CYStech Electronics Corp.
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 1/4
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3
CYStek Product Specification
Small Signal Schottky (double) diodes
BAT54N3/BAT54AN3
BAT54CN3/BAT54SN3
Description
Planar silicon Schottky barrier diodes encapsulated in a SOT-23 small plastic SMD package.
Single diodes and double diodes with different pinning are available.
Features
Very small conduction losses
Low forward voltage drop
Small plastic SMD package
Applications
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diodes
Pinning Outline
Description
Pin
BAT54 BAT54A BAT54C BAT54S
1
A K1 A1 A1
2
NC K2 A2 K2
3 K A1,A2 K1,K2 K1,A1
2
3
1
N.C.
1
2
3
1
2
3
3
2
1
SOT-23
1
2
3
(1) BAT54
(3)BAT54C
(2)BAT54A
(4)BAT54S
Diode configuration and symbol
Marking:
Type Marking
Code
BAT54 N3
L4
BAT54AN3 L42
BAT54CN3 L43
BAT54SN3 L44
CYStech Electronics Corp.
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 2/4
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3
CYStek Product Specification
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -65~+150
C
Junction Temperature Tj .............................................................................................................. +125
C
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) Ptot
(Note)
......................................................................... 230 mW
Maximum Voltages and Currents (Ta=25
C)
Repetitive Peak Reverse Voltage V
RRM
.............................................................................................. 30 V
Continuous Forward Current I
F
................................................................................................... 200 mA
Repetitive Peak Forward Current(tp1s,duty cycle0.5)................................................ 300mA
Non-repetitive Peak Forward Current (tp<10ms, sinusoidal) I
FSM
............................................... 600 mA
Note:for double diodes, Ptot is the total power dissipation of both diodes.
Characteristics
(Ta=25
C)
Characteristic Symbol Condition Min.
Max.
Unit
Reverse Breakdown Voltage
V
BR
I
R
=100A 30
-
V
V
F
(1) I
F
=0.1mA -
240
mV
V
F
(2) I
F
=1mA -
320
mV
V
F
(3) I
F
=10mA -
400
mV
V
F
(4) I
F
=30mA -
500
mV
Forward Voltage (Note 1)
V
F
(5) I
F
=100mA -
800
mV
Reverse Leakage Current (Note 2)
I
R
V
R
=25V,Tj=25
- 2 A
Diode Capacitance
C
D
V
R
=1V, f=1MHz
-
10
pF
Reverse Recovery Time
trr
I
F
=I
R
=10mA R
L
=100
measured at I
R
=1mA
- 5 ns
Notes
:
1.pulse test, tp=380s,duty cycle<2%.
2.pulse test, tp=5ms,duty cycle<2%.
CYStech Electronics Corp.
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 3/4
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3
CYStek Product Specification
Characteristic Curves
Forward Current & Forward Voltage
0
50
100
150
200
250
0
200
400
600
800
1000
Forward Voltage-V
F
(mV)
F
o
r
w
ar
d C
u
r
r
en
t
-
I
F
(mA
)
Diode Capacitance & Reverse-Biased Voltage
1
10
100
0.1
1
10
100
Reverse Biased Voltage-V
R
(V)
D
i
ode C
apac
it
anc
e-
C
d
(
p
F
)
CYStech Electronics Corp.
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 4/4
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3
CYStek Product Specification
SOT-23 Dimension
BAT54 N3: Single Diode (Marking Code L4)
BAT54AN3: Common Anode. (Marking Code L42)
BAT54CN3: Common Cathode. (Marking Code L43)
BAT54SN3: Series Connected. (Marking Code L44)
*: Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1102
0.1204 2.80 3.04 J 0.0034
0.0070 0.85 0.177
B 0.0472
0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335
0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118
0.0197 0.30 0.50 S 0.0830
0.1083 2.10 2.75
G 0.0669
0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Marking:
L4_
Diagram:
3-Lead SOT-23 Plastic Surface Mounted
Package. CYStek Package Code: N3
L4X
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