1-465
H
400 V/10 Ohm,
General Purpose, 1 Form A,
Solid State Relay
Technical Data
Features
Compact Solid-State
Bidirectional Switch
Normally-Off Single-Pole
Relay Function (1 Form-A)
400 V Output Withstand
Voltage in Both Polarities at
25
C
150/300 mA Current Ratings
(See Schematic for
Connection A & B)
Low Input Current; CMOS
Compatibility
Very Low On-Resistance: 6
Typical at 25
C
ac/dc Signal & Power
Switching
Input-to-Output Momentary
Withstand Insulation
Voltage: 2500 Vac, 1 Minute
16-kV ESD Immunity: MIL-
STD-883, Method 3015
CSA Approved
UL 508 Recognized
Applications
Modems
Telecommunication
Switching Equipment
Telecommunication Test
Instruments
Reed Relay Replacement
110/220 Vac Load Driver
Industrial Relay Coil Driver
Description
The HSSR-8400 consists of a
high-voltage circuit, optically
coupled with a Light-Emitting
Diode (LED). This device is a
solid-state replacement for single-
pole, normally-open (1 Form A)
electromechanical relays used for
general purpose switching of
signals and low-power ac/dc
loads. The relay turns on (contact
closes) with a minimum input
current, I
F
, of 5 mA through the
input LED. The relay turns off
(contact opens) with an input
voltage, V
F
, of 0.8 V or less. The
detector contains a high speed
photosensitive FET driver circuit
and two high voltage MOSFETs.
This relay's logic-level input con
trol and very low typical output
on-resistance of 6
make it
suitable for switching of audio
frequency signals in telecom
applications. Connection A, as
shown in the schematic, allows
the relay to switch either ac or dc
loads. In this configuration, the
150 mA output current rating
allows it to switch small loads
that are driven from 110 Vac and
220 Vac power lines. Connection
B, with the polarity and pin
configuration as indicated in the
schematic, allows the relay to
switch dc loads only. The
advantage of Connection B is that
the on-resistance is significantly
reduced and the output current
capability increases by a factor of
two.
The electrical and switching
characteristics of the HSSR-8400
are specified from -40
C to
+85
C.
HSSR-8400
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
Functional Diagram
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
OUTPUT
L
H
5965-3573E
1-468
Thermal Profile (Option #300)
6-Pin Device Outline Drawing Option #300 (Gull Wing Surface Mount)
240
T = 115C, 0.3C/SEC
0
T = 100C, 1.5C/SEC
T = 145C, 1C/SEC
TIME MINUTES
TEMPERATURE C
220
200
180
160
140
120
100
80
60
40
20
0
260
1
2
3
4
5
6
7
8
9
10
11
12
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
HSSR-8400 Outline Option 300
4.19
(0.165)
2.29
(0.090)
2.54
(0.100)
TYP.
0.635 0.130
(0.025 0.005)
9.65 0.25
(0.380 0.010)
7.62 0.25
(0.300 0.010)
0.635 0.25
(0.025 0.010)
12 NOM.
0.20 (0.008)
0.33 (0.013)
1.78
(0.070)
MAX.
9.65 0.25
(0.380 0.010)
6.35 0.25
(0.250 0.010)
DIMENSIONS IN mm (INCHES)
TOLERANCES: xx.xx = 0.01
xx.xxx = 0.001
(unless otherwise specified)
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
[3] [5]
1.194 (0.047)
1.778 (0.070)
4.826
(0.190)
TYP.
9.398 (0.370)
9.906 (0.390)
MAX.
PAD LOCATION (FOR REFERENCE ONLY)
0.381 (0.015)
0.635 (0.025)
HP RXXXX
YYWW
TYPE NUMBER
DATE CODE
1-469
Insulation and Safety Related Specifications
Parameter
Symbol
Value
Units
Conditions
Min. External Air Gap
L(IO1)
7.0
mm
Measured from input terminals to output
(External Clearance)
terminals, shortest distance through air
Min. External Tracking Path
L(IO2)
8.5
mm
Measured from input terminals to output
(External Creepage)
terminals, shortest distance path along body
Min. Internal Plastic Gap
0.5
mm
Through insulation distance, conductor to
(Internal Clearance)
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
Tracking Resistance
CTI
200
volts
DIN IEC 112/VDE 0303 PART 1
(Comparative Tracking Index)
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Regulatory Information
The HSSR-8400 has been
approved by the following
organizations:
UL
Recognized under UL 508,
Component Recognition
Program, Industrial Control
Switches, File E142465.
CSA
Approved under CAN/CSA-C22.2
No. 14-95, Industrial Control
Equipment, File LR 87683.
Absolute Maximum Ratings
Storage Temperature ................................................... -55
C to+125
C
Operating Temperature - T
A
.......................................... -40
C to +85
C
Case Temperature - T
C
.......................................................... +105
C
[1]
Lead Solder Temperature .... 260
C for 10 S (1.6 mm below seating plane)
Average Input Current - I
F
............................................................ 20 mA
Repetitive Peak Input Current - I
F
............................................... 40 mA
(Pulse Width
1 ms; duty cycle
50%)
Transient Peak Input Current - I
F
............................................... 100 mA
(Pulse Width
200
s; duty cycle
1%)
Reverse Input Voltage - V
R
................................................................ 3 V
Input Power Dissipation .............................................................. 40 mW
Output Voltage (T
A
= 25
C)
Connection A - V
O
..................................................... - 400 to +400 V
Connection B - V
O
........................................................... 0 to +400 V
Average Output Current - Figure 3 (T
A
= 25
C, T
C
70
C)
Connection A - I
O
..................................................................... 0.15 A
Connection B - I
O
....................................................................... 0.3 A
Single Shot Peak Output Current
(100 ms pulse width, T
A
= 25
C, I
F
= 10 mA)
Connection A - I
O
...................................................................... 1.0 A
Connection B - I
O
...................................................................... 2.0 A
Output Power Dissipation ..................................................... 750 mW
[2]
Infrared and Vapor Phase Reflow Temperature
(Option #300) ......................................... See Fig. 1, Thermal Profile
Thermal Resistance
Typical Output MOSFET Junction
to Case
JC
= 55
C/W
Demonstrated ESD
Performance
Human Body Model: MIL-STD-
883 Method 3015.7 - 16 kV
Machine Model: EIAJ 1988.3.28
Version 2), Test Method 20,
Condition C 1200 V
Option 300 surface mount classification is Class A in accordance with CECC 00802.
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