Agilent HSDL-3203
Small Profile Package
IrDA
Data Compliant Low Power
115.2 kbit/s Infrared Transceiver
Data Sheet
Features
Fully compliant to IrDA 1.4 low
power specification from
9.6 kbit/s to 115.2 kbit/s
Low power operation at extended
link distance of 50 cm
Miniature package
-- Height: 1.95 mm
-- Width: 8.00 mm
-- Depth: 3.10 mm
Guaranteed temperature
performance, 20 to +70C
-- Critical parameters are
guaranteed over temperature
and supply voltage
Low power consumption
-- Low shutdown current
(10 nA typical)
-- Complete shutdown of TXD,
RXD, and PIN diode
Withstands > 100 mV
p-p
power
supply ripple typically
V
CC
supply 2.7 to 3.6 volts
Integrated EMI shield
LED stuck-high protection
Designed to accommodate light
loss with cosmetic windows
IEC 825-Class 1 Eye Safe
Lead-free and RoHS Compliant
Description
The HSDL-3203 is a miniature low
cost infrared transceiver module
that provides the interface between
logic and infrared (IR) signals for
through air, serial, half-duplex IR
data link. The module is compliant
to IrDA Physical Layer Specifica-
tions version 1.4 Low Power from
9.6 kbit/s to 115.2 kbit/s with
extended link distance and it is
IEC 825-Class 1 eye safe.
The HSDL-3203 can be shutdown
completely to achieve very low
power consumption. In the shut-
down mode, the PIN diode will be
inactive and thus producing very
little photocurrent even under very
bright ambient light. Such features
are ideal for battery operated
handheld products.
Applications
Mobile telecom
-- Mobile phones
-- Pagers
-- Smart phone
Data communication
-- PDAs
-- Portable printers
Digital imaging
-- Digital cameras
-- Photo-imaging printers
Electronic wallet, IrFM
2
Figure 1. Functional block diagram of HSDL-3203.
Application Support Information
The Application Engineering
group in Agilent Technologies is
available to assist you with the
technical understanding associ-
ated with HSDL-3203 infrared
transceiver module. You can con-
tact them through your local
Agilent sales representative for
additional details.
Figure 2. Rear view diagram with pin-out.
8
7
6
5
4
3
2
1
Ordering Information
Part Number
Packaging Type
Package
Quantity
HSDL-3203-021
Tape and Reel
Front View
2500
7
LED
DRIVER
6
5
RX PULSE
SHAPER
8
4
3
2
1
C2
100 nF
SHIELD
C1
6.8 F
TXD
LED A
GND
CX
RXD
VCC
SD
AGND
VCC
VCC
VCC
R1
3
I/O Pin Configuration Table
Pin
Symbol
I/O
Description
Note
1
CX
I
Pin bypass capacitor
2
SD
I
Shutdown. Active high
1
3
AGND
I
Analog ground
2
4
GND
I
Ground
2
5
RXD
O
Receiver data output. Active low
3
6
V
CC
I
Supply voltage
4
7
TXD
I
Transmitter data input. Active high
5
8
LED A
I
LED anode
6
Shield
EMI shield
7
Notes:
1. Complete shutdown TXD, RXD, and PIN diode.
2. Connect to system ground.
3. Output is active low pulse response when light pulse is seen.
4. Regulated, 2.7 to 3.6 volt.
5. Logic high turns on the LED. If held high longer than
50
s, the LED is turned off
automatically. TXD must be driven either high or low. DO NOT leave the pin floating.
6. Tied through external resistor, R1, to regulate V
CC
from 2.7 to 3.6 volt.
7. Connect to system ground via a low inductance trace. For best performance, do not connect
to GND directly at the part.
Recommended Application Circuit Components
Component
Recommended Value
Note
R1
30
,
1%, 0.125 Watt
8
R1
5.6
,
1%, 0.125 Watt
9
C1
6.8
F,
20%, Tantalum
10
C2
100 nF,
20%, X7R Ceramic
Notes:
8. To obtain I
LED
of 50 mA for V
LED
of 3 V.
9. To obtain I
LED
of 250 mA for V
LED
of 3 V.
10. C1 must be placed within 0.7 cm of the HSDL-3203 to obtain optimum noise immunity.
Marking Information
The unit is marked with the
letters "A" and the datacode
"YWW" on the shield for front
options where Y is the last digit
of the year, and WW is the
workweek.
Transceiver I/O Truth Table
Inputs
Outputs
TXD
Light Input to Receiver
SD
LED
RXD
Note
High
Don't Care
Low
On
Not Valid
Low
High
Low
Off
Low
11, 12
Low
Low
Low
Off
High
Don't Care
Don't Care
High
Off
High
Notes:
11. In-band IrDA signals and data rates
115.2 kbit/s.
12. RXD logic low is a pulsed response. The condition is maintained for a duration independent of pattern and strength of the incident intensity.
Caution: The BiCMOS inherent to the design of this component increases the component's susceptibility
to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in
handling and assembly of this component to prevent damage and/or degradation, which may be
induced by ESD.
4
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Conditions
Note
Operating Temperature
T
A
25
85
C
Supply Voltage
V
CC
2.7
3.6
V
Logic High Voltage TXD, SD
V
IH
2/3 V
CC
V
CC
V
Logic Low Voltage TXD, SD
V
IL
0
1/3 V
CC
V
Logic High Receiver Input Irradiance
EI
H
0.0081
500
mW/cm
2
For in-band signals
13
Logic Low Receiver Input Irradiance
EI
L
0.3
W/cm
2
For in-band signals
13
LED Current Pulse Amplitude
I
LEDA
50
250
mA
Guaranteed at 25C
Receiver Signal Rate
9.6
115.2
kbit/s
Note:
13. An in-band optical signal is a pulse/sequence where the peak wavelength,
p, is defined as 850 nm
p
900 nm, and the pulse characteristics
are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
Absolute Maximum Ratings
For implementation where case to ambient thermal resistance is
50C/W.
Parameter
Symbol
Min.
Max.
Units
Conditions
Storage Temperature
T
S
40
100
C
Operating Temperature
T
A
25
85
C
DC LED Current
I
LED
(DC)
20
mA
Peak LED Current
I
LED
(PK)
250
mA
90
s Pulse Width
25% Duty Cycle
LED Anode Voltage
V
LEDA
0.5
7
V
Supply Voltage
V
CC
0
7
V
Input Voltage TXD, SD
V
I
0
V
CC
+ 0.5
V
Output Voltage RXD
V
O
0.5
V
CC
+ 0.5
V
5
Electrical and Optical Specifications
Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions
can be anywhere in their operating range. All typical values are at 25C and 3.0 V unless otherwise noted.
Parameter
Symbol Min.
Typ.
Max. Units
Conditions
Note
Receiver
RXD Output Voltage
Logic Low
V
OL
0
0.4
V
I
OL
= 200
A, for in-band EI
14
Logic High V
OH
V
CC
V
CC
V
I
OH
= 200
A, for in-band
0.2
EI
0.3
W/cm
2
Viewing Angle
2
1/2
30
Logic High Receiver Input
EI
H
0.0081
500
mW/cm
2
For in-band signals
115.2 kbit/s
13
Irradiance
Logic Low Receiver Input
EI
L
0.3
W/cm
2
For in-band signals
13
Irradiance
Peak Sensitivity Wavelength
p
880
nm
RXD Pulse Width
tpw
1.5
2.5
4.0
s
14
RXD Rise and Fall Times
t
r
, t
f
25
100
ns
tpw(EI) = 1.6
s, C
L
= 10 pF
Receiver Latency Time
t
L
25
50
s
14
Receiver Wake Up Time
t
W
50
100
s
15
Transmitter
Radiant Intensity
EI
H
4
8
28.8
mW/sr
I
LEDA
= 50 mA, T
A
= 25C,
1/2
15
22.5
mW/sr
I
LEDA
= 250 mA, T
A
= 25C,
1/2
15
Peak Wavelength
p
875
nm
Spectral Line Half Width
1/2
35
nm
Viewing Angle
2
1/2
30
60
Optical Pulse Width
tpw
1.5
1.6
2
s
tpw(TXD) = 1.6
s
Optical Rise and Fall Times
tr (EI)
600
ns
tpw(TXD) = 1.6
s
tf (EI)
Maximum Optical Pulse Width
tpw
20
50
s
TXD pin stuck high
(max)
LED Anode ON State Voltage
V
ON
1.5
V
I
LEDA
= 50 mA,
(LEDA)
V
IH
(TXD) = 2.7 V
LED Anode OFF State Leakage
I
LK
0.01
1.0
A
V
LEDA
= V
CC
= 3.6 V,
(LEDA)
V
I
(TXD)
1/3 V
CC
Transceiver
TXD and SD Input
Logic Low
I
L
1
0.01 1
A
0
V
I
1/3 V
CC
Logic High I
H
0.01
1
A
V
I
2/3 V
CC
Supply Current
Shutdown
I
CCI
10
200
nA
V
CC
= 3.6 V, V
SD
V
CC
0.5
Idle
I
CC2
2.5
4
mA
V
CC
= 3.6 V, V
I
(TXD)
1/3 V
CC
,
EI = 0
Active
I
CC3
2.6
5
mA
V
CC
= 3.6 V, V
I
(TXD)
1/3 V
CC
16
Receiver
Notes:
14. For in-band signals
115.2 kbit/s where 8.1
W/cm
2
EI
500 mW/cm
2
.
15. Wake up time is measured from SD pin HIGH to LOW transition or V
CC
power ON to valid RXD output.
16. Typical value is at EI = 10 mW/cm
2
, maximum value is at EI = 500 mW/cm
2
.
Currents
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