ChipFind - документация

Электронный компонент: BAR7504D

Скачать:  PDF   ZIP
FEATURES
MECHANICAL SPECIFICATION
!#"
$
%'&
(0)
1'2
354
6'7
859
@'A
B5C
DFE
G
H
I
P
Q
R
SUTV
WUXY
`'a
bdc
e'f
e5g
h'i
p0q
r's
t0u
v'w
v5x5y
'
55
55
'
05
'
50d
e'f
g0h5e
i'j
i5k5l
m'n
o5p5m
qr
q5s5t
uv
uxw'y
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
z{}|~
d{|}{0~
x}|x|
dx
{}|0
00
d|dx
~
dF0d~
~
Data Sheet No. BUDI-7500D-1A
75 AMP JUMBO DIODE CELL
R
0'
'505d555x '505505
DIOTEC ELECTRONICS CORP
U'''xF05xç
F
550ʣ˰'ϣF
ϣ
کݣ
0d
dߥ0dxx
dߧ0
dxx
xF0
U0d
}U'}dx
d0
dxU

Fx

0

"!$# %&'(
)
0
1
2
34
5 67 8@9BADC
EF7CGIHQP CR6TSUP CC
6VWYX
`a
bcHed f
VBRDg
6h7g
idYf
V6pEF7q6
d P r6Cf
crBABd6BGIADVsC
7tW
6BGg
A7G u
vxwTy
tdteBf
gBhi
jkll
mno
pqr
stsuvtwyx{zvxUu}|
zUx{~Uzpe@F
zQ
U~
x
e${v
BTYD
B
x
e$ @
D{ t
B FYD
BB
x
e$QFeYD
BB
tsvŤƦ
QU
Qtt
vpye
vUv
I
pF
{
p
x
F
FxxF
!!
"##
$%&&('0)123465789(@BACDEGFIHPQR(SBTUVWX`Ya(bc(d
K27
Die Size:
0.250" Diameter
Round die
e
f
gih
p
R
qr(s
tvuxw
y
yG
yt
rv
(
(
dveGe
fg(h
ikj
l
j
mnvoqpj
r
st
uwv
xy
zw{
R
PROPRIETARY
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
SOFT GLASS
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
|~}
`v
v}
~
Gw
G dvv~
~v(
v~
Gv~~wGGkkwGw
ww
G
k
¡á
6wáG~kwGwG~
dvv
G~wڡw~
wGk
v
6~
v~
ڡw
Gk
vGG~
kx
!#"%$
&
'(
')
01#23
465%487@9BA%CD4E1%F#GHA#IP3
IBQ
1%RTSATUWV5RTSQX3
Y`RQDYba1#ITAdcefYTQAEgh
ip#qr
s6t%svufwBxy
pB%xEffx#wBxy
Bxtyy
x%
uHHp#xBf
%r
TddP`
pB%x
e
f#g
h@ijlk
mno
p
q#r
sutwvyxBz8{
|
}
~u6
T
TX
`dB
#
T%TEP`
TT#T B%
#X
H%T%
T@
W
X
bB
T
#@d%
T`
%dǺ`
T
6%T`
%dP`
B%E`d#`۩bf