1
www.clare.com
LBB110
DS-LBB110-R6
The LBB110 is a Dual 1 Form B solid state relay that has
two independently controlled optically coupled MOSFETs.
The efficient MOSFET switches and photovoltaic die use
Clare's patented OptoMOS
architecture to provide 3750
V
RMS
of input to output isolation. The optically coupled
inputs are controlled by highly efficient GaAIAs infrared
LEDs. Dual pole OptoMOS relays provide a more compact
design solution than discrete single pole relay in a variety
of applications. The dual pole relays save board space by
incorporating both relays in a single 8-pin package.
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Hookswitch
Dial Pulsing
Ground Start
Ringer Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment--Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
UL Recognized: File Number E76270
CSA Certified: File Number LR 43639-10
BSI Certified to:
BS EN 60950:1992 (BS7002:1992)
Certificate #: 7344
BS EN 41003:1993
Certificate #: 7344
Small 8 Pin DIP Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
3750V
RMS
Input/Output Isolation
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Surface Mount and Tape & Reel Versions Available
Applications
Features
Description
Approvals
DUAL POLE OptoMOS
Relay
Ordering Information
Part #
Description
LBB110
8 Pin DIP (50/Tube)
LBB110P
8 Pin Flatpack (50/Tube)
LBB110PTR
8 Pin Flatpack (1000/Reel)
LBB110S
8 Pin Surface Mount (50/Tube)
LBB110STR
8 Pin Surface Mount (1000/Reel)
LBB110
Units
Load Voltage
350
V
Load Current
120
mA
Max R
ON
35
Pin Configuration
Switching Characteristics of
Normally Closed (Form B) Devices
CONTROL
10ms
10%
90%
90%
+
+
T
ON
T
OFF
+
1
2
3
4
8
7
6
5
+ Control - Switch #1
Control - Switch #1
+ Control - Switch #2
Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
LBB110 Pinout
www.clare.com
LBB110
Rev. 6
Electrical Characteristics
Absolute Maximum Ratings are stress ratings. Stresses
in excess of these ratings can cause permanent damage
to the device. Functional operation of the device at these
or any other conditions beyond those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to the absolute maximum ratings
for an extended period may degrade the device and effect
its reliability.
Absolute Maximum Ratings (@ 25 C)
2
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics @ 25C
Load Voltage (Peak)
-
V
L
-
-
350
V
Load Current* (Continuous)
-
I
L
-
-
120
mA
Peak Load Current
10ms
I
LPK
-
-
350
mA
On-Resistance
I
L
=120mA
R
ON
-
25
35
Off-State Leakage Current
V
L
=350V
-
-
-
1
A
Switching Speeds
Turn-On
I
F
=5mA,V
L
=10V
T
ON
-
-
3
ms
Turn-Off
I
F
=5mA,V
L
=10V
T
OFF
-
-
3
ms
Output Capacitance
50V; f=1MHz
C
OUT
-
25
-
pF
Input Characteristics @ 25C
Input Control Current
I
L
=120mA
I
F
5
-
50
mA
Input Dropout Current
-
I
F
0.4
0.7
-
mA
Input Voltage Drop
I
F
=5mA
V
F
0.9
1.2
1.4
V
Reverse Input Voltage
-
V
R
-
-
5
V
Reverse Input Current
V
R
=5V
I
L
-
-
10
A
Input to Output Capacitance
-
V
C/O
-
3
-
pF
Input to Output Isolation
-
V
I/O
3750
-
-
V
RMS
*Note: If both poles operate simulataneously load current must be derated so as not to exceed the package power dissipation value.
Parameter
Min
Typ
Max Units
Input Power Dissipation
-
-
150
1
mW
Input Control Current
-
-
50
mA
Peak (10ms)
-
-
1
A
Reverse Input Voltage
-
-
5
V
Total Power Dissipation
-
-
800
2
mW
Isolation Voltage
Input to Output
3750
-
-
V
RMS
Operational Temperature
-40
-
+85
C
Storage Temperature
-40
-
+125
C
Soldering Temperature
(10 Seconds Max.)
DIP Package
-
-
+260
C
Flatpack/Surface Mount
Package
-
-
+220
C
1
Derate Linearly 1.33 mw/C
2
Derate Linearly 6.67 mw/C
LBB110
www.clare.com
Rev. 6
PERFORMANCE DATA*
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact
our application department.
3
LBB110
Typical LED Forward Voltage Drop
(N=50 Ambient Temperature = 25
C)
I
F
= 5mADC
35
30
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
LBB110
Typical On-Resistance Distribution
(N=50 Ambient Temperature = 25
C)
(Load Current = 120mADC)
25
20
15
10
5
0
25.5
27.5 28.5
30.5
29.5
31.5
On-Resistance (
)
Device Count (N)
26.5
LBB110
Typical Blocking Voltage Distribution
(N=50 Ambient Temperature = 25
C)
I
F
= 5mADC
25
20
15
10
5
0
357.5 372.5 387.5 402.5 417.5 432.5
Blocking Voltage (V)
Device Count (N)
LBB110
Typical I
F
for Switch Operation
(N=50 Ambient Temperature = 25
C)
(Load Current = 120mADC)
0.33
0.77
1.21
1.65
0.55
0.99
1.43
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
LBB110
Typical I
F
for Switch Dropout
(N=50 Ambient Temperature = 25
C)
(Load Current = 120mADC
25
20
15
10
5
0
0.11
0.55
0.99
1.43
0.33
0.77
1.21
LED Current (mA)
Device Count (N)
)
LBB110
Typical Turn-On Time
(N=50 Ambient Temperature = 25
C)
(Load Current = 120mADC; I
F
= 5mADC)
0.27
0.63
0.99
0.45
0.81
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
0.09
LBB110
Typical Turn-Off Time
(N=50 Ambient Temperature = 25
C)
(Load Current = 120mADC; I
F
= 5mADC)
0.45
0.81
1.35
0.27
0.63
0.99
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
1.17
LBB110
Typical Leakage vs. Temperature
(Measured across Pins 5 & 6 or 7 & 8)
Temperature (
C)
Leakage (
A)
-40
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-20
0
20
40
60
80
100
LBB110
Typical Blocking Voltage vs. Temperature
I
F
= 5mADC
Temperature (
C)
Blocking Voltage (V
RMS
)
-40
410
405
400
395
390
385
380
-20
0
20
40
60
80
100
LBB110
Typical Turn-On vs. Temperature
(Load Current = 120mADC)
Temperature (
C)
5mA
Turn-On (ms)
-40
0.6
0.5
0.4
0.3
0.2
0.1
0
-20
0
20
40
60
80
100
LBB110
Typical Turn-Off vs. Temperature
(Load Current = 120mADC)
Temperature (
C)
Turn-Off (ms)
-40
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0
-20
0
20
40
60
80
100
10mA
5mA
LBB110
Typical Load Current vs. Temperature
Temperature (
C)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
-40 -20
0
20
40
60
80
120
100
www.clare.com
4
LBB110
Rev. 6
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact
our application department.
LBB110
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (
C)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
120
100
50mA
10mA
5mA
LBB110
Typical Turn-On vs. LED Forward Current
(Load Current = 120mADC)
LED Forward Current (mA)
Turn-On (ms)
0
5
10
15
20
25
30
35
40
45
0.3000
0.2500
0.2000
0.1500
0.1000
0.0500
0
50
LBB110
Typical Turn-Off vs. LED Forward Current
(Load Current = 120mADC)
LED Forward Current (mA)
Turn-Off (ms)
0
5
10
15
20
25
30
35
40
45
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
LBB110
Typical I
F
for Switch Operation
vs. Temperature
(Load Current = 120mADC)
Temperature (
C)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20
0
20
40
60
80
100
LBB110
Typical I
F
for Switch Dropout
vs. Temperature
(Load Current = 120mADC)
Temperature (
C)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20
0
20
40
60
80
100
LBB110
Typical Load Current vs. Load Voltage
(Ambient Temperature = 25
C)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-4
-3
-2
-1
1
2
3
0
4
LBB110
Energy Rating Curve
Time
Load Current (A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
s
1ms
100ms
10s
100
s
10ms
1s
100s
LBB110
Typical On-Resistance vs. Temperature
(Load Current =Max Rated Over Temp.)
Temperature (
C)
On-Resistance(
)
-40
50
45
40
35
30
25
20
15
10
5
0
-20
0
20
40
60
80
100
Dual Pole
Single Pole
Instantaneous
LBB110
www.clare.com
5
Rev. 6
Dimensions
mm
(inches)
Mechanical Dimensions
PC Board Pattern
(Top View)
6.350
.127
(.250
.005)
2.540
.127
(.100
.005)
7.620
.127
(.300
.005)
7.620
.127
(.300
.005)
8-.800 DIA.
(8-.031 DIA.)
7.239 TYP.
(.285)
3.302
(.130)
7.620
.254
(.300
.010)
9.144 TYP.
(.360)
6.350
.127
(.250
.005)
9.652
.381
(.380
.015)
2.540
.127
(.100
.005)
9.144
.508
(.360
.020)
.457
.076
(.018
.003)
8.077
.127
(.318
.005 )
8 Pin DIP Through Hole (Standard)
PC Board Pattern
(Top View)
2.540
.127
(.100
.005)
8.763
.127
(.345
.005)
1.193
(.047)
.787
(.031)
8 Pin Flatpack ("P" Suffix)
7.620
.254
(.300
.010)
2.159 TYP.
(.085)
2.286 MAX.
(.090)
9.398
.127
(.370
.005)
6.350
.127
(.250
.005)
9.652
.381
(.380
.015)
2.540
.127
(.100
.005)
8.077
.127
(.318
.005)
.457
.076
(.018
.003)
.203
(.008)
.635
.127
(.025)
4.445
.127
(.175
.005)
3.302
(.130)
7.620
.254
(.300
.010)
6.350
.127
(.250
.005)
8.077
.127
(.318
.005)
2.540
.127
(.100
.005)
9.525
.254
(.375
.010)
.457
.076
(.018
.003)
.254 TYP.
(.010)
.635 TYP.
(.025)
8 Pin DIP Surface Mount ("S" Suffix)
9.652
.381
(.380
.015)
PC Board Pattern
(Top View)
2.540
.127
(.100
.005)
8.305
.127
(.327
.005)
1.905
.127
(.075
.005)
1.498
.127
(.059
.005)
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