1-199
H
Surface Mount High
Performance AlInGaP LED
Indicators
Technical Data
Features
Outstanding LED Material
Efficiency
Exceptional Light Output
Over a Wide Range of Drive
Currents
Colors: 590 nm Amber, 603
nm Orange, and 615 nm
Reddish-Orange
Compatible with Automatic
Placement Equipment
Compatible with Convective
IR, Vapor Phase Reflow, and
TTW Solder Processes
Packaged in 12 mm or 8 mm
Tape on 7" or 13" Diameter
Reels
EIA Standard Package
Low Package Profile
Non-diffused Package
Excellent for Backlighting
and Coupling to Light Pipes
Description
The LED material used in these
devices is the very efficient
absorbing Substrate aluminum
indium gallium phosphide (AS
AlInGaP), capable of producing
high light output over a wide
range of drive currents.
These solid state surface mount
indicators are designed with a flat
top and sides to be easily handled
by automatic placement equip-
ment. A glue pad is provided for
adhesive mounting processes.
They are compatible with
convective IR and vapor phase
reflow soldering, through the
wave (TTW) soldering, and
conductive epoxy attachment
processes.
The package size and configura-
tion conform to the EIA-535
Device Selection Guide
Amber
Orange
Reddish-Orange
d
= 590 nm
d
= 603 nm
d
= 615 nm
Description
HSMA-T425
HSMD-T425
HSMJ-T425
12 mm Tape, 7" Reel, 2000 Devices
HSMA-T525
HSMD-T525
HSMJ-T525
12 mm Tape, 13" Reel, 8000 Devices
HSMA-T625
HSMD-T625
HSMJ-T625
8 mm Tape, 7" Reel, 2000 Devices
HSMA-T725
HSMD-T725
HSMJ-T725
8 mm Tape, 13" Reel, 8000 Devices
SunPower Series
HSMA-TX25
HSMD-TX25
HSMJ-TX25
BAAC standard specification for
case size 3528 tantalum
capacitors. The folded leads
permit dense placement and
provide an external solder joint
for ease of inspection.
These devices are non-diffused,
providing high intensity for
applications such as backlighting,
light pipe illumination, and front
panel indication.
5964-9352E
1-200
Package Dimensions
Tape and Reel
Specifications
Hewlett Packard surface mount
LEDs are packaged tape and reel
in accordance with EIA-481A,
Taping of Surface Mount
Components for Automatic
Placement
. This packaging
system is compatible with tape-
fed automatic pick and place
systems. Each reel is sealed in a
vapor barrier bag for added
protection. Bulk packaging in
vapor barrier bags is available
upon special request.
hp
HEWLETT
PACKARD
CATHODE
PITCH: 4 mm (0.157 IN.)
USER FEED
DIRECTION
CARRIER TAPE WIDTH:
12 mm (0.472 IN.) OR 8 mm (0.315 IN.)
REEL DIAMETER:
178 mm (7 IN.) OR 330 mm (13 IN.)
NOM.
2.2
(0.087)
3.5
0.2
(0.138
0.008)
NOM.
3.1
(0.122)
NOM.
2.7
(0.106)
2.8
0.2
(0.110
0.008)
2.2
0.1
(0.087
0.004)
MIN.
0.7
(0.028)
1.9
0.2
(0.075
0.008)
0.8
0.3
(0.031
0.012)
(2 PLACES)
1.3
(0.050)
MIN.
0.1
(0.004)
NOM.
CATHODE NOTCH
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING.
1-201
Absolute Maximum Ratings at T
A
= 25
C
DC Forward Current
[1,4,5]
............................................................ 50 mA
Peak Forward Current
[2]
........................................................... 200 mA
Average Forward Current ........................................................... 45 mA
(at I
PEAK
= 200 mA, f
1 KHz)
[2]
Transient Forward Current (10
s Pulse)
[3]
.............................. 500 mA
Reverse Voltage (I
R
= 100
A) ......................................................... 5 V
LED Junction Temperature ............................................................ 95
C
Operating Temperature Range ....................................... -40
C to +85
C
Storage Temperature Range .......................................... -40
C to +85
C
Reflow Soldering Temperatures
Convective IR ...................... 235
C Peak, above 183
C for 90 seconds
Vapor Phase ........................................................ 215
C for 3 minutes
Notes:
1. Derate linerally as shown in Figure 4.
2. Refer to Figure 5 to establish pulsed operating conditions.
3. The transient peak current is the maximum non-recurring peak current the device can
withstand without damaging the LED die and wire bonds.
4. Drive currents between 5 mA and 30 mA are recommended for best long term
performance.
5. Operation at currents below 5 mA is not recommended, please contact your Hewlett-
Packard sales representative.
Electrical Characteristics at T
A
= 25
C
Speed of
Forward
Reverse
Capacitance
Response
Voltage
Breakdown
C (pF)
s
(ns)
V
F
(Volts)
V
R
(Volts)
V
F
= 0,
Thermal
Time Constant
Part
@ I
F
= 10 mA
@ I
R
= 100
A
f = 1 MHz
Resistance
e
-t/
Number
Typ.
Max.
Min.
Typ.
Typ.
R
J-PIN
(
C/W)
Typ.
HSMA-TX25
1.9
2.4
5
25
40
180
13
HSMD-TX25
1.9
2.4
5
25
40
180
13
HSMJ-TX25
1.9
2.4
5
25
40
180
13
s
Optical Characteristics at T
A
= 25
C
Luminous
Color,
Viewing
Intensity
Peak
Dominant
Angle
Luminous
I
V
(mcd)
Wavelength
Wavelength
2
1/2
Efficacy
Part
@ 10 mA
PEAK
(nm)
d
[1]
(nm)
Degrees
[2]
v
Number
Min.
Typ.
Typ.
Typ.
Typ.
(lm/w)
HSMA-TX25
10
25
592
590
120
480
HSMD-TX25
10
25
607
603
120
370
HSMJ-TX25
10
25
621
615
120
263
Notes:
1. The dominant wavelength,
d
, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2.
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1-202
Figure 6. Relative Intensity vs.
Angular Displacement.
NORMALIZED INTENSITY
1.0
0
ANGULAR DISPLACEMENT DEGREES
0.8
0.6
0.5
0.7
0.2
100 90
0.1
0.3
0.4
80
70
60
50
40
20
10
0
30
10
20
30
40
50
60
70
80
90 100
0.9
I F
FORWARD CURRENT mA
1.0
0
VF FORWARD VOLTAGE V
2.5
200
120
80
1.5
2.0
160
3.0
40
20
60
100
140
180
WAVELENGTH nm
RELATIVE INTENSITY
550
594 600
650
700
1.0
0.5
0
ORANGE
AMBER
607
621
REDDISH
ORANGE
Figure 1. Relative Intensity vs. Wavelength.
Figure 2. Forward Current vs.
Forward Voltage.
Figure 3. Relative Luminous Intensity
vs. Forward Current.
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0
I
F
DC FORWARD CURRENT mA
20
40
5.0
4.0
3.0
2.0
1.0
10
30
50
I
F
FORWARD CURRENT mA
0
0
T
A
AMBIENT TEMPERATURE C
40
80
50
40
30
20
10
20
60
100
R
J-A
= 439 C/W
R
J-A
= 244 C/W
5
15
25
35
45
10
30
50
70
90
55
110
Figure 4. Maximum Forward Current
vs. Ambient Temperature. Derating
Based on T
J
Max = 95
C.
Figure 5. Maximum Average Current
vs. Peak Forward Current.
I
AVG
AVERAGE CURRENT mA
50
0
I
PEAK
PEAK FORWARD CURRENT mA
150
50
40
30
20
10
100
200
f > 300 Hz
f > 100 Hz
60
f > 1 KHz
1-203
4.45
(0.175)
1.65
(0.065)
2.41
(0.095)
INFRARED/VAPOR PHASE
REFLOW SOLDERING
COMPONENT LOCATION
ON PAD
COMPONENT LOCATION
ON PAD
4.45
(0.175)
1.65
(0.065)
2.41
(0.095)
CONDUCTIVE ATTACHMENT
0.64 (0.025) SQ.
CENTERED HOLE
NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
Convective IR Reflow
Soldering
For information on convective IR
reflow soldering, refer to the
Supplement to Application Note
1060, Surface Mounting SMT
LED Components.
Recommended Printed Circuit Board Attachment Pad Geometries
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