2005 Fairchild Semiconductor Corporation
DS005305
www.fairchildsemi.com
September 1983
Revised January 2005
MM74HC86 Q
u
a
d
2-
Input
E
x
clusi
ve O
R
Gate
MM74HC86
Quad 2-Input Exclusive OR Gate
General Description
The MM74HC86 EXCLUSIVE OR gate utilizes advanced
silicon-gate CMOS technology to achieve operating
speeds similar to equivalent LS-TTL gates while maintain-
ing the low power consumption and high noise immunity
characteristic of standard CMOS integrated circuits. These
gates are fully buffered and have a fanout of 10 LS-TTL
loads. The 74HC logic family is functionally as well as pin
out compatible with the standard 74LS logic family. All
inputs are protected from damage due to static discharge
by internal diode clamps to V
CC
and ground.
Features
s
Typical propagation delay: 9 ns
s
Wide operating voltage range: 26V
s
Low input current: 1
A maximum
s
Low quiescent current: 20
A maximum (74 Series)
s
Output drive capability: 10 LS-TTL loads
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter "X" to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Connection Diagram
Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View
Truth Table
Y
=
A
B
=
A B
+
AB
Order Number
Package
Package Description
Number
MM74HC86M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HC86MX_NL
M14A
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HC86SJ
M14D
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC86MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC86N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
MM74HC86NX_NL
N14A
Pb-Free 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Inputs
Outputs
A
B
Y
L
L
L
L
H
H
H
L
H
H
H
L
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2
MM
74
H
C
86
Absolute Maximum Ratings
(Note 1)
(Note 2)
Recommended Operating
Conditions
Note 1: Absolute Maximum Ratings are those values beyond which dam-
age to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating -- plastic "N" package:
-
12 mW/
C from 65
C to 85
C.
DC Electrical Characteristics
(Note 4)
Note 4: For a power supply of 5V
10% the worst case output voltages (V
OH
, and V
OL
) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst case V
IH
and V
IL
occur at V
CC
=
5.5V and 4.5V respectively. (The V
IH
value at 5.5V is 3.85V.) The worst case leakage cur-
rent (I
IN
, I
CC
, and I
OZ
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
Supply Voltage (V
CC
)
-
0.5 to
+
7.0V
DC Input Voltage (V
IN
)
-
1.5 to V
CC
+
1.5V
DC Output Voltage (V
OUT
)
-
0.5 to V
CC
+
0.5V
Clamp Diode Current (I
IK
, I
OK
)
20 mA
DC Output Current, per pin (I
OUT
)
25 mA
DC V
CC
or GND Current, per pin (I
CC
)
50 mA
Storage Temperature Range (T
STG
)
-
65
C to
+
150
C
Power Dissipation (P
D
)
(Note 3)
600 mW
S.O. Package only
500 mW
Lead Temperature (T
L
)
(Soldering 10 seconds)
260
C
Min
Max
Units
Supply Voltage (V
CC
)
2
6
V
DC Input or Output Voltage
0
V
CC
V
(V
IN
, V
OUT
)
Operating Temperature Range (T
A
)
-
40
+
85
C
Input Rise or Fall Times
(t
r
, t
f
)
V
CC
=
2.0V
1000
ns
V
CC
=
4.5V
500
ns
V
CC
=
6.0V
400
ns
Symbol
Parameter
Conditions
V
CC
T
A
=
25
C
T
A
=
-
40 to 85
C T
A
=
-
55 to 125
C
Units
Typ
Guaranteed Limits
V
IH
Minimum HIGH Level
2.0V
1.5
1.5
1.5
V
Input Voltage
4.5V
3.15
3.15
3.15
V
6.0V
4.2
4.2
4.2
V
V
IL
Maximum LOW Level
2.0V
0.5
0.5
0.5
V
Input Voltage
4.5V
1.35
1.35
1.35
V
6.0V
1.8
1.8
1.8
V
V
OH
Minimum HIGH Level
V
IN
=
V
IH
or V
IL
Output Voltage
|I
OUT
|
20
A
2.0V
2.0
1.9
1.9
1.9
V
4.5V
4.5
4.4
4.4
4.4
V
6.0V
6.0
5.9
5.9
5.9
V
V
IN
=
V
IH
or V
IL
|I
OUT
|
4.0 mA
4.5V
4.2
3.98
3.84
3.7
V
|I
OUT
|
5.2 mA
6.0V
5.7
5.48
5.34
5.2
V
V
OL
Maximum LOW Level
V
IN
=
V
IH
or V
IL
Output Voltage
|I
OUT
|
20
A
2.0V
0
0.1
0.1
0.1
V
4.5V
0
0.1
0.1
0.1
V
6.0V
0
0.1
0.1
0.1
V
V
IN
=
V
IH
or V
IL
|I
OUT
|
4.0 mA
4.5V
0.2
0.26
0.33
0.4
V
|I
OUT
|
5.2 mA
6.0V
0.2
0.26
0.33
0.4
V
I
IN
Maximum Input
V
IN
=
V
CC
or GND
6.0V
0.1
1.0
1.0
A
Current
I
CC
Maximum Quiescent
V
IN
=
V
CC
or GND
6.0V
2.0
20
40
A
Supply Current
I
OUT
=
0
A
3
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MM74HC86
AC Electrical Characteristics
V
CC
=
5V, T
A
=
25
C, C
L
=
15 pF, t
r
=
t
f
=
6 ns
AC Electrical Characteristics
V
CC
=
2.0V to 6.0V, C
L
=
50 pF, t
r
=
t
f
=
6 ns (unless otherwise specified)
Note 5: C
PD
determines the no load dynamic power consumption, P
D
=
C
PD
V
CC
2
f
+
I
CC
V
CC
, and the no load dynamic current consumption,
I
S
=
C
PD
V
CC
f
+
I
CC
.
Symbol
Parameter
Conditions
Typ
Guaranteed
Units
Limit
t
PHL
, t
PLH
Maximum Propagation
12
20
ns
Delay
Symbol
Parameter
Conditions
V
CC
T
A
=
25
C
T
A
=
-
40 to 85
C T
A
=
-
55 to 125
C
Units
Typ
Guaranteed Limits
t
PHL
, t
PLH
Maximum Propagation
2.0V
60
120
151
179
ns
Delay
4.5V
12
24
30
36
ns
6.0V
10
20
26
30
ns
t
TLH
, t
THL
Maximum Output Rise
2.0V
30
75
95
110
ns
and Fall Time
4.5V
8
15
19
22
ns
6.0V
7
13
16
19
ns
C
PD
Power Dissipation
(per gate)
25
pF
Capacitance (Note 5)
C
IN
Maximum Input
5
10
10
10
pF
Capacitance
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4
MM
74
H
C
86
Physical Dimensions
inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M14A
5
www.fairchildsemi.com
MM74HC86
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
www.fairchildsemi.com
6
MM
74
H
C
86
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
7
www.fairchildsemi.com
MM74HC86 Q
u
a
d
2-
Input
E
x
clusi
ve O
R
Gate
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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