FEATURES
MECHANICAL SPECIFICATION
Case: Transfer molded plastic
Finish: All external surfaces are corrosion resistant
and the contact areas are readily solderable
Soldering Temperature: 250 C maximum
Mounting Position: Any
Polarity: Color band denotes cathode
Weight: 0.6 Ounces (1.8 Grams)
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MECHANICAL DATA
INCHES
MILLIMETERS
MIN
5.94
4.19
5.46
8.43
DIM
A
B
D
M
F
5 NOM
MAX
MAX
6.25
5.71
4.45
8.69
0.165
MIN
0.332
0.234
0.215
0.342
0.246
0.225
5 NOM
0.175
R
PROPRIETARY
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
SOFT GLASS
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Data Sheet No. BUDI-3500S-1A
K7
M
A
F
D
B
Color Ring
Denotes Cathode
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
Repetitive Peak Reverse Surge Current (Half wave, single phase,
60 Hz applied to rated load)
I
RSM
110
Non-repetitive Peak Reverse Voltage (Half wave, single phase,
60 Hz peak)
Average Forward Rectified Current @ T =150 C
C
o
I
O
35
Peak Forward Surge Current (8.3mS single half sine wave
superimposed on rated load)
AMPS
I
FSM
500
Maximum Forward Voltage Drop at 35 Amp DC
VOLTS
V
FM
1.1 (Typical 1.05)
1.15
Maximum Thermal Resistance, Junction to Case (Note 1)
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
I
RM
R
JC
C/W
A
@ T = 25 C
A
o
@ T = 100 C
A
o
1
50
0.9
Junction Operating and Storage Temperature Range
T
J
,T
STG
C
-65 to +175
BAR35s
V
RSM
60
120
240
480
1200
720
960
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
V
RWM
V
DC
V
RRM
SYMBOL
RATINGS
UNITS
VOLTS
BAR
BAR
BAR
BAR
BAR
BAR
BAR
50
100
200
400
1000
600
800
3500S 3501S 3502S 3504S 3506S 3508S 3510S
Notes: 1) Single Side Cooled
Die Size:
0.165" x 0.165"
Square
Compact molded design
High surge current, 600 A @ T = 175 C
Low cost
Peak performance at elevated temperatures: 35 A
J
o
@ T = 175 C
J
o
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
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