Surface Mount Chip LEDs
Technical Data
HSMF-C155/C156/C157
Features
Small Size
Industry Standard Footprint
Compatible with IR Solder
Diffused Optics
Operating Temperature
Range of 30
C to +85
C
Three Color Combinations
Available: Red/Green,
Yellow/Green, and
Orange/Green.
Available in 8 mm Tape on
7 in. (178 mm) Diameter
Reels
Applications
Push-Button Backlighting
Symbol Backlighting
Status Indicator
Front Panel Indicator
Description
The HSMF-C15x series of bicolor
chip-type LEDs is designed in
an industry standard package for
ease of handling and use. These
bicolor LEDs are available as
high efficiency red/green, yellow/
green and orange/green. The
HSMF-C15x has the widely used
3.2 x 2.7 mm footprint and wide
viewing angle make this LED
exceptional for backlighting
applications.
All packages are compatible with
IR reflow solder processes. The
small size and wide viewing angle
make these LEDs prime choices
for backlighting applications and
front panel indicators especially
where space is a premium.
Device Selection Guide
Part Number
Color Combinations
Parts Per Reel
HSMF-C155
High Efficiency Red/Green
3000
HSMF-C156
Yellow/Green
3000
HSMF-C157
Orange/Green
3000
2
3.2 (0.126 )
0.50 (0.020)
0.55
(0.022)
0.60
(0.024)
CATHODE
MARK
1.10 (0.043)
0.55
(0.022)
2.00
(0.079)
1.4
(0.055)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
2.7
(0.106)
1.10 (0.043)
R 0.25
(0.010)
TYP.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
1
3
2
4
0.40
(0.016)
4 0.05 (0.002) MAX.
CATHODE LINE
Package Dimensions
HSMF-C155/C156/C157
POLARITY
PART NUMBER
HSMF-C-155
HSMF-C-156
HSMF-C-157
GREEN
GREEN
GREEN
RED
YELLOW
ORANGE
POSITION OF COLOR SOURCE ON DEVICE
1
2
3
4
3
Optical Characteristics at T
A
=25
C
Luminous
Peak
Dominant
Intensity
[1]
Wavelength
Wavelength
Viewing Angle
Color
Iv(mcd) @ 20mA
peak
(nm)
d
(nm)
2
1/2
Degrees
[2]
Min.
Typ.
Typ.
Typ.
Typ.
HER
2.50
10.0
630
626
170
Orange
2.50
8.0
605
604
170
Yellow
2.50
8.0
589
586
170
Green
4.00
15.0
570
572
170
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical
axis of the lamp package.
2.
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Absolute Maximum Ratings at T
A
=25
C
Parameter
HSMF-C155/C156/C157
Units
DC Forward Current
[1]
25
mA
Peak Pulsing Current
[2]
100
mA
Power Dissipation
65
mW
Reverse Voltage (I
R
= 100
A)
5
V
LED Junction Temperature
95
C
Operating Temperature Range
30 to +85
C
Storage Temperature Range
40 to +85
C
Soldering Temperature
See IR soldering profile (Figure 6)
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25
C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
Electrical Characteristics at T
A
=25
C
Forward Voltage
Reverse
Capacitance
Thermal
V
F
(V)
Breakdown V
R
(V)
C(pF)
Resistance
Color
@ I
F
= 20 mA
@ I
R
= 100
A
@ V
F
= 0, f = 1Mhz
R
J-P
(
C/W)
Typ.
Max.
Min.
Typ.
Typ.
HER
2.1
2.6
5
5
325
Orange
2.2
2.6
5
7
325
Yellow
2.1
2.6
5
6
325
Green
2.2
2.6
5
9
325
Note:
The bicolor package contains two individual light sources of different color. The specifications above refer to each color of a
particular package.
4
Figure 1. Relative Intensity vs. Wavelength.
WAVELENGTH nm
HER
GREEN
RELATIVE INTENSITY
1.0
0.5
0
500
550
600
650
700
750
YELLOW
ORANGE
Green Color Bins
[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
561.5
564.5
B
564.5
567.5
C
567.5
570.5
D
570.5
573.5
E
573.5
576.5
Color Bin Limits
Orange Color Bins
[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
597.0
600.0
B
600.0
603.0
C
603.0
606.0
D
606.0
609.0
E
609.0
612.0
F
612.0
615.0
Yellow/Amber Color Bins
[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
582.0
584.5
B
584.5
587.0
C
587.0
589.5
D
589.5
592.0
H
592.0
594.5
J
594.5
597.0
Light Intensity (Iv) Bin Limits
[1]
Intensity (mcd)
Intensity (mcd)
Bin ID
Min.
Max.
Bin ID
Min.
Max.
A
0.11
0.18
N
28.50
45.00
B
0.18
0.29
P
45.00
71.50
C
0.29
0.45
Q
71.50
112.50
D
0.45
0.72
R
112.50
180.00
E
0.72
1.10
S
180.00
285.00
F
1.10
1.80
T
285.00
450.00
G
1.80
2.80
U
450.00
715.00
H
2.80
4.50
V
715.00
1125.00
J
4.50
7.20
W
1125.00
1800.00
K
7.20
11.20
X
1800.00
2850.00
L
11.20
18.00
Y
2850.00
4500.00
M
18.00
28.50
Note:
1. Bin categories are established for
classification of products. Products
may not be available in all categories.
Please contact your Agilent representa-
tive for information on currently
available bins.
Tolerance:
0.5 nm
Tolerance:
1 nm
Tolerance:
0.5 nm
Tolerance:
15%
5
Figure 2. Forward Current vs.
Forward Voltage.
Note: 1. All dimensions in millimeters (inches).
Figure 3. Luminous Intensity vs. Forward
Current (All Colors).
Figure 4. Maximum Forward Current
vs. Ambient Temperature.
Figure 5. Relative Intensity vs. Angle for
HSMx-C155, C156 and C157.
Figure 6. Recommended Pb Free Reflow Soldering Profile.
Figure 7. Recommended Solder Pad Pattern.
RELATIVE INTENSITY %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70
-50
-30
0
20 30
50
70
90
-90
-20
-80
-60
-40
-10
10
40
60
80
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
1.0 (0.039)
0.4 (0.016)
0
10
20
40
IF FORWARD CURRENT mA
0
0.4
1.2
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
30
0.8
100
10
1
0.1
1.5
1.7
1.9
2.1
2.3
VF FORWARD VOLTAGE V
I F
FORWARD CURRENT mA
GREEN
HER
ORANGE
YELLOW
0
35
0
20
60
80
100
5
I F MAX.
MAXIMUM FORWARD CURRENT mA
TA AMBIENT TEMPERATURE C
40
15
25
30
10
20
R
J-A = 600C/W
R
J-A = 800C/W
217 C
MAX. 120 SEC.
6 C/SEC. MAX.
3 C/SEC. MAX.
140 - 160 C
255 C (+5/-0)
60 to 150 SEC.
* THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX.
10 to 20 SEC.
TIME
TEMPERATURE
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