CYStech Electronics Corp.
Spec. No. : C332SY
Issued Date : 2004.04.16
Revised Date :
Page No. : 1/1
CASD355SY
CYStek Product Specification
80V/100mA SURFACE MOUNT SWITCHING DIODE
CASD355SY
Features:
Designed for mounting on small surface
Extremely thin / leadless package
Low leakage current
High mounting capability, strong surge withstand, high reliability
Mechanical data:
Case: 1005(2512) standard package, molded plastic, JEDEC SOD-323
Terminals : Gold plated, solderable per MIL-STD-750, method 2026.
Polarity: Indicated by cathode band
Mounting position: Any
Weight: 0.006 gram (approximately)
Absolute Maximum Ratings
(At Ta=25, unless otherwise noted)
Characteristics Symbol
Min
Typ
Max
Unit
Repetitive Peak Reverse Voltage
V
RRM
- - 90 V
Reverse Voltage
V
R
- - 80 V
Average Forward Current
I
O
- -
100
mA
Peak Forward Surge Current @8.3ms, single half
sine-wave superimposed on rated load(JEDEC method)
I
FSM
-
1000
- mA
Repetitive Peak Forward Current
I
FRM
- - 225
mA
Power Dissipation
P
D
- -
300
mW
Junction Temperature
Tj
-55
-
+125
C
Storage Temperature Range
Tstg
-55
-
+125
C
Electrical Characteristics
( At Ta=25
C, unless otherwise noted)
Parameter
Conditions
Symbol Min Typ Max Unit
Forward Voltage
I
F
=100mA
V
F
- - 1 V
Reverse Current
V
R
=80V
I
R
-
-
100
nA
Diode Capacitance
V
R
=0.5V, f=1MHz
C
D
- - 3 pF
Reverse Recovery Time I
F
=10mA,V
R
=6V,I
RR
=0.1I
R
, R
L
=50
t
rr
-
-
4 ns
CYStech Electronics Corp.
Spec. No. : C332SY
Issued Date : 2004.04.16
Revised Date :
Page No. : 2/2
CASD355SY
CYStek Product Specification
Characteristic Curves
Forward Current vs Forward Voltage
1
10
100
1000
0
0.2
0.4
0.6
0.8
1
1.2
Forward Voltage---VF(V)
Forward Current---IF(mA)
125
75
25
-25
Reverse Leakage Current vs Temperature
1
10
100
1000
10000
0
10
20
30
40
50
60
70
80
Ambient Temperature---TA()
Reverse Leakage Current---IR(n
A)
125
75
25
Diode Capacitance vs Reverse Voltage
0
1
2
3
4
5
0
2
4
6
8
10
12
14
Reverse Voltage---VR(V)
Diode Capacitance---CD(pF)
f=1MHz
Ta=25
Forward Current vs Ambient Temperature
0
25
50
75
100
125
0
25
50
75
100
125
150
Ambient Temperature---Ta()
Percentage of Peak Aver
age
Forward Current(%)
Mounting on glass epoxy PCBs
CYStech Electronics Corp.
Spec. No. : C332SY
Issued Date : 2004.04.16
Revised Date :
Page No. : 3/3
CASD355SY
CYStek Product Specification
SOD-323(1005) Dimension
*:Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.095 0.102 2.4 2.6 D 0.027 0.035 0.7 0.9
B 0.043 0.051 1.1 1.3 E
0.012(typ) 0.30(typ)
C 0.014(typ) 0.35(typ) F 0.014(typ) 0.35(typ)
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SOD-323(1005) Plastic
Surface Mounted Package
CYStek Package Code : SY
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