FEATURES
Data Sheet No. BSDB-5000-1B
MECHANICAL SPECIFICATION
MECHANICAL DATA
Case: Molded plastic, U/L Flammability Rating 94V-0
Terminals: Round silver plated pins
Soldering: Per MIL-STD 202 Method 208 guaranteed
Polarity: Marked on case
Mounting Position: Any. Bolt down on heatsink
Maximum mounting torque = 20 in. lb.
Weight: 0.6 Ounces (17 Grams)
E49
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive loads, derate current by 20%.
Typical Thermal Resistance, Junction to Case
MinimumInsulation Breakdown Voltage (Circuit to Case)
R
JC
C/W
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
I
RM
A
@ T = 25 C
A
o
@ T = 125 C
A
o
1
50
2500
1.10
Junction Operating and Storage Temperature Range
T T
J,
STG
C
-55 to +175
3.01 50sdb
SDB PACKAGE SHOWN ACTUAL SIZE
0.125 Nom
0.750
19.0
n/a
n/a
n/a
n/a
n/a
n/a
0.200 Typ
1.27 Typ
3.175 Nom
5.08 Typ
28.4
28.7
1.12
1.13
10.3
0.405
0.050 Typ
15.9
0.625
MILLIMETERS
INCHES
MIN
MIN
MAX
MAX
SYM
BL
BW
LD
LL
LM
LO
LS
Average Forward Rectified Current @ T = 55 C
C
o
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
I
O
V
RMS
V
RRM
V
RM
SYMBOL
SDB
SDB
RATINGS
UNITS
VOLTS
SDB
SDB
SDB
SDB
SDB
50
100
200
400
1000
35
70
140
280
700
50
Peak Forward Surge Current. Single 60Hz Half-Sine Wave
Superimposed on Rated Load (JEDEC Method). T = 175 C
J
O
Forward Voltage (Per Diode) at 25 Amps DC
VOLTS
VOLTS
AMPS
V
FM
I
FSM
600
1.00
600
800
50
100
200
400
1000
600
800
420
560
5000
5001
5002
5004
5006
5008
5010
Max.
Typ.
0.95
1.05
1.00
UL RECOGNIZED - FILE #E124962
HEAT
SINK
BL
BL
LL
LM
LS LS LS
BW
LO
+
-
AC
0.205 (5.2) Dia Through
Hole for #8 Screw
LD
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
V
ISO
BUILT-IN STRESS RELIEF MECHANISM FOR
SUPERIOR RELIABILITY AND PERFORMANCE
INTEGRALLY MOLDED HEAT SINK PROVIDES VERY
LOW THERMAL RESISTANCE FOR MAXIMUM HEAT
TRANSFER
SPACE SAVING IN-LINE DESIGN FOR PRINTED
CIRCUIT BOARD APPLICATIONS
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
RATING & CHARACTERISTIC CURVES FOR SERIES SDB5000 - SDB5010
Data Sheet No. BSDB-5000-2B
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
Number of Cycles at 60 Hz
50 AMP SILICON BRIDGE RECTIFIERS
3.01 50sdb
FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT
E50
FIGURE 1. FORWARD CURRENT DERATING CURVE
Case Temperature, C
o
Resistive and Inductive Loads
FIGURE 3. TYPICAL FORWARD CHARACTERISTIC PER DIODE
Instantaneous Forward Voltage (Volts)
0.1
1.0
10
100
1000
SDB5008-SDB5010
1
10
100
400
500
600
700
200
300
100
SDB5000-SDB5006
FIGURE 4. TYPICAL REVERSE CHARACTERISTICS
Percent of Rated Peak Reverse Voltage
.01
0.1
1.0
10
100
120
140
20
40
0
60
80
T = 125 C
J
O
T = 25 C
J
O
T = 25 C
J
o
Pulse Width = 300 S
1% Duty Cycle
T = 175 C
J
o
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