2005 Fairchild Semiconductor Corporation
DS005297
www.fairchildsemi.com
September 1983
Revised January 2005
MM74HC08 Q
u
a
d
2-
Input
A
ND Gate
MM74HC08
Quad 2-Input AND Gate
General Description
The MM74HC08 AND gates utilize advanced silicon-gate
CMOS technology to achieve operating speeds similar to
LS-TTL gates with the low power consumption of standard
CMOS integrated circuits. The HC08 has buffered outputs,
providing high noise immunity and the ability to drive 10
LS-TTL loads. The 74HC logic family is functionally as well
as pin-out compatible with the standard 74LS logic family.
All inputs are protected from damage due to static dis-
charge by internal diode clamps to V
CC
and ground.
Features
s
Typical propagation delay: 7 ns (t
PHL
), 12 ns (t
PLH
)
s
Fanout of 10 LS-TTL loads
s
Quiescent power consumption: 2
A maximum at room
temperature
s
Low input current: 1
A maximum
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter "X" to the ordering code. (Tape and Reel not available in N14A)
Pb-Free package per JEDEC J-STD-020B.
Connection Diagram
Top View
Order Number
Package
Package Description
Number
MM74HC08M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HC08MX_NL
M14A
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HC08SJ
M14D
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC08MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC08MTCX-NL
MTC14
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
MM74HC08N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
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2
MM
74
H
C
08
Absolute Maximum Ratings
(Note 1)
(Note 2)
Recommended Operating
Conditions
Note 1: Absolute Maximum Ratings are those values beyond which dam-
age to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating -- plastic "N" package:
-
12 mW/
C from 65
C to 85
C.
DC Electrical Characteristics
(Note 4)
Note 4: For a power supply of 5V
10% the worst case output voltages (V
OH
, and V
OL
) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst case V
IH
and V
IL
occur at V
CC
=
5.5V and 4.5V respectively. (The V
IH
value at 5.5V is 3.85V.) The worst case leakage cur-
rent (I
IN
, I
CC
, and I
OZ
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
Supply Voltage (V
CC
)
-
0.5 to
+
7.0V
DC Input Voltage (V
IN
)
-
1.5 to V
CC
+
1.5V
DC Output Voltage (V
OUT
)
-
0.5 to V
CC
+
0.5V
Clamp Diode Current (I
IK
, I
OK
)
20 mA
DC Output Current, per pin (I
OUT
)
25 mA
DC V
CC
or GND Current, per pin
(I
CC
)
50 mA
Storage Temperature Range (T
STG
)
-
65
C to
+
150
C
Power Dissipation (P
D
)
(Note 3)
600 mW
S.O. Package only
500 mW
Lead Temperature (T
L
)
(Soldering 10 seconds)
260
C
Min
Max
Units
Supply Voltage (V
CC
)
2
6
V
DC Input or Output Voltage
0
V
CC
V
(V
IN
, V
OUT
)
Operating Temperature Range (T
A
)
-
40
+
85
C
Input Rise or Fall Times
(t
r
, t
f
)
V
CC
=
2.0V
1000
ns
V
CC
=
4.5V
500
ns
V
CC
=
6.0V
400
ns
Symbol
Parameter
Conditions
V
CC
T
A
=
25
C
T
A
=
-
40 to 85
C T
A
=
-
40 to 125
C
Units
Typ
Guaranteed Limits
V
IH
Minimum HIGH Level
2.0V
1.5
1.5
1.5
V
Input Voltage
4.5V
3.15
3.15
3.15
V
6.0V
4.2
4.2
4.2
V
V
IL
Maximum LOW Level
2.0V
0.5
0.5
0.5
V
Input Voltage
4.5V
1.35
1.35
1.35
V
6.0V
1.8
1.8
1.8
V
V
OH
Minimum HIGH Level
V
IN
=
V
IH
Output Voltage
|I
OUT
|
20
A
2.0V
2.0
1.9
1.9
1.9
V
4.5V
4.5
4.4
4.4
4.4
V
6.0V
6.0
5.9
5.9
5.9
V
V
IN
=
V
IH
|I
OUT
|
4.0 mA
4.5V
4.2
3.98
3.84
3.7
V
|I
OUT
|
5.2 mA
6.0V
5.7
5.48
5.34
5.2
V
V
OL
Maximum LOW Level
V
IN
=
V
IH
or V
IL
Output Voltage
|I
OUT
|
20
A
2.0V
0
0.1
0.1
0.1
V
4.5V
0
0.1
0.1
0.1
V
6.0V
0
0.1
0.1
0.1
V
V
IN
=
V
IH
or V
IL
|I
OUT
|
4.0 mA
4.5V
0.2
0.26
0.33
0.4
V
|I
OUT
|
5.2 mA
6.0V
0.2
0.26
0.33
0.4
V
I
IN
Maximum Input Current
V
IN
=
V
CC
or GND
6.0V
0.1
1.0
1.0
A
I
CC
Maximum Quiescent
V
IN
=
V
CC
or GND
6.0V
2.0
20
40
A
Supply Current
I
OUT
=
0
A
3
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MM74HC08
AC Electrical Characteristics
V
CC
=
5V, T
A
=
25
C, C
L
=
15 pF, t
r
=
t
f
=
6 ns
AC Electrical Characteristics
V
CC
=
2.0V to 6.0V, C
L
=
50 pF, t
r
=
t
f
=
6 ns (unless otherwise specified)
Note 5: C
PD
determines the no load dynamic power consumption, P
D
=
C
PD
V
CC
2
f
+
I
CC
V
CC
, and the no load dynamic current consumption,
I
S
=
C
PD
V
CC
f
+
I
CC
.
Symbol
Parameter
Conditions
Typ
Guaranteed
Limit
Units
t
PHL
Maximum Propagation
12
20
ns
Delay, Output HIGH-to-LOW
t
PLH
Maximum Propagation
7
15
ns
Delay, Output LOW-to-HIGH
Symbol
Parameter
Conditions
V
CC
T
A
=
25
C
T
A
=
-
40 to 125
C
Units
Typ
Guaranteed Limits
t
PHL
Maximum Propagation Delay,
2.0V
77
121
175
ns
Output HIGH-to-LOW
4.5V
15
24
35
ns
6.0V
13
20
30
ns
t
PLH
Maximum Propagation Delay,
2.0V
30
90
134
ns
Output LOW-to-HIGH
4.5V
10
18
27
ns
6.0V
8
15
23
ns
t
TLH
, t
THL
Maximum Output
2.0V
30
75
110
ns
Rise and Fall Time
4.5V
8
15
22
ns
6.0V
7
13
19
ns
C
PD
Power Dissipation Capacitance (Note 5)
(per gate)
38
pF
C
IN
Maximum Input Capacitance
4
10
10
pF
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4
MM
74
H
C
08
Physical Dimensions
inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M14A
5
www.fairchildsemi.com
MM74HC08
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
www.fairchildsemi.com
6
MM
74
H
C
08
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
7
www.fairchildsemi.com
MM74HC08 Q
u
a
d
2-
Input
A
ND Gate
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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