transistor. Internal shields
provide a guaranteed common
mode transient immunity
specification of 1000 V/
s. For
Isolation Voltage applications
requiring up to 2500 Vdc, the
HCPL-5650 family is also
available. Package styles for
these parts are 8 and 16 pin DIP
through hole (case outlines P and
E respectively), and 16 pin
surface mount DIP flat pack
(case outline F), leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options. See Selection Guide
Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the figures
are identical for all parts.
Occasional exceptions exist due to
package variations and limitations,
and are as noted. Additionally, the
same package assembly processes
and materials are used in all
devices. These similarities give
justification for the use of data
obtained from one part to
represent other parts' performance
for reliability and certain limited
radiation test results.
3
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
GND
1
V
O2
19
20
2
3
V
O1
8
7
V
CC2
V
CC1
10
GND
2
15
13
12
Functional Diagrams
16 Pin DIP
8 Pin DIP
8 Pin DIP
16 Pin Flat Pack
20 Pad LCCC
Through Hole
Through Hole
Through Hole
Unformed Leads
Surface Mount
2 Channels
1 Channel
2 Channels
4 Channels
2 Channels
Note: All DIP and flat pack devices have common V
CC
and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic
chip carrier) package has isolated channels with separate V
CC
and ground connections. All diagrams are "top view."
Leaded Device Marking
Leadless Device Marking
5
7
6
8
12
10
11
9
GND
1
3
2
4
16
14
15
13
V
CC
V
O1
V
O2
V
CC
V
OUT
V
E
GND
1
8
2
7
3
6
4
5
5
7
6
8
12
10
11
9
GND
1
3
2
4
16
14
15
13
V
CC
V
O1
V
O3
V
O2
V
O4
0.20 (0.008)
0.33 (0.013)
4.45 (0.175)
MAX.
20.06 (0.790)
20.83 (0.820)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.89 (0.035)
1.65 (0.065)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3.81 (0.150)
MIN.
1
3
2
4
8
6
7
5
V
CC
GND
V
O2
V
O1
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
COUNTRY OF MFR.
Agilent CAGE CODE*
Agilent DESIGNATOR
DSCC SMD*
PIN ONE/
ESD IDENT
Agilent P/N
DSCC SMD*
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX 50434
DSCC SMD*
Agilent CAGE CODE*
Agilent DESIGNATOR
COUNTRY OF MFR.
Agilent P/N
PIN ONE/
ESD IDENT
DSCC SMD*
* QUALIFIED PARTS ONLY
4
Outline Drawings (continued)
16 Pin Flat Pack, 4 Channels
8 Pin DIP Through Hole, 2 Channels
2500 Vdc Withstand Test Voltage
20 Terminal LCCC Surface Mount,
2 Channels
8 Pin DIP Through Hole, 1 and 2 Channels
8.13 (0.320)
MAX.
5.23
(0.206)
MAX.
2.29 (0.090)
MAX.
7.24 (0.285)
6.99 (0.275)
1.27 (0.050)
REF.
0.46 (0.018)
0.36 (0.014)
11.13 (0.438)
10.72 (0.422)
2.85 (0.112)
MAX.
0.89 (0.035)
0.69 (0.027)
0.31 (0.012)
0.23 (0.009)
0.88 (0.0345)
MIN.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3.81 (0.150)
MIN.
4.32 (0.170)
MAX.
9.40 (0.370)
9.91 (0.390)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3.81 (0.150)
MIN.
5.08 (0.200)
MAX.
9.40 (0.370)
9.91 (0.390)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
4.95 (0.195)
5.21 (0.205)
8.70 (0.342)
9.10 (0.358)
1.78 (0.070)
2.03 (0.080)
0.51 (0.020)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
METALLIZED
CASTILLATIONS (20 PLCS)
2.16 (0.085)
TERMINAL 1 IDENTIFIER
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
1.14 (0.045)
1.40 (0.055)
5
Hermetic Optocoupler Options
Option
Description
100
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for
lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
300
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details). This option has solder dipped leads.
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1.40 (0.055)
1.65 (0.065)
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.51 (0.020)
MIN.
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5 MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).