Электронный компонент: HSSR-8060

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1-441

60 V/0.7 Ohm,
General Purpose, 1 Form A,
Solid State Relay

Technical Data

HSSR-8060

� Telecommunication

Switching Equipment

� Reed Relay Replacement

� 28 Vdc, 24 Vac, 48 Vdc Load

Driver

� Industrial Relay Coil Driver

Description

The HSSR-8060 consists of a
high-voltage circuit, optically
coupled with a light emitting
diode (LED). This device is a
solid-state replacement for single-
pole, normally-open (1 Form A)
electromechanical relays used for
general purpose switching of
signals and low-power loads. The
relay turns on (contact closes)
with a minimum input current, I

F

,

of 5 mA through the input LED.
The relay turns off (contact
opens) with an input voltage, V

F

,

of 0.8 V or less. The detector
contains a high speed photosensi-
tive FET driver circuit and two
high voltage MOSFETs.

This relay's logic level input con-
trol and very low typical output
on-resistance of 0.4

makes it

suitable for both ac and dc loads.
Connection A, as shown in the
schematic, allows the relay to

switch either ac or dc loads.
Connection B, with the polarity
and pin configuration as indicated
in the schematic, allows the relay
to switch dc loads only. The
advantage of Connection B is that
the on-resistance is significantly
reduced, and the output current
capability increases by a factor of
two.

The electrical and switching char-
acteristics of the HSSR-8060 are
specified from -40

�

C to +85

�

C.

Features

� Compact Solid-State

Bidirectional Switch

� Normally-Off Single-Pole

Relay Function (1 Form A)

� 60 V Output Withstand

Voltage in Both Polarities at
25

�

C

� 0.75/1.5 Amp Current

Ratings (See Schematic for
Connections A & B)

� Low Input Current; CMOS

Compatibility

� Very Low On-resistance:

0.4

Typical at 25

�

C

� ac/dc Signal and Power

Switching

� Input-to-Output Momentary

Withstand Insulation
Voltage: 2500 Vac, 1 Minute

� 16-kV ESD Immunity: MIL-

STD-883, Method 3015

� IEEE Surge Withstand

Capability (IEEE STD
472-1974)

� CSA Approved

� UL 508 Approved

Applications

� Programmable Logic

Controllers

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.

Functional Diagram

TRUTH TABLE

(POSITIVE LOGIC)

LED

ON

OFF

OUTPUT

L

H

H

5965-3575E

1-442

Selection Guide

Maximum

Maximum

Maximum

6-Pin DIP

4-Pin DIP

Maximum

ON

Output

Output

Hermetic

(300 Mil)

(300 Mil)

Speed

Resistance

Voltage

Current

Minimum

8-Pin

Single

Dual

t(ON)

R(ON)

VO(off)

Io(ON)

Input

Single

Channel

Channel

msec

V

mA

Current

Channel

Package

Package

25

�

C

25

�

C

25

�

C

25

�

C

mA

Packages

HSSR-8400

[1]

0.95

10

400

150

5

HSSR-8060

1.4

0.7

60

750

5

HSSR-8200

[1]

1.5

200

200

40

1

6

1

90

800

5

HSSR-7110

[1]

Note:
1. Technical data are on separate HP publication.

Ordering Information

Specify part number followed by Option Number (if desired).

HSSR-8060#XXX

300 = Gull Wing Surface Mount Lead Option

500 = Tape/Reel Package Option (1 k min.)

Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.

Schematic

IF

VF

1

2

+

�

6

SWITCH

DRIVER

5

4

1-443

Outline Drawing

6-pin DIP Package (HSSR-8060)

9.40 (0.370)
9.90 (0.390)

PIN

ONE

DOT

HP RXXXX

YYWW

TYPE
NUMBER

DATE CODE

2.16 (0.085)
2.54 (0.100)

2.28 (0.090)
2.80 (0.110)

0.51 (0.020) MIN.

0.45 (0.018)
0.65 (0.025)

4.70 (0.185) MAX.

2.92 (0.115) MIN.

6.10 (0.240)
6.60 (0.260)

0.20 (0.008)
0.33 (0.013)

5� TYP.

7.36 (0.290)
7.88 (0.310)

DIMENSIONS IN MILLIMETERS AND (INCHES).

5

6

3

2

1

1.78 (0.070) MAX.

4

1-444

240

T = 115�C, 0.3�C/SEC

0

T = 100�C, 1.5�C/SEC

T = 145�C, 1�C/SEC

TIME � MINUTES

TEMPERATURE � �C

220

200

180

160

140

120

100

80

60

40

20

0

260

1

2

3

4

5

6

7

8

9

10

11

12

6-Pin Device Outline Drawing Option #300 (Gull Wing Surface Mount)

Thermal Profile (Option #300)

Regulatory Information

The HSSR-8060 has been
approved by the following
organizations:

UL

Recognized under UL 508,
Component Recognition Program,
Industrial Control Switches, File
E142465.

CSA

Approved under CAN/CSA-C22.2
No. 14-95, Industrial Control
Equipment, File LR 87683.

Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)

4.19

(0.165)

2.29

(0.090)

2.54

(0.100)

TYP.

0.635 � 0.130

(0.025 � 0.005)

9.65 � 0.25

(0.380 � 0.010)

7.62 � 0.25

(0.300 � 0.010)

0.635 � 0.25

(0.025 � 0.010)

12� NOM.

0.20 (0.008)
0.30 (0.013)

1.78

(0.070)

MAX.

9.65 � 0.25

(0.380 � 0.010)

6.35 � 0.25

(0.250 � 0.010)

DIMENSIONS IN mm (INCHES)
TOLERANCES: xx.xx = 0.01
xx.xxx = 0.001
(unless otherwise specified)

LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)

[3] [5]

1.194 (0.047)
1.778 (0.070)

4.826

(0.190)

TYP.

9.398 (0.370)
9.906 (0.390)

MAX.

PAD LOCATION (FOR REFERENCE ONLY)

0.381 (0.015)
0.635 (0.025)

HP RXXXX

YYWW

TYPE NUMBER

DATE CODE

1-445

Insulation and Safety Related Specifications

Parameter

Symbol

Value

Units

Conditions

Min. External Air Gap

L(IO1)

7.0

mm

Measured from input terminals to output

(External Clearance)

terminals, shortest distance through air

Min. External Tracking Path

L(IO2)

8.5

mm

Measured from input terminals to output

(External Creepage)

terminals, shortest distance path along body

Min. Internal Plastic Gap

0.5

mm

Through insulation distance, conductor to

(Internal Clearance)

conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity

Tracking Resistance

CTI

200

V

DIN IEC 112/VDE 0303 PART 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 � surface mount classification is Class A in accordance with CECC 00802.

Absolute Maximum Ratings

Storage Temperature ................................................... -55

�

C to+125

�

C

Operating Temperature - T

A

.......................................... -40

�

C to +85

�

C

Case Temperature - T

C

.......................................................... +105

�

C

[1]

Average Input Current - I

F

............................................................ 20 mA

Repetitive Peak Input Current - I

F

............................................... 40 mA

(Pulse Width

1 ms; duty cycle

50%)

Transient Peak Input Current - I

F

............................................... 100 mA

(Pulse Width

200

�

s; duty cycle

1%)

Reverse Input Voltage - V

R

................................................................ 3 V

Input Power Dissipation .............................................................. 40 mW
Output Voltage (T

A

= 25

�

C)

Connection A - V

O

......................................................... - 60 to +60 V

Connection B - V

O

............................................................. 0 to +60 V

Average Output Current - Figure 3 (T

A

= 25

�

C, T

C

70

�

C)

Connection A - I

O

..................................................................... 0.75 A

Connection B - I

O

..................................................................... 1.50 A

Single Shot Peak Output Current

(100 ms pulse width, T

A

= 25

�

C, I

F

= 10 mA)

Connection A - I

O

.................................................................... 3.75 A

Connection B - I

O

...................................................................... 7.0 A

Output Power Dissipation ..................................................... 750 mW

[2]

Lead Solder Temperature .... 260

�

C for 10 S (1.6 mm below seating plane)

Infrared and Vapor Phase Reflow Temperature

(Option #300) ......................................... See Fig. 1, Thermal Profile

Thermal Resistance

Typical Output MOSFET Junction
to Case �

JC

= 55

�

C/W

Demonstrated ESD
Performance

Human Body Model: MIL-STD-

883 Method 3015.7 - 16 kV

Machine Model: EIAJ 1988.3.28

Version 2), Test Method 20,
Condition C � 1200 V

Surge Withstand
Capability

IEEE STD 472-1974

Document Outline

• Selector Guide
• List of Figures
  • 1. Maximum Solder Reflow Thermal Profile.
  • 2. Recommended Input Circuit.
  • 3A. Maximum Average Output Current Rating vs. Ambient Temperature.
  • 3B. Maximum Average Output Current Rating vs. Case Temperature.
  • 4. Output Power Derating vs. Case Temperature.
  • 5. Normalized Typical Output Withstand Voltage vs. Temperature.
  • 6. Normalized Typical Output Resistance vs. Temperature.
  • 7. Typical On State Output I-V Characteristics.
  • 8. Switching Test Circuit for t ON , t OFF .
  • 9. Typical Turn On Time vs. Temperature.
  • 10. Typical Turn On Time vs. Input Current.
  • 11. Typical Turn Off Time vs. Temperature.
  • 12. Typical Turn Off Time vs. Input Current.
  • 13. Typical Output Leakage vs. Temperature.
  • 14. Typical Output Capacitance vs. Output Voltage.
  • 15. Typical Input Forward Current vs. Input Forward Voltage.
  • 16. Output Transient Rejection Test Circuit.
  • 17. Input-Output Transient Rejection Test Circuit.
  • 18. Voltage Offset Test Setup.
  • 19. Thermal Model.
  • 20. Turn On Time Variation with High Temperature Operating Life.
  • 21. Turn On Time Variation with Temperature Cycling.
• Features
• Applications
• Description
• Functional Diagram
• Selection Guide
• Ordering Information
• Schematic
• Outline Drawing
• 6-Pin Device Outline Drawing Option #300 (Gull Wing Surface Mount)
• Thermal Profile (Option #300)
• Regulatory Information
• Insulation and Safety Related Specifications
• Absolute Maximum Ratings
• Thermal Resistance
• Demonstrated ESD Performance
• Surge Withstand Capability
• Recommended Operating Conditions
• DC Electrical Specifications
• Switching Specifications
• Package Characteristics
• Applications Information
  • Thermal Model
  • On-Resistance and Derating Curves
  • Turn On Time Variation