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Электронный компонент: CY7C1339F-133BGI

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4-Mbit (128K x 32) Pipelined Sync SRAM
CY7C1339F
Cypress Semiconductor Corporation
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Document #: 38-05217 Rev. *C
Revised April 09, 2004
Features
Registered inputs and outputs for pipelined operation
128K 32 common I/O architecture
3.3V core power supply
2.5V / 3.3V I/O operation
Fast clock-to-output times
-- 2.6 ns (for 250-MHz device)
-- 2.6 ns (for 225-MHz device)
-- 2.8 ns (for 200-MHz device)
-- 3.5 ns (for 166-MHz device)
-- 4.0 ns (for 133-MHz device)
-- 4.5 ns (for 100-MHz device)
Provide high-performance 3-1-1-1 access rate
User-selectable burst counter supporting Intel
Pentium
interleaved or linear burst sequences
Separate processor and controller address strobes
Synchronous self-timed writes
Asynchronous output enable
Offered in JEDEC-standard 100-pin TQFP and 119-ball
BGA packages
"ZZ" Sleep Mode Option
Functional Description
[1]
The CY7C1339F SRAM integrates 131,072 x 32 SRAM cells
with advanced synchronous peripheral circuitry and a two-bit
counter for internal burst operation. All synchronous inputs are
gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE
1
), depth-expansion Chip Enables (CE
2
and
CE
3
), Burst
Control inputs (ADSC, ADSP, and ADV), Write Enables
(BW
[A:D]
, and BWE), and Global Write (GW). Asynchronous
inputs include the Output Enable (OE) and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to four bytes wide as
controlled by the byte write control inputs. GW when active
LOW causes all bytes to be written.
The CY7C1339F operates from a +3.3V core power supply
while all outputs may operate with either a +2.5 or +3.3V
supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
1
Note:
1. For bestpractices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
ADDRESS
REGISTER
ADV
CLK
BURST
COUNTER
AND
LOGIC
CLR
Q1
Q0
ADSP
ADSC
M ODE
BW E
GW
CE
1
CE
2
CE
3
OE
ENABLE
REGISTER
OUTPUT
REGISTERS
SENSE
AM PS
OUTPUT
BUFFERS
E
PIPELINED
ENABLE
INPUT
REGISTERS
A0, A1, A
BW
B
BW
C
BW
D
BW
A
M EM ORY
ARRAY
D Q s
SLEEP
CONTROL
ZZ
A
[1:0]
2
DQ
A
BYTE
WRITE REGISTER
DQ
B
BYTE
WRITE REGISTER
DQ
C
BYTE
WRITE REGISTER
DQ
D
BYTE
WRITE REGISTER
DQ
A
BYTE
WRITE DRIVER
DQ
B
BYTE
WRITE DRIVER
DQ
C
BYTE
WRITE DRIVER
DQ
D
BYTE
WRITE DRIVER
Logic Block Diagram
background image
CY7C1339F
Document #: 38-05217 Rev. *C
Page 2 of 17
Pin Configurations
Selection Guide
250 MHz
225 MHz
200 MHz
166 MHz
133 MHz
100 MHz
Unit
Maximum Access Time
2.6
2.6
2.8
3.5
4.0
4.5
ns
Maximum Operating Current
325
290
265
240
225
205
mA
Maximum CMOS Standby Current
40
40
40
40
40
40
mA
Shaded areas contain advanced information. Please contact your local Cypress sales representative for availability of these parts.
A
A
A
A
A
1
A
0
NC NC
V
SS
V
DD
NC
NC
A
A
A
A
A
A
A
NC
DQ
B
DQ
B
V
DDQ
V
SSQ
DQ
B
DQ
B
DQ
B
DQ
B
V
SSQ
V
DDQ
DQ
B
DQ
B
V
SS
NC
V
DD
ZZ
DQ
A
DQ
A
V
DDQ
V
SSQ
DQ
A
DQ
A
DQ
A
DQ
A
V
SSQ
V
DDQ
DQ
A
DQ
A
NC
NC
DQ
C
DQ
C
V
DDQ
V
SSQ
DQ
C
DQ
C
DQ
C
DQ
C
V
SSQ
V
DDQ
DQ
C
DQ
C
NC
V
DD
NC
V
SS
DQ
D
DQ
D
V
DDQ
V
SSQ
DQ
D
DQ
D
DQ
D
DQ
D
V
SSQ
V
DDQ
DQ
D
DQ
D
NC
A
A
CE
1
CE
2
BW
D
BW
C
BW
B
BW
A
CE
3
V
DD
V
SS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A
A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
MODE
BYTE A
BYTE B
BYTE D
BYTE C
100-pin TQFP
CY7C1339F
background image
CY7C1339F
Document #: 38-05217 Rev. *C
Page 3 of 17
Pin Configurations
(continued)
Pin Definitions
Name
BGA
TQFP
I/O
Description
A
0
, A
1
, A
P4,N4,
A2,C2,R2,
A3,B3,C3,
T3,T4,A5,
B5,C5,T5,
A6,C6,R6
37,36,
32,33,34,
35,44,45,
46,47,48,
49,50,81,
82,99,
100
Input-
Synchronous
Address Inputs used to select one of the 128K address locations.
Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW,
and CE
1
,
CE
2
, and
CE
3
are sampled active. A1, A0 are fed to the two-bit
counter..
BW
A,
BW
B
BW
C,
BW
D
L5,G5,G3,
L3
93,94,95,
96
Input-
Synchronous
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct
byte writes to the SRAM. Sampled on the rising edge of CLK.
GW
H4
88
Input-
Synchronous
Global Write Enable Input, active LOW. When asserted LOW on the
rising edge of CLK, a global write is conducted (ALL bytes are written,
regardless of the values on BW
[A:D]
and BWE).
BWE
M4
87
Input-
Synchronous
Byte Write Enable Input, active LOW. Sampled on the rising edge of
CLK. This signal must be asserted LOW to conduct a byte write.
CLK
K4
89
Input-
Clock
Clock Input. Used to capture all synchronous inputs to the device. Also
used to increment the burst counter when ADV is asserted LOW, during
a burst operation.
CE
1
E4
98
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK.
Used in conjunction with CE
2
and CE
3
to select/deselect the device.
ADSP is ignored if CE
1
is HIGH.
CE
2
B2
97
Input-
Synchronous
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK.
Used in conjunction with CE
1
and CE
3
to select/deselect the device.
2
3
4
5
6
7
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
DDQ
NC
NC
NC
DQ
C
DQ
D
DQ
C
DQ
D
A
A
A
A
ADSP
V
DDQ
CE
2
A
DQ
C
V
DDQ
DQ
C
V
DDQ
V
DDQ
V
DDQ
DQ
D
DQ
D
NC
NC
V
DDQ
V
DD
CLK
V
DD
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
V
DDQ
V
DDQ
V
DDQ
A
A
A
A
NC
A
A
A
A
A
A
A0
A1
DQ
A
DQ
C
DQ
A
DQ
A
DQ
A
DQ
B
DQ
B
DQ
B
DQ
B
DQ
B
DQ
B
DQ
B
DQ
A
DQ
A
DQ
A
DQ
A
DQ
B
V
DD
DQ
C
DQ
C
DQ
C
V
DD
DQ
D
DQ
D
DQ
D
DQ
D
ADSC
NC
CE
1
OE
ADV
GW
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
MODE
NC
NC
BW
B
BW
c
NC
V
DD
NC
BW
A
NC
BWE
BW
D
ZZ
CY7C1339F (128K 32)
119-ball BGA
background image
CY7C1339F
Document #: 38-05217 Rev. *C
Page 4 of 17
CE
3
-
92
Input-
Synchronous
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK.
Used in conjunction with CE
1
and
CE
2
to select/deselect the device. Not
connected for BGA. Where referenced, CE
3
is assumed active
throughout this document for BGA.
OE
F4
86
Input-
Asynchronous
Output Enable, asynchronous input, active LOW. Controls the
direction of the I/O pins. When LOW, the I/O pins behave as outputs.
When deasserted HIGH, I/O pins are three-stated, and act as input data
pins. OE is masked during the first clock of a read cycle when emerging
from a deselected state.
ADV
G4
83
Input-
Synchronous
Advance Input signal, sampled on the rising edge of CLK, active
LOW. When asserted, it automatically increments the address in a burst
cycle.
ADSP
A4
84
Input-
Synchronous
Address Strobe from Processor, sampled on the rising edge of
CLK, active LOW. When asserted LOW, addresses presented to the
device are captured in the address registers. A1, A0 are also loaded into
the burst counter. When ADSP and ADSC are both asserted, only ADSP
is recognized. ASDP is ignored when CE
1
is deasserted HIGH.
ADSC
B4
85
Input-
Synchronous
Address Strobe from Controller, sampled on the rising edge of
CLK, active LOW. When asserted LOW, addresses presented to the
device are captured in the address registers. A1, A0 are also loaded into
the burst counter. When ADSP and ADSC are both asserted, only ADSP
is recognized.
ZZ
T7
64
Input-
Asynchronous
ZZ "sleep" Input, active HIGH. When asserted HIGH places the device
in a non-time-critical "sleep" condition with data integrity preserved. For
normal operation, this pin has to be LOW or left floating. ZZ pin has an
internal pull-down.
DQs
K6,L6,M6,
N6,K7,L7,
N7,P7,E6,
F6,G6,H6,
D7,E7,G7,
H7,D1,E1,
G1,H1,E2,
F2,G2,H2,
K1,L1,N1,
P1,K2,L2,
M2,N2
52,53,56,
57,58,59,
62,63,68,
69,72,73,
74,75,78,
79,2,3,6,
7,8,9,12,
13,18,19,
22,23,24,
25,28,29
I/O-
Synchronous
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data
register that is triggered by the rising edge of CLK. As outputs, they
deliver the data contained in the memory location specified by the
addresses presented during the previous clock rise of the read cycle.
The direction of the pins is controlled by OE. When OE is asserted LOW,
the pins behave as outputs. When HIGH, DQs are placed in a three-state
condition.
V
DD
J2,J4,R4
15,41,65,
91
Power Supply Power supply inputs to the core of the device.
V
SS
D3,E3,F3,
K3,M3,N3,
P3,D5,E5,
F5,H5,K5,
M5,N5,P5
17,40,67,
90
Ground
Ground for the core of the device.
V
DDQ
A1,F1,J1,
M1,U1,A7,
F7,J7,M7,
U7
4,11,20,
27,54,61,
70,77
I/O Power
Supply
Power supply for the I/O circuitry.
V
SSQ
-
5,10,21,
26,55,60,
71,76
I/O Ground
Ground for the I/O circuitry.
MODE
R3
31
Input-
Static
Selects Burst Order. When tied to GND selects linear burst sequence.
When tied to V
DD
or left floating selects interleaved burst sequence. This
is a strap pin and should remain static during device operation. Mode
Pin has an internal pull-up.
Pin Definitions
(continued)
Name
BGA
TQFP
I/O
Description
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CY7C1339F
Document #: 38-05217 Rev. *C
Page 5 of 17
Functional Overview
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock.
Maximum access delay from the clock rise (t
CO
) is 3.5 ns
(166-MHz device).
The CY7C1339F supports secondary cache in systems
utilizing either a linear or interleaved burst sequence. The
interleaved burst order supports Pentium and i486
processors. The linear burst sequence is suited for processors
that utilize a linear burst sequence. The burst order is user
selectable, and is determined by sampling the MODE input.
Accesses can be initiated with either the Processor Address
Strobe (ADSP) or the Controller Address Strobe (ADSC).
Address advancement through the burst sequence is
controlled by the ADV input. A two-bit on-chip wraparound
burst counter captures the first address in a burst sequence
and automatically increments the address for the rest of the
burst access.
Byte Write operations are qualified with the Byte Write Enable
(BWE) and Byte Write Select (BW
[A:D]
) inputs. A Global Write
Enable (GW) overrides all Byte Write inputs and writes data to
all four bytes. All writes are simplified with on-chip
synchronous self-timed Write circuitry.
Three synchronous Chip Selects (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output three-state control. ADSP is ignored if
CE
1
is HIGH.
Single Read Accesses
This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW, (2)
CE
1
, CE
2
, CE
3
are all asserted active, and (3) the Write
signals (GW, BWE) are all deserted HIGH. ADSP is ignored if
CE
1
is HIGH. The address presented to the address inputs (A)
is stored into the address advancement logic and the Address
Register while being presented to the memory array. The
corresponding data is allowed to propagate to the input of the
Output Registers. At the rising edge of the next clock the data
is allowed to propagate through the output register and onto
the data bus within 3.5 ns (166-MHz device) if OE is active
LOW. The only exception occurs when the SRAM is emerging
from a deselected state to a selected state, its outputs are
always three-stated during the first cycle of the access. After
the first cycle of the access, the outputs are controlled by the
OE signal. Consecutive single Read cycles are supported.
Once the SRAM is deselected at clock rise by the chip select
and either ADSP or ADSC signals, its output will three-state
immediately.
Single Write Accesses Initiated by ADSP
This access is initiated when both of the following conditions
are satisfied at clock rise: (1) ADSP is asserted LOW, and
(2) CE
1
, CE
2
, CE
3
are all asserted active. The address
presented to A is loaded into the address register and the
address advancement logic while being delivered to the
memory array. The Write signals (GW, BWE, and BW
[A:D]
) and
ADV inputs are ignored during this first cycle.
ADSP-triggered Write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQs inputs is written into the corre-
sponding address location in the memory array. If GW is HIGH,
then the Write operation is controlled by BWE and BW
[A:D]
signals. The CY7C1339F provides Byte Write capability that is
described in the Write Cycle Descriptions table. Asserting the
Byte Write Enable input (BWE) with the selected Byte Write
(BW
[A:D]
) input, will selectively write to only the desired bytes.
Bytes not selected during a Byte Write operation will remain
unaltered. A synchronous self-timed Write mechanism has
been provided to simplify the Write operations.
Because the CY7C1339F is a common I/O device, the Output
Enable (OE) must be deserted HIGH before presenting data
to the DQs inputs. Doing so will three-state the output drivers.
As a safety precaution, DQs are automatically three-stated
whenever a Write cycle is detected, regardless of the state of
OE.
Single Write Accesses Initiated by ADSC
ADSC Write accesses are initiated when the following condi-
tions are satisfied: (1) ADSC is asserted LOW, (2) ADSP is
deserted HIGH, (3) CE
1
, CE
2
, CE
3
are all asserted active, and
(4) the appropriate combination of the Write inputs (GW, BWE,
and BW
[A:D]
) are asserted active to conduct a Write to the
desired byte(s). ADSC-triggered Write accesses require a
single clock cycle to complete. The address presented to A is
loaded into the address register and the address
advancement logic while being delivered to the memory array.
The ADV input is ignored during this cycle. If a global Write is
conducted, the data presented to the DQs is written into the
corresponding address location in the memory core. If a Byte
Write is conducted, only the selected bytes are written. Bytes
not selected during a Byte Write operation will remain
unaltered. A synchronous self-timed Write mechanism has
been provided to simplify the Write operations.
Because the CY7C1339F is a common I/O device, the Output
Enable (OE) must be deserted HIGH before presenting data
to the DQs inputs. Doing so will three-state the output drivers.
As a safety precaution, DQs are automatically three-stated
whenever a Write cycle is detected, regardless of the state of
OE.
NC
B1,C1,R1,
T1,D2,P2,
T2,U2,J3,
U3,D4,L4,
U4,J5,U5,
B6,D6,P6,
T6,U6,B7,
C7,R5,R7
1,14,16,
30,38,39,
42,43,51,
66,80
No Connects. Not internally connected to the die
Pin Definitions
(continued)
Name
BGA
TQFP
I/O
Description