MP04TT500
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FEATURES
s
Dual Device Module
s
Electrically Isolated Package
s
Pressure Contact Construction
s
International Standard Footprint
s
Alumina (Non Toxic) Isolation Medium
s
Integral Water Cooled Heatsink
APPLICATIONS
s
Motor Control
s
Controlled Rectifier Bridges
s
Heater Control
s
AC Phase Control
VOLTAGE RATINGS
ORDERING INFORMATION
Order As:
MP04TT500-XX-W2
1/4 - 18 NPT connection
MP04TT500-XX-W3
1/4 - 18 NPT connection
MP04TT500-XX-W3A
1/4 - 18 NPT water connection
thread
XX shown in the part number about represents V
DRM
/100
selection required, eg. MP04TT500-27-W2
Note: When ordering, please use the complete part number.
KEY PARAMETERS
V
DRM
2800V
I
T(AV)(per arm)
480A
I
TSM(per arm)
11200A
I
T(RMS)(per arm)
753A
V
isol
3000V
MP04TT500
Dual Thyristor Water Cooled Module
Advance Information
DS5446-1.2 May 2001
Fig. 1 TT Circuit diagram
Fig. 2 Module package variants - (not to scale)
Module outline type code: MP04-W2
(See Package Details for further information)
2800
2700
2600
2500
MP04TT500-28
MP04TT500-27
MP04TT500-26
MP04TT500-25
Conditions
T
vj
= 0 to 125C,
I
DRM
= I
RRM
= 50mA
V
DSM
= V
RSM
=
V
DRM
= V
RRM
+ 100V
respectively
Lower voltage grades available
Type Number
Repetitive Peak
Voltages
V
DRM
V
RRM
V
5 (G1)
6 (G2)
4 (K1)
7 (K2)
3 (A)
2 (A)
1 (AK)
Module outline type code:
MP04-W3
Module outline type code:
MP04-W3A
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Parameter
Mean on-state current
RMS value
Surge (non-repetitive) on-current
I
2
t for fusing
Surge (non-repetitive) on-current
I
2
t for fusing
Isolation voltage
Test Conditions
Half wave resistive load,
T
water (in)
= 25C
4.5 Ltr/min
T
water (in)
= 40C
T
water (in)
= 25C @ 4.5 Ltr/min
T
water (in)
= 40C @ 4.5 Ltr/min
10ms half sine, T
j
= 125C
V
R
= 0
10ms half sine, T
j
= 125C
V
R
= 50% V
DRM
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
Symbol
I
T(AV)
I
T(RMS
I
TSM
I
2
t
I
TSM
I
2
t
V
isol
Units
A
A
A
A
kA
A
2
s
kA
A
2
s
V
Max.
540
480
845
753
11.25
633 x 10
3
9
506 x 10
3
3000
Test Conditions
dc, 4.5 Ltr/min
Half wave, 4.5 Ltr/min
3 Phase, 4.5 Ltr/min
Reverse (blocking)
-
Mounting - M6
Electrical connections - M10
Parameter
Thermal resistance - junction to water
(per thyristor)
Virtual junction temperature
Storage temperature range
Screw torque
THERMAL AND MECHANICAL RATINGS
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
R
th(j-w)
T
vj
T
stg
-
Units
C/kW
C/kW
C/kW
C
C
Nm (lb.ins)
Nm (lb.ins)
Max.
0.102
0.106
0.112
125
125
-
12 (106)
Min.
-
-
-
-
40
6 (53)
-
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Units
mA
V/
s
A/
s
V
m
Test Conditions
t V
RRM
/V
DRM
, T
j
= 125C
To 67% V
DRM
, T
j
= 125C
From 67% V
DRM
to 500A, gate source 10V, 5
t
r
= 0.5
s, T
j
= 125C
At T
vj
= 125C
At T
vj
= 125C
Parameter
Peak reverse and off-state current
Linear rate of rise of off-state voltage
Rate of rise of on-state current
Threshold voltage. (See note 1)
On-state slope resistance. (See note 1)
DYNAMIC CHARACTERISTICS
Symbol
I
RRM
/I
DRM
dV/dt
dI/dt
V
T(TO)
r
T
Max.
50
1000
500
0.91
0.65
Min.
-
-
-
-
-
Parameter
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
Mean gate power
Test Conditions
V
DRM
= 5V, T
case
= 25
o
C
V
DRM
= 5V, T
case
= 25
o
C
At V
DRM
T
case
= 125
o
C
Anode positive with respect to cathode
Anode negative with respect to cathode
-
Anode positive with respect to cathode
See table fig. 5
-
Symbol
V
GT
I
GT
V
GD
V
FGM
V
FGN
V
RGM
I
FGM
P
GM
P
G(AV)
GATE TRIGGER CHARACTERISTICS AND RATINGS
Max.
3.5
200
0.25
30
0.25
5
10
150
10
Units
V
mA
V
V
V
V
A
W
W
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
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20
15
10
5
0
Peak half sine wave on-state current - (kA)
1
10
1
2
3 4 5
50
ms
Cycles at 50Hz
Duration
250
300
I
2
t value - (A
2
s x 10
3
)
I
2
t
I
2
t =
2
x t
2
350
25
400
10
20 30
Fig. 6 Transient thermal impedance - dc
Fig. 3 Maximum (limit) on-state characteristics
Fig. 4 Surge (non-repetitive) on-state current vs time
(with 50% V
RSM
at T
case
= 125C)
Fig. 5 Gate characteristics
0.5
1.0
1.5
2.0
2.5
Instantaneous on-state voltage, V
T
- (V)
0
500
1000
1500
2000
2500
Instantaneous on-state current, I
T
- (A)
1
2
1: T
j
= 125C Min
2: T
j
= 125C Max
Measured under pulse
conditions
10
1
0.1
0.01
0.001
Gate trigger current, I
GT
- (A)
100
10
1
0.1
Gate trigger voltage V
GT
- (V)
Region of certain
triggering
Upper limit 99%
Lower limit 99%
T
j
= 125
C
T
j
= 25
C
T
j
= -40
C
V
GD
I
FGM
Table gives pulse power P
GM
in Watts
Pulse width
s
100
200
500
1ms
10ms
Frequency Hz
50
150
150
150
150
20
100
150
150
150
100
-
400
150
125
100
25
-
100W
50W
20W
10W
5W
0
0.02
0.04
0.06
0.08
0.1
0.12
0.001
0.01
0.1
1
10
100
1000
Time (Seconds)
Thermal resistance, Junction to water, R
th(j-w)
- (
C/W)
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Fig. 7 On-state power loss per arm vs on-state current at
specified conduction angles, sine wave 50/60Hz
Fig. 8 On-state power loss per arm vs on-state current at
specified conduction angles, square wave 50/60Hz
Fig. 9 Maximum permissible water inlet temperature vs on-
state current at specified conduction angles,
sine wave 50/60Hz
Fig. 10 Maximum permissible water inlet temperature vs on-
state current at specified conduction angles,
square wave 50/60Hz
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
0
100
200
300
400
500
600
700
800
900 1000
Sine wave current (Average, per arm)
Power dissipation (Watts, per arm)
30
60
90
120
180
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
0
200
400
600
800
1000
1200
1400
Square wave current (Average, per arm)
Power dissipation (Watts, per arm)
30
60
90
120
180
DC
0
10
20
30
40
50
60
70
80
90
100
0
100
200
300
400
500
600
Sine wave current (Average, per arm)
Maximum permissble inlet water temperature - (
C)
30
60
90
120
180
0
10
20
30
40
50
60
70
80
90
100
0
100
200
300
400
500
600
700
800
Square wave current (Average, per arm)
Maximum permissible water inlet temperature - (
C)
30
60
90
120
180
DC
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Fig. 11 50/60Hz single phase bridge DC output current vs
power loss and maximum permissible water inlet
Fig. 12 50/60Hz three phase bridge DC output current vs
power loss and maximum permissible water inlet
0
500
1000
1500
2000
2500
3000
3500
4000
400
500
600
700
800
900
1000 1100 1200
DC bridge output current - (A)
Total device power loss - (W)
Power resistive load
Power inductive load
Temp resistive load
Temp inductive load
20
10
30
40
50
60
70
80
90
Max permissible water inlet temp. - (
C)
0
1000
2000
3000
4000
5000
6000
600
700
800
900 1000 1100 1200 1300 1400 1500
DC bridge output current - (A)
Total device power loss - (W)
Power resistive or inductive load
Temp resistive or inductive load
10
0
20
30
40
50
60
70
80
90
Max permissible water inlet temp. - (
C)
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PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W2
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PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3
MP04TT500
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PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2530g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3A
MP04TT500
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POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.
An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
Dynex Semiconductor 2001 Publication No. DS5446-1 Issue No. 1.2 May 2001
TECHNICAL DOCUMENTATION NOT FOR RESALE. PRINTED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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