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Электронный компонент: B37957J5225M062

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Data Sheet
Data Sheet
Multilayer ceramic capacitors
Date:
October 2006
EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the
information contained therein without EPCOS' prior express consent is prohibited.
Chip capacitors, Z5U (Y5U)
2
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Ordering code system
B37942
K
5
104
M
0
60
Packaging
60 cardboard tape, 180-mm reel
62 blister tape, 180-mm reel
70 cardboard tape, 330-mm reel
72 blister tape, 330-mm reel
01 bulk case
^
^
^
^
^
Internal coding
Capacitance tolerance
M
20% (standard)
^
Rated voltage
Rated voltage [VDC]
Code
25
50
0
5
Termination
K
nickel barrier for case sizes 0603, 0805, 1206, 1210
J
silver-palladium for case sizes 1812, 2220
^
^
Type and size
Chip size
(inch / mm)
0603 / 1608
0805 / 2012
1206 / 3216
1210 / 3225
1812 / 4532
2220 / 5750
Temperature characteristic
Z5U (Y5U)
B37932
B37942
B37873
B37951
B37954
B37957
Capacitance, coded
(example)
104
10 10
4
pF = 100 nF
105
10 10
5
pF =
1
mF
224
22 10
4
pF = 220 nF
^
^
^
Standard:
Chip
Z5U (Y5U)
Multilayer ceramic capacitors
3
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Features
Extremely high volumetric efficiency
Non-linear capacitance change
Y5U characteristic is also fulfilled
Applications
Blocking
Coupling
Decoupling
Interference suppression
Termination
For soldering: Nickel barrier termination (Ni) for case sizes 0603 to 1210
Silver-palladium termination (AgPd) for case sizes 1812 and 2220
Delivery mode
Cardboard and blister tape (blister tape for chip thickness
1.2 0.1 mm and case sizes 1210),
180-mm and 330-mm reel available
Bulk case for case sizes 0603 and 0805 (
68 nF)
Electrical data
Temperature characteristic
Z5U (Y5U)
1)
Max. relative capacitance change
within 30
C to +85 C
DC/C
+22/56
%
Climatic category (IEC 60068-1)
30/85/56
Standard
EIA
Dielectric
Class 2
Rated voltage
2)
V
R
25,
50
VDC
Test voltage
V
test
2.5 V
R
/5 s
VDC
Capacitance range
C
R
10 nF ... 4.7
mF
Dissipation factor (limit value)
tan
d
<50 10
3
Insulation resistance
3)
at +25
C
R
ins
>10
4
M
W
Time constant
3)
at +25
C
t >500
s
Operating temperature range
T
op
30 ... +85
C
Ageing
4)
yes
1) Y5U specification is also fulfilled.
2) Note: No operation on AC line.
3) For C
R
>10 nF the time constant
t = C R
ins
is given.
4) Refer to chapter "General technical information", "Ageing".
Chip
Z5U (Y5U)
Multilayer ceramic capacitors
4
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Z5U
(Y5U)
Multilayer ceramic capacitors
Capacitance tolerances
Dimensional drawing
Dimensions (mm)
Tolerances to CECC 32101-801
Code letter
M
(standard)
Tolerance
20%
Case size
(inch)
(mm)
0603
1608
0805
2012
1206
3216
1210
3225
l 1.6
0.15
2.00
0.20
3.2
0.20
3.2
0.30
b 0.8
0.10
1.25
0.15
1.6
0.15
2.5
0.30
s 0.8
0.10
1.30 max.
1.30 max.
1.30 max.
k
0.1 0.4
0.13 0.75
0.25 0.75
0.25 0.75
Case size
(inch)
(mm)
1812
4532
2220
5750
l 4.5
0.30
5.7
0.40
b 3.2
0.30
5.0
0.40
s
1.30 max.
1.30 max.
k
0.25 1.0
0.25 1.0
KKE0329-N
k
s
b
k
Z5U (Y5U)
5
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer ceramic capacitors
Z5U
(Y5U)
Recommended solder pad
Recommended dimensions (mm) for reflow soldering
Termination
Case size
(inch/mm)
Type
A
C
D
0603/1608
single chip
0.6 ... 0.7
1.8 ... 2.20
0.6 ... 0.8
0805/2012
single chip
0.6 ... 0.7
2.2 ... 2.60
0.8 ... 1.1
1206/3216
single chip
0.8 ... 0.9
3.8 ... 4.32
1.0 ... 1.4
1210/3225
single chip
1.0 ... 1.2
4.0 ... 4.80
1.8 ... 2.3
1812/4532
single chip
1.2 ... 1.4
5.4 ... 6.30
2.3 ... 3.0
2220/5750
single chip
1.4 ... 1.6
6.8 ... 7.80
3.5 ... 4.8
KKE0308-1
D
A
C
External electrode
Intermediate electrode
Substrate electrode
KKE0484-W
Ni
Sn
Ag
Inner electrode
AgPd
Termination
(nickel barrier)
Ceramic body
Z5U (Y5U)
6
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Z5U
(Y5U)
Multilayer ceramic capacitors
Product range chip capacitors, Z5U (Y5U)
Size
1)
inch
mm
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
2220
5750
Type
B37932
B37942
B37873
B37951
B37954
B37957
25
50
25
50
25
50
50
50
50
10 nF
15 nF
22 nF
33 nF
47 nF
68 nF
100 nF
150 nF
220 nF
330 nF
470 nF
680 nF
1.0
mF
1.5
mF
2.2
mF
3.3
mF
4.7
mF
1) l
b (inch) / l b (mm)
V
R
(VDC)
C
R
Z5U (Y5U)
7
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer ceramic capacitors
Z5U
(Y5U)
Ordering codes and packing for Z5U (Y5U), 25 VDC, nickel barrier terminations
Chip
thickness
Cardboard tape,
180-mm reel
Cardboard tape,
330-mm reel
Bulk case
**
60
**
70
**
01
C
R
Ordering code
mm
pcs/reel
pcs/reel
pcs
Case size 0603, 25 VDC
100
.
nF
B37932K0104M0**
0.8
0.1
4000
16000
15000
Case size 0805, 25 VDC
150
.
nF
B37942K0154M0**
0.8
0.1
4000
16000
220
.
nF
B37942K0224M0**
0.8
0.1
4000
16000
Case size 1206, 25 VDC
1.0
mF
B37873K0105M0**
1.2
0.1
3000
1)
12000
2)
Ordering codes and packing for Z5U (Y5U), 50 VDC, nickel barrier terminations
Chip
thickness
Cardboard tape,
180-mm reel
Cardboard tape,
330-mm reel
Bulk case
**
60
**
70
**
01
C
R
Ordering code
mm
pcs/reel
pcs/reel
pcs
Case size 0603, 50 VDC
10
.
nF
B37932K5103M0**
0.8
0.1
4000
16000
15000
22
.
nF
B37932K5223M0**
0.8
0.1
4000
16000
15000
47
.
nF
B37932K5473M0**
0.8
0.1
4000
16000
15000
Case size 0805, 50 VDC
10
.
nF
B37942K5103M0**
0.6
0.1
5000
20000
10000
22
.
nF
B37942K5223M0**
0.6
0.1
5000
20000
10000
47
.
nF
B37942K5473M0**
0.6
0.1
5000
20000
10000
100
.
nF
B37942K5104M0**
0.8
0.1
4000
16000
Case size 1206, 50 VDC
100
.
nF
B37873K5104M0**
0.8
0.1
4000
16000
220
.
nF
B37873K5224M0**
0.8
0.1
4000
16000
470
.
nF
B37873K5474M0**
1.2
0.1
3000
1)
12000
2)
Case size 1210, 50 VDC
470
.
nF
B37951K5474M0**
0.8
0.1
4000
1)
16000
2)
1.0
mF
B37951K5105M0**
1.2
0.1
3000
1)
12000
2)
^
^
^
1) Blister tape, 180-mm reel, ordering code ** 62
2) Blister tape, 330-mm reel, ordering code ** 72
^
^
^
^
^
Z5U (Y5U); 0603 to 1210
8
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Z5U
(Y5U)
Multilayer ceramic capacitors
Ordering codes and packing for Z5U (Y5U), 50 VDC, silver-palladium terminations
Chip
thickness
Blister tape,
180-mm reel
Blister tape,
330-mm reel
**
62
**
72
C
R
Ordering code
mm
pcs/reel
pcs/reel
Case size 1812, 50 VDC
680
.
nF
B37954J5684M0**
1.2
0.1
1500
5000
1.0
mF
B37954J5105M0**
1.2
0.1
1500
5000
1.5
mF
B37954J5155M0**
1.2
0.1
1500
5000
Case size 2220, 50 VDC
1.0
mF
B37957J5105M0**
1.2
0.1
1500
5000
2.2
mF
B37957J5225M0**
1.2
0.1
1500
5000
4.7
mF
B37957J5475M0**
1.2
0.1
1500
5000
^
^
Z5U (Y5U); 1812 and 2220
9
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer ceramic capacitors
Z5U
(Y5U)
Typical characteristics
Capacitance change
DC/C
25
versus
temperature T
Capacitance change
DC/C
0
versus
superimposed DC voltage V
Impedance |Z| versus
frequency f
Dissipation factor tan
d versus
temperature T
KKE0200-Y
0
20 40 60 80 100
140
T
C
C
25
0
10
%
20
_
_
40
60
_
80
_
70
_
60
_
50
_
40
_
30
_
20
_
10
_
C
KKE0201-7
0
C
V
o
C
0
10
%
10
20
30
40
50
V
_
80
70
_
60
_
50
_
40
_
30
_
20
_
10
_
KKE0128-3
MHz
10
0
10
1
10
2
10
3
Z
f
10
_
2
10
_
1
10
0
1
10
2
10
10 nF
100 nF
1 F
KKE0122-N
T
60
_
tan
40
_
20
_
0
20 40 60 80 100
140
2
10
_
10
_
3
10
1
_
C
Z5U (Y5U)
10
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Z5U
(Y5U)
Multilayer ceramic capacitors
Typical characteristics
Insulation resistance R
ins
versus
temperature T
Capacitance change
DC/C
1
versus
time t
KKE0131-M
R
T
2
10
ins
0
20
40
60
80
100
140
10
3
10
4
10
5
10
6
10
8
M
C
KKE0104-Q
t
%
h
10
0
20
_
10
1
10
2
10
3
C
C
1
15
_
10
_
5
_
0
5
Z5U (Y5U)
11
10/06
Multilayer ceramic capacitors
Cautions and warnings
Notes on the selection of ceramic capacitors
In the selection of ceramic capacitors, the following criteria must be considered:
1. Depending on the application, ceramic capacitors used to meet high quality requirements should
at least satisfy the specifications to AEC-Q200. They must meet quality requirements going
beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of
critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS
and airbag equipment or durable industrial goods).
2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at
positions with stranding potential, to reduce the probability of short circuits following a fracture,
two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated
series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single
component.
3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the require-
ments to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R
ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these
capacitors should not be used as discrete components (see the chapter "Effects on mechanical,
thermal and electrical stress", point 1.4).
4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the
chapter "Effects on mechanical, thermal and electrical stress", point 1.4).
5. An application-specific derating or continuous operating voltage must be considered in order to
cushion (unexpected) additional stresses (see the chapter "Reliability").
The following should be considered in circuit board design
1. If technically feasible in the application, preference should be given to components having an
optimal geometrical design.
2. At least FR4 circuit board material should be used.
3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed.
4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the
circuit board. High bending forces may be exerted there when the panels are separated and dur-
ing further processing of the board (such as when incorporating it into a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit
board.
6. No screw connections should be used to fix the board or to connect several boards. Compo-
nents should not be placed near screw holes. If screw connections are unavoidable, they must
be cushioned (for instance by rubber pads).
12
10/06
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter "Soldering directions").
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
13
10/06
Multilayer ceramic capacitors
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of passive electronic components
or failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified.
In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of a passive electronic component could endanger human life or health
(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of
suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third
parties in the event of malfunction or failure of a passive electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as "hazardous")
. Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the "General Terms of Delivery for Products and Services in the Electrical Industry"
published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap,
PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.