90 V/1.0
, Hermetically Sealed,
Power MOSFET Optocoupler
Technical Data
Features
Dual Marked with Device
Part Number and DSCC
Standard Microcircuit
Drawing
ac/dc Signal & Power
Switching
Compact Solid-State
Bidirectional Switch
Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
QML-38534
MIL-PRF-38534 Class H
Space Level Processing
Available
Hermetically Sealed 8-Pin
Dual In-Line Package
Small Size and Weight
Performance Guaranteed
over -55
C to +125
C
Connection A
0.8 A, 1.0
Connection B
1.6 A, 0.25
1500 Vdc Withstand Test
Voltage
High Transient Immunity
5 Amp Output Surge Current
Applications
Military and Space
High Reliability Systems
Standard 28 Vdc and 48 Vdc
Load Driver
Standard 24 Vac Load Driver
Aircraft Controls
ac/dc Electromechanical and
Solid State Relay
Replacement
I/O Modules
Harsh Industrial
Environments
eight-pin, hermetic, dual-in-line,
ceramic packages. The devices
operate exactly like a solid-state
relay. The products are capable of
operation and storage over the
full military temperature range
and can be purchased as a
standard product (HSSR-7110),
with full MIL-PRF-38534 Class H
testing (HSSR-7111), or from the
DSCC Standard Microcircuit
Drawing (SMD) 5962-93140.
These devices may be purchased
with a variety of lead bend and
plating options. See Selection
Guide Table for details. Standard
Microcircuit (SMD) parts are
available for each lead style.
Description
The HSSR-7110, HSSR-7111 and
SMD 5962-9314001 are single
channel power MOSFET
optocouplers, constructed in
Functional Diagrams
TRUTH TABLE
INPUT
OUTPUT
H
CLOSED
L
OPEN
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
HSSR-711X*
5962-9314001
*See matrix for available extensions
CONNECTION A
AC/DC CONNECTION
2
3
4
1
6
7
5
8
NC
NC
+
+
CONNECTION B
DC CONNECTION
IF
VF
IO
VO
2
3
4
1
6
7
5
8
NC
NC
+
+
IF
VF
IO
VO
2
All devices are manufactured and
tested on a MIL-PRF-38534 certi-
fied line and are included in the
DSCC Qualified Manufacturers
List, QML-38534 for Hybrid
Microcircuits. Each device
contains an AlGaAs light emitting
diode optically coupled to a
photovoltaic diode stack which
drives two discrete power
MOSFETs. The device operates
as a solid-state replacement for
single-pole, normally open,
(1 Form A) relays used for
general purpose switching of
signals and loads in high
reliability applications.
The devices feature logic level
input control and very low output
on-resistance, making them
suitable for both ac and dc loads.
Connection A, as shown in the
Functional Diagram, allows the
device to switch either ac or dc
loads. Connection B, with the
polarity and pin configuration as
shown, allows the device to
switch dc loads only. The
advantage of Connection B is that
the on-resistance is significantly
reduced, and the output current
capability increases by a factor of
two.
The devices are convenient
replacements for mechanical and
solid state relays where high
component reliability with
standard footprint lead configu-
ration is desirable. Devices may
be purchased with a variety of
lead bend and plating options.
See Selection Guide table for
details. Standard Microcircuit
Drawing (SMD) parts are
available for each package and
lead style.
The HSSR-7110, HSSR-7111, and
SMD 5962-93140 are designed to
switch loads on 28 Vdc power
systems. They meet 80 V surge
and
600 V spike requirements.
Outline Drawing
8-pin DIP Through Hole
Selection GuidePackage Styles and Lead
Configuration Options
HP Part # and Options
Commercial
HSSR-7110
MIL-PRF-38534 Class H
HSSR-7111
Standard Lead Finish
Gold
Solder Dipped
Option #200
Butt Joint/Gold Plate
Option #100
Gull Wing/Soldered
Option #300
Crew Cut/Gold Plate
Option #600
SMD Part #
Prescript for all below
5962-
Either Gold or Soldered
9314001HPX
Gold Plate
9314001HPC
Solder Dipped
9314001HPA
Butt Joint/Gold Plate
9314001HYC
Butt Joint/Soldered
9314001HYA
Gull Wing/Soldered
9314001HXA
Crew Cut/Gold Plate
9314001HZC
Crew Cut/Soldered
9314001HZA
3.81 (0.150)
MIN.
4.32 (0.170)
MAX.
9.40 (0.370)
9.91 (0.390)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Input Current (on)
I
F(ON)
5
20
mA
Input Voltage (off)
V
F(OFF)
0
0.6
V
Operating Temperature
T
A
-55
+125
C
Device Marking
Absolute Maximum Ratings
Storage Temperature Range ........................................ -65
C to +150
C
Operating Ambient Temperature T
A
.......................... -55
C to +125
C
Junction Temperature T
J
......................................................... +150
C
Operating Case Temperature T
C
......................................... +145
C
[1]
Lead Solder Temperature ............................................... 260
C for 10 s
(1.6 mm below seating plane)
Average Input Current I
F
........................................................... 20 mA
Peak Repetitive Input Current I
FPK
............................................ 40 mA
(Pulse Width < 100 ms; duty cycle < 50%)
Peak Surge Input Current I
FPK
surge ....................................... 100 mA
(Pulse Width < 0.2 ms; duty cycle < 0.1%)
Reverse Input Voltage V
R
............................................................... 5 V
Average Output Current Figure 2
Connection A I
O
....................................................................... 0.8 A
Connection B I
O
...................................................................... 1.6 A
Single Shot Output Current Figure 3
Connection A I
OPK
surge (Pulse width < 10 ms) ...................... 5.0 A
Connection B I
OPK
surge (Pulse width < 10 ms) ................... 10.0 A
Output Voltage
Connection A V
O
...................................................... -90 V to +90 V
Connection B V
O
.......................................................... 0 V to +90 V
Average Output Power Dissipation Figure 4 ....................... 800 mW
[2]
Thermal Resistance
Maximum Output MOSFET Junction to Case
JC
= 15
C/W
ESD Classification
(MIL-STD-883, Method 3015) .......................................... (
), Class 2
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
50434
COUNTRY OF MFR.
HP FSCN*
HP LOGO
DSCC SMD*
PIN ONE/
ESD IDENT
HP P/N
DSCC SMD*
* QUALIFIED PARTS ONLY
4
Option
Description
Hermetic Optocoupler Options
100
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option
is available on commercial and hi-rel product.
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and
hi-rel product. DSCC Drawing part numbers contain provisions for lead finish.
300
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product. This option has solder dipped leads.
600
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option
is available on commercial and hi-rel product.
Note: Dimensions in millimeters (inches).
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MIN.
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5 MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
3.81 (0.150)
MAX.
1.02 (0.040)
TYP.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
5
Electrical Specifications
T
A
=-55
C to +125
C, unless otherwise specified. See note 9.
Group
A, Sub-
Parameter
Sym.
group
Test Conditions
Min.
Typ.* Max. Units
Fig.
Notes
Output Withstand
|V
O(OFF)
|
1, 2, 3
V
F
= 0.6 V, I
O
= 10
A
90
110
V
5
Voltage
Output
Connection
R
(ON)
1, 2, 3
I
F
= 10 mA, I
O
= 800 mA,
0.40
1.0
6,7
3
On-
A
(pulse duration
30 ms)
Resistance
Connection
I
F
= 10 mA, I
O
= 1.6 A,
0.12
0.25
B
(pulse duration
30 ms)
Output Leakage
I
O(OFF)
1, 2, 3
V
F
= 0.6 V, V
O
= 90 V,
10
-4
10
A
8
Current
Input Forward
V
F
1, 2, 3
I
F
= 10 mA
1.0
1.24
1.7
V
9
Voltage
Input Reverse
V
R
1, 2, 3
I
R
= 100
A
5.0
V
Breakdown Voltage
Input-Output
I
I-O
1
RH
45%, t = 5 s,
1.0
A
4, 5
Insulation
V
I-O
= 1500 Vdc,
T
A
= 25
C
Turn On Time
t
ON
9, 10, 11 I
F
= 10 mA, V
DD
= 28 V,
1.25
6.0
ms
1,10,
I
O
= 800 mA
11, 12,
13
Turn Off Time
t
OFF
9,10,11
I
F
= 10 mA,
0.02
0.25
ms
1,10,
V
DD
= 28 V, I
O
= 800 mA
14,15
Output Transient
dVo
9
V
PEAK
= 50 V,
1000
V/
s
17
Rejection
dt
C
M
= 1000 pF,
C
L
= 15 pF, R
M
1 M
Input-Output
dVio
9
V
DD
= 5 V,
500
V/
s
18
Transient Rejection
dt
V
IO(PEAK)
= 50 V,
R
L
= 20 k
, C
L
= 15 pF
*All typical values are at T
A
= 25
C, I
F(ON)
= 10 mA, V
F(OFF)
= 0.6 V unless otherwise specified.
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