2005 Fairchild Semiconductor Corporation
DS012002
www.fairchildsemi.com
February 1994
Revised May 2005
7
4LCX16373
Low
V
o
lt
ag
e 16-
Bit
T
r
ansp
arent
La
tch
wit
h
5V
T
o
ler
ant
In
put
s and
Outp
ut
s
74LCX16373
Low Voltage 16-Bit Transparent Latch
with 5V Tolerant Inputs and Outputs
General Description
The LCX16373 contains sixteen non-inverting latches with
3-STATE outputs and is intended for bus oriented applica-
tions. The device is byte controlled. The flip-flops appear
transparent to the data when the Latch Enable (LE) is
HIGH. When LE is LOW, the data that meets the setup time
is latched. Data appears on the bus when the Output
Enable (OE) is LOW. When OE is HIGH, the outputs are in
a high impedance state.
The LCX16373 is designed for low voltage (2.5V or 3.3V)
V
CC
applications with capability of interfacing to a 5V signal
environment.
The LCX16373 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s
5V tolerant inputs and outputs
s
2.3V3.6V V
CC
specifications provided
s
5.4 ns t
PD
max (V
CC
3.3V), 20
P
A I
CC
max
s
Power down high impedance inputs and outputs
s
Supports live insertion/withdrawal (Note 1)
s
r
24 mA output drive (V
CC
3.0V)
s
Uses patented noise/EMI reduction circuitry
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human body model
!
2000V
Machine model
!
200V
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Note 2: Ordering code "G" indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter "X" to the ordering code.
Logic Symbol
Order Number
Package Number
Package Description
74LCX16373G
(Note 2)(Note 3)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LCX16373MEA
(Note 3)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LCX16373MTD
(Note 3)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
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2
74LCX16373
Connection Diagrams
Pin Assignment for SSOP and TSSOP
Pin Assignment for FBGA
(Top Thru View)
Pin Descriptions
FBGA Pin Assignments
Truth Tables
H
HIGH Voltage Level
L
LOW Voltage Level
X
Immaterial
Z
High Impedance
O
0
Previous O
0
before HIGH-to-LOW transition of Latch Enable
Pin Names
Description
OE
n
Output Enable Input (Active LOW)
LE
n
Latch Enable Input
I
0
I
15
Inputs
O
0
O
15
Outputs
NC
No Connect
1
2
3
4
5
6
A
O
0
NC
OE
1
LE
1
NC
I
0
B
O
2
O
1
NC
NC
I
1
I
2
C
O
4
O
3
V
CC
V
CC
I
3
I
4
D
O
6
O
5
GND
GND
I
5
I
6
E
O
8
O
7
GND
GND
I
7
I
8
F
O
10
O
9
GND
GND
I
9
I
10
G
O
12
O
11
V
CC
V
CC
I
11
I
12
H
O
14
O
13
NC
NC
I
13
I
14
J
O
15
NC
OE
2
LE
2
NC
I
15
Inputs
Outputs
LE
1
OE
1
I
0
I
7
O
0
O
7
X
H
X
Z
H
L
L
L
H
L
H
H
L
L
X
O
0
Inputs
Outputs
LE
2
OE
2
I
8
I
15
O
8
O
15
X
H
X
Z
H
L
L
L
H
L
H
H
L
L
X
O
0
3
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7
4LCX16373
Functional Description
The LCX16373 contains sixteen D-type latches with
3-STATE standard outputs. The device is byte controlled
with each byte functioning identically, but independent of
the other. Control pins can be shorted together to obtain full
16-bit operation. The following description applies to each
byte. When the Latch Enable (LE
n
) input is HIGH, data on
the I
n
enters the latches. In this condition the latches are
transparent, i.e. a latch output will change state each time
its I input changes. When LE
n
is LOW, the latches store
information that was present on the I inputs a setup time
preceding the HIGH-to-LOW transition of LE
n
. The
3-STATE standard outputs are controlled by the Output
Enable (OE
n
) input. When OE
n
is LOW, the standard out-
puts are in the 2-state mode. When OE
n
is HIGH, the stan-
dard outputs are in the high impedance mode but this does
not interfere with entering new data into the latches.
Logic Diagrams
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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4
74LCX16373
Absolute Maximum Ratings
(Note 4)
Recommended Operating Conditions
(Note 6)
Note 4: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The "Recom-
mended Operating Conditions" table will define the conditions for actual device operation.
Note 5: I
O
Absolute Maximum Rating must be observed.
Note 6: Unused inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Symbol
Parameter
Value
Conditions
Units
V
CC
Supply Voltage
0.5 to
7.0
V
V
I
DC Input Voltage
0.5 to
7.0
V
V
O
DC Output Voltage
0.5 to
7.0
Output in 3-STATE
V
0.5 to V
CC
0.5
Output in HIGH or LOW State (Note 5)
I
IK
DC Input Diode Current
50
V
I
GND
mA
I
OK
DC Output Diode Current
50
V
O
GND
mA
50
V
O
!
V
CC
I
O
DC Output Source/Sink Current
r
50
mA
I
CC
DC Supply Current per Supply Pin
r
100
mA
I
GND
DC Ground Current per Ground Pin
r
100
mA
T
STG
Storage Temperature
65 to
150
q
C
Symbol
Parameter
Min
Max
Units
V
CC
Supply Voltage
Operating
2.0
3.6
V
Data Retention
1.5
3.6
V
I
Input Voltage
0
5.5
V
V
O
Output Voltage
HIGH or LOW State
0
V
CC
V
3-STATE
0
5.5
I
OH
/I
OL
Output Current
V
CC
3.0V
3.6V
r
24
mA
V
CC
2.7V
3.0V
r
12
V
CC
2.3V
2.7V
r
8
T
A
Free-Air Operating Temperature
40
85
q
C
'
t/
'
V
Input Edge Rate, V
IN
0.8V2.0V, V
CC
3.0V
0
10
ns/V
Symbol
Parameter
Conditions
V
CC
T
A
40
q
C to
85
q
C
Units
(V)
Min
Max
V
IH
HIGH Level Input Voltage
2.3
2.7
1.7
V
2.7
3.6
2.0
V
IL
LOW Level Input Voltage
2.3
2.7
0.7
V
2.7
3.6
0.8
V
OH
HIGH Level Output Voltage
I
OH
100
P
A
2.3
3.6
V
CC
0.2
V
I
OH
8 mA
2.3
1.8
I
OH
12 mA
2.7
2.2
I
OH
18 mA
3.0
2.4
I
OH
24 mA
3.0
2.2
V
OL
LOW Level Output Voltage
I
OL
100
P
A
2.3
3.6
0.2
V
I
OL
8 mA
2.3
0.6
I
OL
12 mA
2.7
0.4
I
OL
16 mA
3.0
0.4
I
OL
24 mA
3.0
0.55
I
I
Input Leakage Current
0
d
V
I
d
5.5V
2.3
3.6
r
5.0
P
A
I
OZ
3-STATE Output Leakage
0
d
V
O
d
5.5V
2.3
3.6
r
5.0
P
A
V
I
V
IH
or V
IL
I
OFF
Power-Off Leakage Current
V
I
or V
O
5.5V
0
10
P
A
5
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7
4LCX16373
DC Electrical Characteristics
(Continued)
Note 7: Outputs disabled or 3-STATE only.
AC Electrical Characteristics
Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t
OSHL
) or LOW-to-HIGH (t
OSLH
). Parameter guaranteed by design.
Dynamic Switching Characteristics
Capacitance
Symbol
Parameter
Conditions
V
CC
T
A
40
q
C to
85
q
C
Units
(V)
Min
Max
I
CC
Quiescent Supply Current
V
I
V
CC
or GND
2.3
3.6
20
P
A
3.6V
d
V
I
, V
O
d
5.5V (Note 7)
2.3
3.6
r
20
'
I
CC
Increase in I
CC
per Input
V
IH
V
CC
0.6V
2.3
3.6
500
P
A
Symbol
Parameter
T
A
40
q
C to
85
q
C, R
L
500
:
Units
V
CC
3.3V
r
0.3V
V
CC
2.7V
V
CC
2.5V
r
0.2V
C
L
50 pF
C
L
50 pF
C
L
30 pF
Min
Max
Min
Max
Min
Max
t
PHL
Propagation Delay
1.5
5.4
1.5
5.9
1.5
6.5
ns
t
PLH
I
n
to O
n
1.5
5.4
1.5
5.9
1.5
6.5
t
PHL
Propagation Delay
1.5
5.5
1.5
6.4
1.5
6.6
ns
t
PLH
LE to O
n
1.5
5.5
1.5
6.4
1.5
6.6
t
PZL
Output Enable Time
1.5
6.1
1.5
6.5
1.5
7.9
ns
t
PZH
1.5
6.1
1.5
6.5
1.5
7.9
t
PLZ
Output Disable Time
1.5
6.0
1.5
6.3
1.5
7.2
ns
t
PHZ
1.5
6.0
1.5
6.3
1.5
7.2
t
S
Setup Time, I
n
to LE
2.5
2.5
3.0
ns
t
H
Hold Time, I
n
to LE
1.5
1.5
2.0
ns
t
W
LE Pulse Width
3.0
3.0
3.5
ns
t
OSHL
Output to Output Skew (Note 8)
1.0
ns
t
OSLH
1.0
Symbol
Parameter
Conditions
V
CC
T
A
25
q
C
Units
(V)
Typical
V
OLP
Quiet Output Dynamic Peak V
OL
C
L
50 pF, V
IH
3.3V, V
IL
0V
3.3
0.8
V
C
L
30 pF, V
IH
2.5V, V
IL
0V
2.5
0.6
V
OLV
Quiet Output Dynamic Valley V
OL
C
L
50 pF, V
IH
3.3V, V
IL
0V
3.3
0.8
V
C
L
30 pF, V
IH
2.5V, V
IL
0V
2.5
0.6
Symbol
Parameter
Conditions
Typical
Units
C
IN
Input Capacitance
V
CC
Open, V
I
0V or V
CC
7
pF
C
OUT
Output Capacitance
V
CC
3.3V, V
I
0V or V
CC
8
pF
C
PD
Power Dissipation Capacitance
V
CC
3.3V, V
I
0V or V
CC
, f
10 MHz
20
pF
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6
74LCX16373
AC LOADING and WAVEFORMS
Generic for LCX Family
FIGURE 1. AC Test Circuit (C
L
includes probe and jig capacitance)
Waveform for Inverting and Non-Inverting Functions
Propagation Delay. Pulse Width and t
rec
Waveforms
3-STATE Output Low Enable and
Disable Times for Logic
3-STATE Output High Enable and
Disable Times for Logic
Setup Time, Hold Time and Recovery Time for Logic
t
rise
and t
fall
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, t
r
= t
f
= 3ns)
Test
Switch
t
PLH
, t
PHL
Open
t
PZL
, t
PLZ
6V at V
CC
3.3
r
0.3V, and 2.7V
V
CC
x 2 at V
CC
2.5
r
0.2V
t
PZH
, t
PHZ
GND
Symbol
V
CC
3.3V
r
0.3V
2.7V
2.5V
r
0.2V
V
mi
1.5V
1.5V
V
CC
/2
V
mo
1.5V
1.5V
V
CC
/2
V
x
V
OL
0.3V
V
OL
0.3V
V
OL
0.15V
V
y
V
OH
0.3V
V
OH
0.3V
V
OH
0.15V
7
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7
4LCX16373
Schematic Diagram
Generic for LCX Family
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8
74LCX16373
Physical Dimensions
inches (millimeters) unless otherwise noted
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
Package Number BGA54A
9
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7
4LCX16373
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
Package Number MS48A
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10
74L
C
X
16
373
Low V
o
lt
age 16-
Bit
T
r
ansp
arent
Lat
ch w
i
th 5V T
o
l
e
r
ant Input
s
and Output
s
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD48
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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