Alpha Industries, Inc. [978] 241-7000
Fax [978] 241-7906 Email sales@alphaind.com www.alphaind.com
1
Specifications subject to change without notice. 1/02A
2932 GHz Surface Mount
Medium Power Amplifier
Features
Surface Mount Package
11 dB Gain
24 dBm P
1 dB
Output Power
100% DC and RF Testing
AA032P1-A4
Patent Pending
Description
The AA032P1-A4 is a broadband millimeterwave medium
power amplifier in a rugged surface mount package that
is compatible with high-volume solder installation. The
amplifier is designed for use in millimeterwave
communication and sensor systems as an output stage
or driver in the transmit chain or LO chain when high gain
and high linearity is required. The robust ceramic
surface mount package provides excellent electrical
performance and a high degree of environmental
protection for long-term reliability. All amplifiers are
screened at the operating frequencies prior to shipment
for guaranteed performance. Amplifier is targeted for high-
volume millimeterwave applications such as point-to-point
and point-to-multipoint wireless communications systems
and satellite communication systems.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Bandwidth
BW
29
32
GHz
Small Signal Gain
1
G
9
11
dB
Output Power at 1 dB Gain Compression
2
P
1 dB
23
24
dBm
Input Return Loss
4
RL
I
9
dB
Output Return Loss
4
RL
O
7
dB
Temperature Coefficient of Gain
4
dG/dT
-0.038
dB/C
Drain Current
3
I
D
400
450
mA
Electrical Specifications at 25C (V
D
= 6 V, V
G
= -1 V)
Pin Out
AA032P1-A4
YYWW
RF In
RF Out
Orientation
Indicated by
Missing
Castellations
N/C
V
G
V
D
N/C N/C N/C
1. Small signal gain over entire bandwidth is measured on 100% of parts.
2. Output power P
1 dB
is measured at 31 GHz on 100% of parts.
3. Drain current is measured on 100% of parts.
4. Not measured on 100% of parts.
Preliminary
2932 GHz Surface Mount Medium Power Amplifier
AA032P1-A4
2
Alpha Industries, Inc. [978] 241-7000
Fax [978] 241-7906 Email sales@alphaind.com www.alphaind.com
Specifications subject to change without notice. 1/02A
Characteristic
Value
Operating Temperature (T
C
)
-55C to +85C
Storage Temperature (T
ST
)
-65C to +125C
Bias Voltage (V
D
)
7 V
DC
Power In (P
IN
)
22 dBm
Absolute Maximum Ratings
(dB)
Frequency (GHz)
S-Parameters
-20
-10
0
10
20
25
30
35
40
S
21
S
11
S
22
Output Power (dBm)
Input Power (dBm)
Output Power vs. Input Power
12
15
18
21
24
27
3
6
9
12
15
18
P
1 dB
= 23.0 dBm @ 28 GHz
P
1 dB
= 24.7 dBm @ 30 GHz
P
1 dB
= 23.9 dBm @ 32 GHz
P
1 dB
= 24.3 dBm
@ 31GHz
(dB)
Frequency (GHz)
Gain vs. Temperature
-20
-10
0
10
20
27
29
31
33
35
+85C
-55C
+25C
P
1 dB
(dBm)
Frequency (GHz)
P
1 dB
vs. Frequency
20
21
22
23
24
25
26
29
30
31
32
6.0 V
5.5 V
Typical Performance Data (V
D
= 6 V, V
G
= -1 V)
Outline Drawing
YYWW
0.080
(0.20 mm)
0.037
(0.94 mm)
0.040
(1.02 mm)
0.065
(1.65 mm)
0.026
(0.66 mm)
C
L
C
L
0.153
(3.87 mm)
0.145
(3.68 mm)
0.054
(1.37 mm)
0.014
(0.36 mm)
0.056 (1.42 mm)
0.285
(7.24 mm)
0.291 (7.39 mm)
0.275 (6.98 mm)
0.306
(7.77 mm)
0.040 (1.02 mm)
2932 GHz Surface Mount Medium Power Amplifier
AA032P1-A4
Alpha Industries, Inc. [978] 241-7000
Fax [978] 241-7906 Email sales@alphaind.com www.alphaind.com
3
Specifications subject to change without notice. 1/02A
Typical S-Parameters at 25C (V
D
= 6 V, V
G
= -1 V)
Frequency
S
11
S
21
S
12
S
22
(GHz)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
10
-0.5
-94
-35.3
4
-61.1
-114
-0.5
44
12
-0.7
-158
-50.8
-154
-51.1
176
-0.3
0
14
-1.0
111
-56.9
100
-55.0
99
-0.4
-37
16
-1.3
39
-43.2
83
-43.0
84
-0.9
-96
18
-0.8
-36
-40.3
31
-45.1
8
-1.3
-147
20
-0.6
-109
-29.3
17
-39.2
62
-1.1
166
22
-1.0
-165
-15.8
-76
-52.1
41
-2.1
104
24
-2.4
77
-3.6
171
-38.7
-48
-3.3
-3
25
-2.8
-7
1.4
106
-46.4
-65
-3.3
-55
26
-3.1
-75
5.3
43
-39.8
-37
-2.7
-105
27
-3.5
-136
9.8
-24
-32.0
-75
-2.8
-152
28
-6.1
159
12.7
-104
-28.7
-156
-6.7
162
29
-8.7
121
13.1
179
-28.4
132
-17.0
145
30
-7.8
60
12.6
111
-28.0
77
-16.3
-177
31
-5.7
1
12.1
51
-28.6
22
-19.6
177
32
-5.0
-52
11.9
-13
-28.4
-23
-26.1
118
33
-6.6
-86
10.5
-71
-28.9
-66
-14.2
14
34
-7.5
-129
10.3
-124
-27.7
-114
-9.4
-10
35
-9.8
167
11.0
178
-26.9
-177
-10.8
-39
36
-13.4
143
10.7
111
-26.1
123
-16.7
-114
37
-7.6
163
8.8
39
-26.1
65
-11.9
149
38
-5.8
129
6.3
-25
-23.7
25
-10.7
99
39
-8.7
77
2.2
-87
-21.4
-16
-11.5
47
40
-4.8
23
-0.4
-141
-19.8
-72
-9.2
9
Biasing
For biasing on, adjust V
G
from 0 to approximately -1 V.
Adjust V
D
from 0 to desired value (5 V6 V recommended).
Adjust V
G
to achieve desired I
D
(400 mA recommended).
For biasing off, reverse the biasing on procedure.
2932 GHz Surface Mount Medium Power Amplifier
AA032P1-A4
4
Alpha Industries, Inc. [978] 241-7000
Fax [978] 241-7906 Email sales@alphaind.com www.alphaind.com
Specifications subject to change without notice. 1/02A
Alpha-2
TM
Surface Mount Package
Handling and Mounting
Millimeterwave components require careful mounting
design to maintain optimal performance. The Alpha-2
TM
surface mount package (patent pending) provides a
rugged and repeatable electrical connection using
standard solder techniques.
The -A4 package is one of several parts in the Alpha-2
TM
surface mount package family.
Handling
The -A4 surface mount package is very rugged. However,
due to ceramic's brittle nature, one should exercise care
when handling with metal tools. Do not apply heavy
pressure to the lid. Vacuum tools may be used to pick and
place this part.
Only personnel trained in both ESD precautions and
handling precautions should be allowed to handle these
packages.
Package Construction
The -A4 surface mount package consists of a base and
a lid. The package base is ceramic with filled vias and
plated castellations. The package lid is unplated alumina.
The lid seal is epoxy.
Mounting Design
The -A4 surface mount package is installed on top of a printed
circuit board on a specially designed footprint.
Mounting footprint geometry for the -A4 package will be
supplied by Alpha Industries in electronic format upon request.
Mounting the Package
The -A4 surface mount package is compatible with high-
volume surface mount installation using solder. RF and DC
connections are accomplished with metallized edge
castellations that hold solder fillets. Ground connections are
accomplished by both metallized edge castellations and
filled vias to the bottom of the package. Care should be
taken to ensure that there are no voids or gaps in the solder
so that good RF, DC and ground contact is maintained.
-A4 Surface Mount Package Installation.
Printed Circuit Board
Rogers 4003,
0.008" (0.20 mm) Thick
or Equivalent
Electrically & Thermally
Conductive Ground Plane
RF In
RF Out
DC Bias Lines
(Up to 3 per side)
DC Bias Lines
(Up to 3 per side)
Footprint Geometry for -A4 Surface Mount Package.
DC Connections
RF In
Via Holes
to Ground
RF Out
DC Connections
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