512 Megabit Synchronous DRAM
DPSD64MX8WKY5
DESCRIPTION:
The LP-StackTM series is a family of interchangeable memory modules. The 512 Megabit SDRAM is a member of this family which utilizes the new
and innovative space saving TSOP stacking technology. The modules are constructed with 32 Meg x 8 SDRAMs.
This 256 Megabit based LP-StackTM module, the DPSD64MX8WKY5 has
been designed to fit in the same footprint as the 32 Meg x 8 SDRAM TSOP
monolithic and 256 Megabit SDRAM based family of LP-StackTM modules.
This allows the memory board designer to upgrade the memory in their
products without redesigning the memory board, thus saving time and
money.
FEATURES:
Configuration Available:
64 Meg x 8 (2 Banks of 8M x 4 x 8 bits)
Clock Frequency:
66
[1]
, 83
[1]
, 100, 125
[2]
, 133
[2]
MHz (max.)
PC100 and PC133 Compatible
3.3V Supply
LVTTL Compatible I/O
Four Bank Operation
Programmable Burst Type, Burst Length,
and CAS Latency
8192 Cycles / 64 ms
Auto and Self Refresh
Package: TSOP Leadless Stack
NOTES:
[1] Available in Industrial Temperature Ranges Only
[2] Available in Commercial Temperature Range Only.
1
30A226-10
REV. B
PIN-OUT DIAGRAM
PIN NAMES
A0 - A12
Row Address:
A0 - A12
Column Address: A0 - A9, A11
BA0, BA1
Bank Select Address
DQ0 - DQ7
Data In / Data Out
CAS
Column Address Strobes
RAS
Row Address Enables
WE
Data Write Enable
DQM
Data Input/Output Mask
CKE
Clock Enable
CLK
System Clock
CS0-CS1
Chip Selects
V
CC
/V
SS
Power Supply/Ground
V
CCQ
/V
SSQ
Data Output Power/Ground
N.C.
No Connect
FUNCTIONAL BLOCK DIAGRAM
This document contains information on a product that is currently released to production at Dense-Pac Microsystems, Inc.
Dense-Pac reserves the right to change products or specifications herein without prior notice.
DPSD64MX8WKY5
Dense-Pac Microsystems, Inc.
NOTES:
[1] Available in Industrial Temperature Ranges Only, see note 4.
[3] Contact your sales representative for supplier and manufacturer codes.
[2] Available in Commercial Temperature Range Only.
[4] All industrial temperature range parts are subject to availability of screened components.
PART NUMBERING DESCRIPTION
2
30A226-10
REV. B
MECHANICAL DRAWING
.020 [.51]
.0315 [.80]
.0305 [.775]
TOP VIEW
SIDE VIEW
BOTTOM VIEW
END VIEW
PIN 1
INDEX
.502.008
.098 MAX.
.0335 [.85]
.885.010
.407 [10.34]
.397 [10.08]
.527 [13.39]
.517 [13.13]
.0315 [.80] BSC
.018 [.46]
Standard TSOP pad layout is acceptable, however, when possible,
the following pad layout is recommended for optimal manufacture and
inspection. See Application Note 53A001-00 for further information.
[12.75.20]
[22.48.25]
[2.49 MAX.]
.819 [20.80] BSC
.022 [.56]
7321 lincoln way, garden grove, california 92841-1431
(714) 898-0007
(800) 642-4477
fax: (714) 897-1772
http://www.dense-pac.com
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