SV15..F
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APPLICATIONS
s
Induction Heating
s
A.C. Motor Drives
s
Snubber Diode
s
Welding
s
High Frequency Rectification
s
UPS
FEATURES
s
Thermal Fatigue Free Pressure Contact
s
High Surge Capability
s
Low Recovery Charge
VOLTAGE RATINGS
KEY PARAMETERS
V
RRM
1600V
I
F(AV)
205A
I
FSM
3000A
Q
r
35
C
t
rr
3.2
s
1600
1400
1200
1000
800
600
SV15 16F M or K
SV15 14F M or K
SV15 12F M or K
SV15 10F M or K
SV15 08F M or K
SV15 06F M or K
Conditions
V
RSM
= V
RRM
+ 100V
For 1/2" 20 UNF thread, add suffix K, e.g. SV15 16FK.
For M12 thread, add suffix M, e.g. SV15 16FM.
For stud anode add 'R' to type number, e.g. SV15 16FMR.
For outline DO8C add suffix 'C' to typ number,
e.g. SV15 16FKC.
Type Number
Repetitive Peak
Reverse Voltage
V
RRM
V
Outline type codes: DO8 and DO8C.
See Package Details for further information.
CURRENT RATINGS
Symbol
Parameter
Conditions
Units
Max.
I
F(AV)
Mean forward current
I
F(RMS)
RMS value
Half wave resistive load, T
case
= 65
o
C
205
A
T
case
= 65
o
C
236
A
SV15..F
Fast Recovery Diode
Replaces March 1998 version, DS4209-2.2
DS4209-3.0 January 2000
SV15..F
2/7
SURGE RATINGS
Conditions
Max.
Units
3.0
kA
45 x 10
3
A
2
s
I
2
t for fusing
I
2
t
Surge (non-repetitive) forward current
I
FSM
Parameter
Symbol
10ms half sine; with 0% V
RRM,
T
j
= 150
o
C
-
kA
-
A
2
s
I
2
t for fusing
I
2
t
Surge (non-repetitive) forward current
I
FSM
10ms half sine; with 50% V
RRM,
T
j
= 150
o
C
THERMAL AND MECHANICAL DATA
dc
Conditions
Max.
Units
o
C/W
-
0.02
Thermal resistance - case to heatsink
R
th(c-h)
Thermal resistance - junction to case
R
th(j-c)
Mounting torque 15Nm
with mounting compound
Symbol
Parameter
-
0.23
o
C/W
Min.
t
rr
20
Symbol
Typ.
Units
Parameter
V
FM
Forward voltage
I
RRM
Peak reverse current
Reverse recovery time
Q
RA1
Recovered charge (50% chord)
I
RM
Reverse recovery current
K
Soft factor
V
TO
Threshold voltage
r
T
Slope resistance
V
FRM
Forward recovery voltage
di/dt = 1000A/
s, T
j
= 125
o
C
-
-
V
At T
vj
= 150
o
C
-
1.33
m
At T
vj
= 150
o
C
-
1.0
V
-
-
-
-
21
A
-
35
C
-
3.2
s
At V
RRM
, T
case
= 150
o
C
-
mA
At 450A peak, T
case
= 25
o
C
-
1.6
V
Conditions
Max.
I
F
= 450A, di
RR
/dt = 10A/
s
T
case
= 125
o
C, V
R
= 100V
CHARACTERISTICS
T
stg
Storage temperature range
-55
200
o
C
Nm
15.0
12.0
Mounting torque
-
T
vj
Virtual junction temperature
On-state (conducting)
-
150
o
C
SV15..F
3/7
DEFINITION OF K FACTOR AND Q
RA1
0.5x I
RR
I
RR
dI
R
/dt
t
1
t
2
Q
RA1
= 0.5x I
RR
(t
1
+ t
2
)
k = t
1
/t
2
CURVES
500
1000
1500
2000
2500
3000
Instantaneous forward current I
F
- (A)
1.0
2.0
3.0
4.0
5.0
Instantaneous forward voltage V
F
- (V)
Measured under pulse conditions
T
j
= 150C
T
j
= 25C
Fig.1 Maximum (limit) forward characteristics
SV15..F
4/7
1
10
100
1000
Rate of rise of reverse current dI
R
/dt - (A/
s)
100
10
1000
10000
Reverse recovered charge Q
S
- (
C)
I
RR
QS
t
p
= 1ms
I
F
dI
R
/dt
Q
S
=
Conditions:
T
j
= 150C,
V
R
= 100V
50
s
0
I
F
= 2000
I
F
= 1000
I
F
= 500
I
F
= 200
I
F
= 100
Fig.3 Recovered charge
0
100
200
300
400
500
Instantaneous forward current I
F
- (A)
1.0
1.2
1.4
1.6
1.8
Instantaneous forward voltage V
F
- (V)
Measured under pulse conditions
T
j
= 150C
T
j
= 25C
Fig.2 Maximum (limit) forward characteristics
SV15..F
5/7
1
10
100
1000
Rate of rise of reverse current dI
R
/dt - (A/
s)
10
100
1000
Reverse recovery current I
RR
- (A)
Conditions:
T
j
= 150C,
V
R
= 100V
I
F
= 2000A
I
F
= 1000A
I
F
= 500A
I
F
= 200A
I
F
= 100A
Fig.4 Typical reverse recovery current vs rate of rise of reverse current
100
10
1
0.1
0.01
Time - (s)
0.1
0.01
0.001
Thermal impedance - (
C/W)
d.c.
Fig.5 Maximum (limit) transient thermal impedance - junction to case - (C/W)
SV15..F
6/7
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Thread M12
1/2" 20 UNF
163
10
Type No + K - 20.6
0.6
Type No + M - 18.0
0.5
8 min
27 max
8 min
3.17 max
8.4
0.3
20 max
Nominal weight: 120g
Mounting torque: 15Nm
10%
Package outine type code: DO8
Nominal weight: 120g
Mounting torque: 15Nm
10%
Package outine type code: DO8C
Thread M12
1/2" 20 UNF
60 max
Type No + K - 20.6
0.6
Type No + M - 18.0
0.5
12
0.5
27 max
8 min
3.17 max
5.2
0.2
12
0.5
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Calculating the junction temperature or power semiconductors
AN4506
Thyristor and diode measurement with a multi-meter
AN4853
Use of V
TO
, r
T
on-state characteristic
AN5001
SV15..F
7/7
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has it's own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
Dynex Semiconductor 2000 Publication No. DS4209-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION NOT FOR RESALE. PRINTED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Suite 410, 99 Bank Street,
Ottawa, Ontario, Canada K1P 6B9.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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