1
Edition 1.1
July 1999
FLL57MK
L-Band Medium & High Power GaAs FET
Item
Drain-Source Voltage
Gate-Source Voltage
Total Power Dissipation
Storage Temperature
Channel Temperature
Symbol
VDS
VGS
15
-5
21.4
-65 to +175
175
Tc = 25C
V
V
W
C
C
PT
Tstg
Tch
Condition
Unit
Rating
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25C)
Fujitsu recommends the following conditions for the reliable operation of GaAs FETs:
1. The drain-source operating voltage (VDS) should not exceed 10 volts.
2. The forward and reverse gate currents should not exceed 32.2 and -2.2 mA respectively with
gate resistance of 100.
3. The operating channel temperature (Tch) should not exceed 145C.
Item
Saturated Drain Current
Transconductance
Pinch-off Voltage
Gate Source Breakdown Voltage
Power-added Efficiency
Output Power at 1dB G.C.P.
Power Gain at 1dB G.C.P.
Symbol
IDSS
-
1800
2700
-
1000
-
-1.0
-2.0
-3.5
-5
-
-
10.5
11.5
-
-
37
-
35.5
36.0
-
VDS = 5V, IDS = 90mA
VDS = 5V, IDS = 1100mA
VDS = 5V, VGS = 0V
IGS = -90A
Channel to Case
VDS = 10V
IDS = 0.55IDSS (Typ.),
f = 2.3GHz
mA
mS
V
dB
%
dBm
V
gm
Vp
VGSO
P1dB
G1dB
add
Thermal Resistance
-
6.2
7.0
C/W
Rth
Test Conditions
Unit
Limit
Typ.
Max.
Min.
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25C)
G.C.P.: Gain Compression Point
CASE STYLE: MK
FEATURES
High Output Power: P1dB = 36.0dBm (Typ.)
High Gain: G1dB = 11.5dB (Typ.)
High PAE: add = 37% (Typ.)
Proven Reliability
Hermetically Sealed Package
DESCRIPTION
The FLL57MK is a Power GaAs FET that is specifically designed to
provide high power at L-Band frequencies with gain, linearity and
efficiency superior to that of silicon devices. The performance in
multitone environments for Class AB operation make them ideally
suited for base station applications.
Fujitsu's stringent Quality Assurance Program assures the highest
reliability and consistent performance.
2
FLL57MK
L-Band Medium & High Power GaAs FET
POWER DERATING CURVE
DRAIN CURRENT vs. DRAIN-SOURCE VOLTAGE
10
5
20
25
15
0
50
100
150
200
2
0
4
6
8
10
Case Temperature (C)
Drain-Source Voltage (V)
Total Power Dissipation (W)
1000
500
2000
1500
Drain Current (mA)
VGS =0V
-0.5V
-1.5V
-2.0V
-1.0V
OUTPUT POWER vs. INPUT POWER
VDS=10V
IDS 0.55 IDSS
f = 2.3 GHz
18
20
22
24
26
28
Input Power (dBm)
36
34
32
30
28
26
30
40
50
60
20
10
Output Power (dBm)
add
Pout
add
(%)
4
For further information please contact:
FUJITSU COMPOUND SEMICONDUCTOR, INC.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
Phone: (408) 232-9500
FAX: (408) 428-9111
www.fcsi.fujitsu.com
FUJITSU MICROELECTRONICS, LTD.
Compound Semiconductor Division
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
Phone:+44 (0)1628 504800
FAX:+44 (0)1628 504888
Fujitsu Limited reserves the right to change products and specifications without notice.
The information does not convey any license under rights of Fujitsu Limited or others.
1998 FUJITSU COMPOUND SEMICONDUCTOR, INC.
Printed in U.S.A. FCSI0598M200
Fujitsu Compound Semiconductor Products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
CAUTION
Do not put these products into the mouth.
Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
FLL57MK
L-Band Medium & High Power GaAs FET
2-R 1.25
(0.049)
1.00.1
(0.039)
14.30.2
(0.563)
2.5 Min.
(0.098)
2.5 Min.
(0.098)
4.5 Max.
(0.177)
1.78
(0.073)
6.3
0.2
(0.25)
4.8
(0.188)
Case Style "MK"
Metal-Ceramic Hermetic Package
Unit: mm(inches)
1. Gate
2. Source (Flange)
3. Drain
0.1
(0.004)
2.280.2
(0.089)
1
3
2
17.50.2
(0.689)
8.9
(0.349)
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