Document Outline
- List of Figures
- 1. HSDL-2100 Block Diagram and Application Circuit.
- 2.
- 3.
- 4.
- 5.
- 6.
- 1.0. Stencil and PCB.
- 2.0. Top View of Land Pattern.
- 3.0. PCBA Adjacent Land Keep-out and Solder Mask.
- 4.0. Solder Paste Stencil/Aperture.
- 5.0 Section of a castellation in Y-axis
- Features
- Applications
- Description
- Applications Information
- Optical SubAssembly
- I/O Pins Configuration Table
- Electrical SubAssembly
- Recommended Application Circuit Components
- Package Outline with Dimension and Recommended PCBoard Pad Layout
- Package Outline with Dimension and Recommended PCBoard Pad Layout
- Truth Table
- Absolute Maximum Ratings
- Recommended Operating Conditions
- Electrical and Optical Specifications
- Switching Specifications
- Reflow Profile
- The Temperature Profile for a Nominal Convective IR Reflow Solder Process
- Thermal Derating Curves
- Tape and Reel Dimensions
- Reel for 24 mm Tape
- Appendix A.
- Appendix B. SMT Assembly Methods
- 1.0 Solder Pad, Mask and Metal Solder Stencil Adapter
- 1.1. Recommended Land Pattern for HSDL-2100
- 1.2. Adjacent Land Keepout and Solder Mask Areas
- 2.0. Recommended Solder Paste/Cream Volume for Castellation Joints
- 2.1. Recommended Metal Solder Stencil Aperture
- 3.0. Pick and Place Misalignment Tolerance and Product Self-Alignment after Solder Reflow
- 3.1. Tolerance for X-axis Alignment of Castellation
- 3.2. Tolerance for Rotational (Theta) Misalignment
- 3.3. Y-axis Misalignment of Castellation
Infrared IrDA
Compliant Transceiver
Technical Data
HSDL-2100
Features
Small Module Package
height of 5.5 mm max.
Integrated EMI Shield
excellent Noise Immunity
Lower I
LEDA
Current
IEC825-Class 1 Eye Safe
Enhanced Reliability
Performance
Fully Compliant to IrDA 1.1
Specifications
excellent Nose-to-Nose
operation
2 Channels:
2.4 Kb/s to 115.2 Kb/s
576 Kb/s to 4.0 Mb/s
Designed to Accommodate
Light Loss with Cosmetic
Windows
Compatible with ASK,
HP-SIR and TV Remote
No Mode Programming
Required
Interfaces to Various Super
I/O and Controller Devices
Applications
Data Communication:
Notebook Computers,
Subnotebook Computers,
Desktop Computers,
Printers, PDAs, Fax/
Photocopier
Digital Imaging:
Digital Cameras, Photo
Imaging Printers
Digital Appliances:
Internet Web TVs,
Internet Appliances
Industrials and Medical
Instrumentation
General Data Collection
Devices
Patient and Pharmaceutical
Data Collection
IR LANs
Description
The HSDL-2100 is a new
generation low-cost Infrared (IR)
transceiver module that provides
the interface between logic and
IR signals for through-air, serial,
half-duplex IR data links and is
compliant to IrDA Physical Layer
Specification 1.1. This module
is also IEC825-Class 1 Eye Safe.
Package
This IR module provides two
output signals, RXD-A for signal
rates from 2.4 Kb/s to 115.2 Kb/s
and RXD-B for signal rates of
0.576 Mb/s to 4.0 Mb/s.
HSDL-2100 consists of the
following basic elements: an
Optical SubAssembly (OSA) and
an Electrical SubAssembly (ESA)
combination with an integrated
EMI shield.
I/O pins configuration table is
shown on page 2. HSDL-2100
block diagram and recommended
application circuit is illustrated in
Figure 1 on page 3. The IR
transceiver module package
outline and recommended
PCBoard Pad layout, (Option
#001 -- Integrated EMI shield
with guide pins) is illustrated
in Figure 2 on page 4.
Benefits
This combination of an integrated
EMI shield and transceiver sub-
assembly utilizes existing in-
house high-volume assembly
processes ensuring high quality
and high-volume supply. An
integrated EMI shield helps to
ensure low EMI emissions and
high immunity to EMI fields,
enhancing reliable performance.
2
A brief description of the 2 basic
sub-assemblies, Optical
S
ubAssembly (OSA) and
E
lectrical SubAssembly (ESA), is
on page 2.
Applications Information
The Applications Engineering
group, in the Hewlett-Packard
Communications Semiconductor
Solutions Division, is available
to assist you with the technical
understanding associated with
this IR transceiver module. You
can contact them through your
local Hewlett-Packard sales
representative for additional
details.
Optical SubAssembly
The Optical SubAssemblies (OSA)
includes a Transmitter and a
Receiver. The transmitter has
a discrete emitter that utilizes
a high speed, high efficiency,
Transparent Substrate, double
heterojunction, Aluminum
Gallium Arsenide (TS AlGaAs)
LED technology with an integral
lens in a clear molded package.
The transmitter lens is optimized
for speed, efficiency, and
distance at an emission wavelength
of 870 nm.
The receiver utilizes a discrete
silicon PIN photodiode with an
integral lens in a molded package
and contains a dye to absorb
visible light. The receiver lens
magnifies the effective area of the
PIN diode to enhance sensitivity.
The power supply for the PIN
and preamplifier are filtered to
attenuate noise from external
sources.
Electrical SubAssembly
The Electrical SubAssembly
(ESA) consists of a printed circuit
board on which a bipolar silicon
Integrated Circuit (IC) and
various surface-mount passive
circuit elements are attached. The
IC contains an LED driver and a
receiver providing two output
signals, RXD-A and RXD-B.
I/O Pins Configuration Table
Pin
Description
Symbol
1
LED Anode
LEDA
2
Transmitter Data Input
TXD
3
Receiver Data Output Channel B
RXD-B
4
Receiver Data Output Channel A
RXD-A
5
Threshold Capacitor
CX3
6
Ground
GND
7
Supply Voltage
V
CC
8
Averaging Capacitor
CX4
9
Ground (Analog)
GND
10
PIN Bypass Cap
CX1
3
Recommended Application Circuit Components
Component
Recommended Value
R1
560
,
5%, 0.125 Watt
R2
4.7
,
5%, 0.5 Watt
R3
[1]
10
,
5%, 0.125 Watt
CX1
[2]
0.47
F,
10%, X7R Ceramic
CX2
220 pF,
10%, X7R Ceramic
CX3
[4]
4700 pF,
10%, X7R Ceramic
CX4
0.010
F,
10%, X7R Ceramic
CX5
[2]
0.47
F,
20%, X7R Ceramic
5 mm lead length
CX6
6.8
F Tantalum. Larger value recommended for noisy supplies or environments.
CX7
[3]
0.47
F,
20%, X7R Ceramic.
Notes:
1. In environments with noisy power supplies, supply rejection can be enhanced by including R3 as shown in application circuit.
2. CX1 and CX5 must be placed within 0.7 cm of the HSDL-2100 to obtain optimum noise immunity.
3. Only necessary in applications where transmitter switching causes more than a 50 mV ripple on V
CC
.
4. CX3 may be replaced with 1000 pF for MIR, FIR application performance. For FIR application used 4700 pF as shown in application
circuit.
Figure 1. HSDL-2100 Block Diagram and Application Circuit.
CX5
VCC
EI
TXD
R1
LEDA
1
R2
VCC
CX2
2
PIN
BIAS
RXD-A
4
7
9
10
CX1
CX6
RXD-B
3
CX4
CX3
CX4
CX3
6
GND
8
5
IE
HSDL-2100
VREF
ADAPTIVE
THRESHOLD
& SQUELCH
R3
CX7
CX1
GND
VCC
TXD
4
Figure 2.
Package Outline with Dimension and Recommended PCBoard Pad Layout
(Option #001 -- Integrated EMI shield with Guide Pins.)
7.5 0.20
8.8 0.20
1.00
1.05
13.00 0.20
2.80 0.30
9.60 0.30
1.143 BSC
TYP. 0.55
TYP. R 0.15
5.50
0.15
0.80 0.15
3.20 0.30
5.30 0.20
0.80 0.20
1.00
+ 0.15
0
1.50 0.30
0.51 0.15
1.25
(10X) 0.70
0.97 0.10
2.40
B
2.92
1.143
BSC
5.05
(10X) 2.60
1.05 0.10
1.31 0.10
2.31 0.10
SHIELD
SOLDER PAD
SHIELD GROUND PIN
1
10
NOTES:
1. RECOMMENDED SOLDER STENCIL TO BE 5 TO 6 MILS THICK.
2. LETTER 'A' INDICATES LOCATION OF THROUGH HOLE FOR SHIELD GUIDE PIN.
2. LETTER 'B' INDICATES LOCATION OF SHIELD SOLDERED GROUNDING PAD.
3 3
GUIDE PINS
A
11.86 0.10
5.84
A
R 0.40
4.30
0.59
6.30 0.10
PIN
1
5
Figure 3.
Package Outline with Dimension and Recommended PCBoard Pad Layout
(Option #002 -- Integrated EMI shield without Guide Pins.)
7.5 0.20
8.8 0.20
1.00
1.05
13.00 0.20
2.80 0.30
9.60 0.30
1.143 BSC
TYP. 0.55
TYP. R 0.15
5.50
0.15
0.80 0.15
3.20 0.30
5.30 0.20
0.80 0.20
1.00
+ 0.15
0
1.50 0.30
0.51 0.15
1.25
(10X) 0.70
0.97 0.10
2.40
A
2.92
1.143
BSC
5.05
(10X) 2.60
PIN
1
1.05 0.10
1.31 0.10
2.31 0.10
SHIELD SOLDER PAD
SHIELD GROUND PIN
1
10
NOTES:
1. RECOMMENDED SOLDER STENCIL TO BE 5 TO 6 MILS THICK.
2. LETTER 'A' INDICATES LOCATION OF SHIELD SOLDERED GROUNDING PAD.
3 3
1
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