ChipFind - документация

Электронный компонент: MF-SMDF050

Скачать:  PDF   ZIP
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Electrical Characteristics
Max. Time
Tripped
Ihold
Itrip
To Trip
Power
Resistance
Dissipation
Model
Amperes
Ohms
Amperes
Seconds
Watts
V max.
I max.
at 23 C
at 23 C
at 23 C
at 23 C
at 23 C
Volts
Amps
Hold
Trip RMin.
R1Max.
Typ.
MF-SMDF030
60
20
0.30
0.80
0.450
2.250
1.5
1.5
0.7
MF-SMDF050
60
10
0.55
1.20
0.200
0.950
2.5
4.0
1.0
MF-SMDF100
15
40
1.10
2.20
0.100
0.390
8.0
0.5
1.1
MF-SMDF150
15
40
1.50
3.00
0.070
0.175
8.0
0.9
1.2
MF-SMDF150/33
33
40
1.50
3.00
0.070
0.175
8.0
0.9
1.2
MF-SMDF200
10
40
2.00
4.10
0.048
0.095
8.0
2.7
1.3
Operating Temperature ......................................-40 C to +85 C
Maximum Device Surface Temperature
in Tripped State ................................................125 C
Passive Aging......................................................+85 C, 1000 hours ....................................5 % typical resistance change
Humidity Aging....................................................+85 C, 85 % R.H. 1000 hours ..................5 % typical resistance change
Thermal Shock ....................................................+85 C to -40 C, 20 times ........................10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Environmental Characteristics
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 C............................................................Rmin
R R1max
Time to Trip ....................................At specified current, Vmax, 23 C ..................................
T max. time to trip (seconds)
Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage
Test Procedures And Requirements For Model MF-SMDF Series
MF-SMDF Series -
PTC Resettable Fuses
Features
Very low profile
High voltage
Lead-free construction
Symmetrical
2018 footprint
Agency recognition pending
Applications
Power Over Ethernet (IEEE 802.3 af) port
protection
Firewire and i.Link IEEE 1394 port
protection
Automotive electronic control module
protection
Telecom equipment low voltage
protection
NEW!
Thermal Derating Chart - Ihold / Itrip (Amps)
Ambient Operating Temperature
Model
-40 C
-20 C
0 C
23 C
40 C
50 C
60 C
70 C
85 C
MF-SMDF030
0.48 / 0.96 0.42 / 0.84 0.35 / 0.70 0.30 / 0.60 0.24 / 0.48 0.21 / 0.42 0.17 / 0.34 0.15 / 0.30 0.10 / 0.20
MF-SMDF050
0.86 / 1.72
0.77 / 1.54
0.70 / 1.40
0.55 / 1.10
0.48 / 0.96
0.43 / 0.86
0.38 / 0.76
0.36 / 0.72
0.26 / 0.52
MF-SMDF100
1.59 / 3.18
1.43 / 2.86
1.20 / 2.40
1.10 / 2.20
0.94 / 1.88
0.85 / 1.70
0.72 / 1.44
0.69 / 1.38
0.57 / 1.14
MF-SMDF150
2.21 / 4.42
1.97 / 3.94
1.70 / 3.40
1.50 / 3.00
1.26 / 2.52
1.15 / 2.30
1.00 / 2.00
0.91 / 1.82
0.73 / 1.46
MF-SMDF150/33
2.21 / 4.42
1.97 / 3.94
1.70 / 3.40
1.50 / 3.00
1.26 / 2.52
1.15 / 2.30
1.00 / 2.00
0.91 / 1.82
0.73 / 1.46
MF-SMDF200
2.81 / 5.62
2.54 / 5.08
2.27 / 4.54
2.00 / 4.00
1.73 / 3.46
1.59 / 3.18
1.46 / 2.92
1.32 / 2.64
1.12 / 2.24
Product Dimensions
Packaging: 2000 pcs. per reel.
MF-SMDF Series -
PTC Resettable Fuses
A
B
C
D
E
Model
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Min.
MF-SMDF030
4.72
5.44
4.22
4.93
0.79
1.09
0.30
0.25
(0.186)
(0.214)
(0.166)
(0.194)
(0.031)
(0.043)
(0.012)
(0.010)
MF-SMDF050
4.72
5.44
4.22
4.93
0.79
1.09
0.30
0.25
(0.186)
(0.214)
(0.166)
(0.194)
(0.031)
(0.043)
(0.012)
(0.010)
MF-SMDF100
4.72
5.44
4.22
4.93
0.79
1.09
0.30
0.25
(0.186)
(0.214)
(0.166)
(0.194)
(0.031)
(0.043)
(0.012)
(0.010)
MF-SMDF150
4.72
5.44
4.22
4.93
0.79
1.09
0.30
0.25
(0.186)
(0.214)
(0.166)
(0.194)
(0.031)
(0.043)
(0.012)
(0.010)
MF-SMDF150/33
4.72
5.44
4.22
4.93
0.79
1.09
0.30
0.25
(0.186)
(0.214)
(0.166)
(0.194)
(0.031)
(0.043)
(0.012)
(0.010)
MF-SMDF200
4.72
5.44
4.22
4.93
0.79
1.09
0.30
0.25
(0.186)
(0.214)
(0.166)
(0.194)
(0.031)
(0.043)
(0.012)
(0.010)
MM
(INCHES)
UNIT =
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Optional Sn finish:
Meets ANSI/J-STD-002 Category 3.
Recommended Storage:
40 C max./70 % RH max.
A
B
C
Top and Bottom View
Side View
D
E
Recommended Pad Layout
4.6 0.1
(.181 .004)
3.4 0.1
(.134 .004)
1.5 0.05
(.059 .002)
1.5 0.05
(.059 .002)
Typical Time to Trip at 23 C
0.01
0.1
1
0.001
0.1
1
10
100
10
100
Fault Current (Amps)
Time to Trip (Seconds)
MF-SMDF030
MF-SMDF050
MF-SMDF200
MF-SMDF150
MF-SMDF100
The Time to Trip curves
represent typical perform-
ance of a device in a
simulated application
environment. Actual
performance in specific
customer applications may
differ from these values due
to the influence of other
variables.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
How to Order
MF - SMDF 150/33 T - 2
Multifuse
Product
Designator
Series
SMDF = 2018 Surface Mount
Component
Hold Current, Ihold
030-200 (0.30 Amps - 2.00 Amps)
Higher Voltage Option
__ = Standard Voltage
/33 = 33 Volt Rated
Optional Terminal Finish
__ = Standard Au Finish
T = Optional Sn Finish
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-SMDF Series -
PTC Resettable Fuses
Typical Part Marking
Represents total content. Layout may vary.
PART
IDENTIFICATION:
30 = MF-SMDF030
05 = MF-SMDF050
10 = MF-SMDF100
15 = MF-SMDF150
20 = MF-SMDF200
YEAR CODE:
3 = 2003
BI-WEEKLY DATE CODE:
WEEKS 13-14 = G
MANUFACTURER'S
TRADEMARK
10 3
G
160220
300
250
200
150
100
50
0
1020
Temperature (
C)
120
Preheating
Soldering
Cooling
Time (seconds)
Solder Reflow Recommendations
Notes:
MF-SMDF models cannot be wave soldered.
If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
Compatible with Pb and Pb-free solder reflow profiles.
MF-SMDF SERIES, REV. B, 05/04
MF-NSMF Series
MF-SMDF Series
Tape Dimensions
per EIA 481-1
per EIA 481-2
W
P0
P1
P2
A0
B0
B1 max.
D0
F
E1
E2 min.
T max.
T1 max.
K0
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2 max.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-NSMF & MF-SMDF Series Tape and Reel Specifications
B1
N(HUB DIA.)
(MEASURED
AT HUB)
A
T
COVER
TAPE
K0
T1
A0
W2
(MEASURED
AT HUB)
W1
P1
B0
F
D0
P2
P0
E2
E1
W
UNIT =
MM
(INCHES)
8.0 0.30
(0.315 0.012)
4.0 0.10
(0.157 0.004)
4.0 0.10
(0.157 0.004)
2.0 0.05
(0.079 0.002)
1.85 0.10
(0.073 0.004)
1.75 0.10
(0.069 0.004)
1.50 + 0.1/-0.0
(0.059 + 0.004/-0)
8.4 + 1.5/-0.0
(0.331 + 0.059/-0.0)
4.35
(0.171)
6.25
(0.246)
0.6
(0.024)
0.1
(0.004)
390
(15.35)
160
(6.30)
185
(7.28)
50
(1.97)
14.4
(0.567)
16.0 0.3
(0.630 0.012)
4.0 0.1
(0.157 0.004)
8.0 0.1
(0.315 0.004)
2.0 0.1
(0.079 0.004)
5.1 0.15
(0.201 0.006)
5.6 0.23
(0.220 0.009)
7.5 0.10
(0.295 0.004)
1.75 0.10
(0.069 0.004)
1.0 0.15
(0.039 0.015)
1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
16.4 + 2.0/ -0.0
(0.646 + 0.079/-0.0)
12.1
(0.476)
14.25
(0.561)
0.6
(0.024)
0.1
(0.004)
390
(15.35)
160
(6.30)
331
(13.03)
50
(1.97)
22.4
(0.882)
3.45 0.10
(0.136 0.004)
0.74 0.10
(0.029 0.004)