REVISIONS
LTR DESCRIPTION
DATE
(YR-MO-DA)
APPROVED
A
Changes in accordance with N.O.R. 5962-R062-94.
93-12-06
M. A. FRYE
B
Redrawn. Add case outline X. Technical and editorial changes throughout.
95-03-24
M. A. FRYE
C
Drawing updated to reflect current requirements. - ro
01-10-02
R. MONNIN
REV
SHEET
REV
SHEET
REV
STATUS
REV
C C C C C C C C C C C C C
OF
SHEETS
SHEET
1 2 3 4 5 6 7 8 9 10
11
12
13
PMIC N/A
PREPARED BY
DAN WONNELL
DEFENSE SUPPLY CENTER COLUMBUS
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
SANDRA ROONEY
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, ANALOG SWITCH,
MONOLITHIC SILICON
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
93-05-06
AMSC N/A
REVISION LEVEL
C
SIZE
A
CAGE CODE
67268
5962-90737
SHEET
1 OF
13
DSCC FORM 2233
APR
97
5962-E640-01
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-90737
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
C
SHEET
2
DSCC FORM 2234
APR 97
1.
SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
90737
01
M
P
X
Federal
stock class
designator
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\ /
(see
1.2.3)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic
number Circuit
function
01
DG417A
CMOS, SPST analog switch
02
DG418A
CMOS, SPST analog switch
03
DG419A
CMOS, SPST analog switch
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive
designator Terminals Package
style
H
GDFP1-F10 or CDFP2-F10
10
Flat pack
P
GDIP1-T8 or CDIP2-T8
8
Dual-in-line
X CDFP3-F10
10
Flat
pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-90737
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
C
SHEET
3
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
Supply voltage between V+ and V- ........................................ 44 V dc
Supply voltage between GND and V-..................................... 25 V dc
Digital
inputs
range
to V- ....................................................... (GND -0.3 V dc) to 44 V dc 2/
Digital input range V
S
, V
D
to V- ............................................ (V-) -2 V dc to (V+) +2 V dc
or 30 mA, whichever occurs first 2/
Current (any terminal except for S and D) continuous ........... 30 mA
Current (S or D) pulsed, 1 ms, 10% duty cycle ...................... 100 mA
Power
dissipation
(P
D
):
Cases H and X, at +70
C .................................................. 421 mW 3/
Case P at +75
C ............................................................... 600 mW 3/
Junction
temperature
(T
J
) ...................................................... +175
C
Lead
temperature
(soldering, 10 seconds ) ........................... +300
C
Storage
temperature range .................................................... -65
C to +150
C
Thermal resistance, junction-to-case (
JC
) ........................... See MIL-STD-1835
1.4 Recommended operating conditions.
Positive
supply
voltage (V+)................................................... +15 V dc
Negative supply voltage (V-) .................................................. -15 V dc
Logic supply voltage (V
L
) ....................................................... 5 V dc
Ambient operating temperature range (T
A
)............................ -55
C to +125
C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT
OF
DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT
OF
DEFENSE
MIL-STD-883 - Test
Method
Standard
Microcircuits.
MIL-STD-1835 - Interface
Standard
Electronic Component Case Outlines.
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation
at the maximum levels may degrade performance and affect reliability.
2/ Signals on S
X
, D
X
, or IN
X
exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to
the maximum current ratings.
3/ For case outlines H and X, derate above T
A
= +70
C linearly at 5.26 mW/
C. For case outline P, derate above
T
A
= +75
C linearly at 12 mW/
C.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-90737
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
C
SHEET
4
DSCC FORM 2234
APR 97
HANDBOOKS
DEPARTMENT
OF
DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard
Microcircuit
Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth tables. The truth tables shall be as specified on figure 2.
3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-90737
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
C
SHEET
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55
C
T
A
+125
C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Unit
Min
Max
Drain-source ON
resistance
r
DS(ON)
I
S
= -10 mA, V
D
=
12.5 V,
V
IN
= 0.8 V,
1 01
2.5
35
V+ = +13.5 V, V- = -13.5 V
2,3
2.5
45
I
S
= -10 mA, V
D
=
12.5 V,
V
IN
= 2.4 V,
1 02
2.5
35
V+ = +13.5 V, V- = -13.5 V
2,3
2.5
45
I
S
= -10 mA, 2/
V
D
=
12.5 V,
1 03
2.5
35
V
IN
= 0.8 V, 2.4 V,
V+ = +13.5 V, V- = -13.5 V
2,3
2.5
45
Source OFF leakage
current
I
S(OFF)
V
D
=
15.5 V,
V
S
=
15.5 V, V
IN
= 2.4 V,
1 01
0.25
nA
V+ = +16.5 V, V- = -16.5 V
2,3
20
V
D
=
15.5 V,
V
S
=
15.5 V, V
IN
= 0.8 V,
1 02
0.25
V+ = +16.5 V, V- = -16.5 V
2,3
20
V
D
=
15.5 V, 2/
V
S
=
15.5 V,
1 03
0.25
V
IN
= 0.8 V, 2.4 V,
V+ = +16.5 V, V- = -16.5 V
2,3
20
Drain OFF leakage
current
I
D(OFF)
V
D
=
15.5 V,
V
S
=
15.5 V, V
IN
= 2.4 V,
1 01
0.25
nA
V+ = +16.5 V, V- = -16.5 V
2,3
20
V
D
=
15.5 V,
V
S
=
15.5 V, V
IN
= 0.8 V,
1 02
0.25
V+ = +16.5 V, V- = -16.5 V
2,3
20
See footnotes at end of table.
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