December 2002
2002 Fairchild Semiconductor Corporation
FDD6696/FDU6696 Rev D (W)
FDD6696/FDU6696
30V N-Channel PowerTrench
MOSFET
General Description
This N-Channel MOSFET has been designed
specifically to improve the overall efficiency of DC/DC
converters using either synchronous or conventional
switching PWM controllers. It has been optimized for
low gate charge, low R
DS( ON)
and fast switching speed.
Applications
DC/DC converter
Motor drives
Features
50A, 30 V
R
DS(ON)
= 8.0 m
@ V
GS
= 10 V
R
DS(ON)
= 10.7 m
@ V
GS
= 4.5 V
Low gate charge (17nC typical)
Fast switching
High performance trench technology for extremely
low R
DS(ON)
G
S
D
TO-252
D-PAK
(TO-252)
G D S
I-PAK
(TO-251AA)
S
G
D
Absolute Maximum Ratings
T
A
=25
o
C unless otherwise noted
Symbol
Parameter
Ratings
Unit
s
V
DSS
Drain-Source Voltage
30
V
V
GSS
Gate-Source Voltage
16
I
D
Continuous Drain Current @T
C
=25C
(Note 3)
50
A
@T
A
=25C
(Note 1a)
13
Pulsed
(Note 1a)
100
Power Dissipation
@T
C
=25C
(Note 3)
52
@T
A
=25C
(Note 1a)
3.8
P
D
@T
A
=25C
(Note 1b)
1.6
W
T
J
, T
STG
Operating and Storage Junction Temperature Range
55 to +175
C
Thermal Characteristics
R
JC
Thermal Resistance, Junction-to-Case
(Note 1)
2.9
C/W
R
JA
Thermal Resistance, Junction-to-Ambient
(Note 1a)
40
Thermal Resistance, Junction-to-Ambient
(Note 1b)
96
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape width
Quantity
FDD6696
FDD6696
D-PAK (TO-252)
13''
12mm
2500 units
FDU6696
FDU6696
I-PAK (TO-251)
Tube
N/A
75
FDD6696/FDU6696
FDD6696/FDU6696 Rev. D (W)
D
R
P
DS(ON)
Electrical Characteristics
T
A
= 25C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Unit
s
Drain-Source Avalanche Ratings
(Note 2)
E
AS
Drain-Source Avalanche Energy
Single Pulse, V
DD
= 15 V, I
D
=13A
165
mJ
I
AS
Drain-Source Avalanche Current
13
A
Off Characteristics
BV
DSS
DrainSource Breakdown
Voltage
V
GS
= 0 V,
I
D
= 250
A
30
V
BV
DSS
T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250
A, Referenced to 25
C
23
mV/
C
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 24 V,
V
GS
= 0 V
10
A
I
GSSF
GateBody Leakage
V
GS
=
16 V,
V
DS
= 0 V
100
nA
On Characteristics
(Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
,
I
D
= 250
A
1
2
3
V
V
GS(th)
T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= 250
A, Referenced to 25
C
5
mV/
C
R
DS(on)
Static DrainSource
OnResistance
V
GS
= 10 V,
I
D
= 13 A
V
GS
= 4.5 V,
I
D
= 12 A
V
GS
= 10 V, I
D
= 13 A, T
J
=125
C
6.7
8.6
10.2
8.0
10.7
15.0
m
g
FS
Forward Transconductance
V
DS
= 5 V,
I
D
= 13 A
51
S
Dynamic Characteristics
C
iss
Input Capacitance
1715
pF
C
oss
Output Capacitance
410
pF
C
rss
Reverse Transfer Capacitance
V
DS
= 15 V,
V
GS
= 0 V,
f = 1.0 MHz
180
pF
R
G
Gate Resistance
V
GS
= 15 mV, f = 1.0 MHz
1.3
Switching Characteristics
(Note 2)
t
d(on)
TurnOn Delay Time
13
23
ns
t
r
TurnOn Rise Time
4
9
ns
t
d(off)
TurnOff Delay Time
27
43
ns
t
f
TurnOff Fall Time
V
DD
= 15 V,
I
D
= 13 A,
V
GS
= 10 V,
R
GEN
= 6
17
31
ns
Q
g
Total Gate Charge
17
24
nC
Q
gs
GateSource Charge
5
nC
Q
gd
GateDrain Charge
V
DS
= 15V,
I
D
= 13 A,
V
GS
= 5 V
6
nC
DrainSource Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous DrainSource Diode Forward Current
13
A
V
SD
DrainSource Diode Forward
Voltage
V
GS
= 0 V, I
S
= 13 A
(Note 2)
0.8
1.2
V
t
rr
Diode Reverse Recovery Time
27
nS
Q
rr
Diode Reverse Recovery Charge
I
F
= 13 A,
d
iF
/d
t
= 100 A/s
15
nC
Notes:
1. R
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
JC
is guaranteed by design while R
CA
is determined by the user's board design.
a) R
JA
= 40C/W when mounted on
a 1in
2
pad of 2 oz copper
b) R
JA
= 96C/W when mounted
on a minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300
s, Duty Cycle < 2.0%
3. Maximum current is calculated as:
where P
D
is maximum power dissipation at T
C
= 25C and R
DS(on)
is at T
J(max)
and V
G S
= 10V. Package
current limitation is 21A
FDD6696/FDU6696
FDD6696/FDU6696 Rev. D (W)
Typical Characteristics
0
20
40
60
80
100
0
1
2
3
4
V
DS
, DRAIN-SOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
3.5V
V
GS
=10V
4.0V
3.0V
6.0V
5.0V
4.5V
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
0
20
40
60
80
100
I
D
, DRAIN CURRENT (A)
R
DS(ON)
, NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
V
GS
= 3.5V
4.0V
6.0V
4.5V
5.0V
10V
Figure 1. On-Region Characteristics
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage
0.6
0.8
1
1.2
1.4
1.6
1.8
-50
-25
0
25
50
75
100
125
150
175
T
J
, JUNCTION TEMPERATURE (
o
C)
R
DS(ON)
, NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
I
D
= 50A
V
GS
= 10V
0.002
0.006
0.01
0.014
0.018
0.022
2
4
6
8
10
V
GS
, GATE TO SOURCE VOLTAGE (V)
R
DS(ON)
, ON-RESISTANCE (OHM)
I
D
= 25A
T
A
= 125
o
C
T
A
= 25
o
C
Figure 3. On-Resistance Variation with
Temperature
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage
0
20
40
60
2
2.5
3
3.5
4
V
GS
, GATE TO SOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
T
A
=125
o
C
25
o
C
V
DS
= 5V
-55
o
C
0.0001
0.001
0.01
0.1
1
10
100
0
0.2
0.4
0.6
0.8
1
1.2
V
SD
, BODY DIODE FORWARD VOLTAGE (V)
I
S
, REVERSE DRAIN CURRENT (A)
T
A
= 125
o
C
25
o
C
-55
o
C
V
GS
= 0V
Figure 5. Transfer Characteristics
Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature
FDD6696/FDU6696
FDD6696/FDU6696 Rev. D (W)
Typical Characteristics
0
2
4
6
8
10
0
10
20
30
40
Q
g
, GATE CHARGE (nC)
V
GS
, GATE-SOURCE VOLTAGE (V)
I
D
= 13A
V
D S
= 10V
15V
20V
0
500
1000
1500
2000
2500
0
5
10
15
20
25
30
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
CAPACITANCE (pF)
C
iss
C
rss
C
oss
f = 1MHz
V
GS
= 0 V
Figure 7. Gate Charge Characteristics
Figure 8. Capacitance Characteristics
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
V
D S
, DRAIN-SOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
DC
1s
100ms
R
DS(ON)
LIMIT
V
GS
= 10V
SINGLE PULSE
R
J A
= 96
o
C/W
T
A
= 25
o
C
10ms
1ms
100s
10s
0
20
40
60
80
100
0.01
0.1
1
10
100
1000
t
1
, TIME (sec)
P(pk), PEAK TRANSIENT POWER (W)
SINGLE PULSE
R
J A
= 96C/W
T
A
= 25C
Figure 9. Maximum Safe Operating Area
Figure 10. Single Pulse Maximum
Power Dissipation
0.001
0.01
0.1
1
0.001
0.01
0.1
1
10
100
1000
t
1
, TIME (sec)
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
R
JA
(t) = r(t) * R
JA
R
JA
= 96 C/W
T
J
- T
A
= P * R
JA
(t)
Duty Cycle, D = t
1
/ t
2
P(pk)
t
1
t
2
SINGLE PULSE
0.01
0.02
0.05
0.1
0.2
D = 0.5
Figure 11. Transient Thermal Response Curve
Thermal characterization performed using the conditions described in Note 1b.
Transient thermal response will change depending on the circuit board design.
FDD6696/FDU6696
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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In Design
First Production
Full Production
Not In Production
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