AE1.0E
FUJITSU SEMICONDUCTOR
DATA SHEET
FLASH MEMORY
CMOS
16M (2M
8/1M
16) BIT
Dual Operation
MBM29DL16XTD
-70/-90/-12
/MBM29DL16XBD
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s
FEATURES
0.33um Process Technology
Simultaneous Read/Write operations (dual bank)
Multiple devices available with different bank sizes (Refer to Table 1)
Host system can program or erase in one bank, then immediately and simultaneously read from the other bank
Zero latency between read and write operations
Read-while-erase
Read-while-program
Single 3.0 V read, program, and erase
Minimizes system level power requirements
Compatible with JEDEC-standard commands
Uses same software commands as E
2
PROMs
Compatible with JEDEC-standard world-wide pinouts
48-pin TSOP(I) (Package suffix: PFTN Normal Bend Type, PFTR Reversed Bend Type)
48-ball FBGA (Package suffix: PBT)
Minimum 100,000 program/erase cycles
High performance
70 ns maximum access time
Sector erase architecture
Eight 4K word and thirty one 32K word sectors in word mode
Eight 8K byte and thirty one 64K byte sectors in byte mode
Any combination of sectors can be concurrently erased. Also supports full chip erase.
Boot Code Sector Architecture
T = Top sector
B = Bottom sector
Hidden ROM (Hi-ROM) region
64K byte of Hi-ROM, accessible through a new "Hi-ROM Enable" command sequence
Factory serialized and protected to provide a secure electronic serial number (ESN)
WP/ACC input pin
At V
IL
, allows protection of boot sectors, regardless of sector protection/unprotection status
At V
IH
, allows removal of boot sector protection
At V
ACC
, increases program performance
Embedded Erase
TM
Algorithms
Automatically pre-programs and erases the chip or any sector
(Continued)
Embedded Erase
TM
and Embedded Program
TM
are trademarks of Advanced Micro Devices, Inc.
MBM29DL16XTD
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/MBM29DL16XBD
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2
(Continued)
Embedded Program
TM
Algorithms
Automatically writes and verifies data at specified address
Data Polling and Toggle Bit feature for detection of program or erase cycle completion
Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
Automatic sleep mode
When addresses remain stable, automatically switch themselves to low power mode.
Low V
CC
write inhibit
2.5 V
Erase Suspend/Resume
Suspends the erase operation to allow a read in another sector within the same device
Sector group protection
Hardware method disables any combination of sector groups from program or erase operations
Sector Group Protection Set function by Extended sector group protection command
Fast Programming Function by Extended Command
Temporary sector group unprotection
Temporary sector group unprotection via the RESET pin.
In accordance with CFI (Common Flash Memory Interface)
Hidden ROM (Hi-ROM) region
s
PACKAGE
48-pin plastic TSOP (I)
(FPT-48P-M19)
48-pin plastic TSOP (I)
(FPT-48P-M20)
Marking Side
Marking Side
48-ball FBGA
(BGA-48P-M03)
3
MBM29DL16XTD
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/MBM29DL16XBD
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s
GENERAL DESCRIPTION
The MBM29DL16XTD/BD are a 16M-bit, 3.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M
words of 16 bits each. The MBM29DL16XTD/BD are offered in a 48-pin TSOP(I) and 48-ball FBGA Package.
These devices are designed to be programmed in-system with the standard system 3.0 V V
CC
supply. 12.0 V
V
PP
and 5.0 V V
CC
are not required for write or erase operations. The devices can also be reprogrammed in
standard EPROM programmers.
MBM29DL16XTD/BD are organized into two banks, Bank 1 and Bank 2, which can be considered to be two
separate memory arrays as far as certain operations are concerned. These devices are the same as Fujitsu's
standard 3 V only Flash memories with the additional capability of allowing a normal non-delayed read access
from a non-busy bank of the array while an embedded write (either a program or an erase) operation is
simultaneously taking place on the other bank.
In the MBM29DL16XTD/BD, a new design concept is implemented, so called "Slidding Bank Architecture". Under
this concept, the MBM29DL16XTD/BD can be produced a series of devices with different Bank 1/Bank 2 size
combinations; 0.5 Mb/15.5 Mb, 2 Mb/14 Mb, 4 Mb/12 Mb, 8 Mb/8 Mb.
The standard MBM29DL16XTD/BD offer access times 70 ns, 90 ns and 120 ns, allowing operation of high-speed
microprocessors without wait states. To eliminate bus contention the devices have separate chip enable (CE),
write enable (WE), and output enable (OE) controls.
The MBM29DL16XTD/BD are pin and command set compatible with JEDEC standard E
2
PROMs. Commands
are written to the command register using standard microprocessor write timings. Register contents serve as
input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally
latch addresses and data needed for the programming and erase operations. Reading data out of the devices
is similar to reading from 5.0 V and 12.0 V Flash or EPROM devices.
The MBM29DL16XTD/BD are programmed by executing the program command sequence. This will invoke the
Embedded Program Algorithm which is an internal algorithm that automatically times the program pulse widths
and verifies proper cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds.
Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase
Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed
before executing the erase operation. During erase, the devices automatically time the erase pulse widths and
verify proper cell margin.
A sector is typically erased and verified in 1.0 second. (If already completely preprogrammed.)
The devices also feature a sector erase architecture. The sector mode allows each sector to be erased and
reprogrammed without affecting other sectors. The MBM29DL16XTD/BD are erased when shipped from the
factory.
The devices feature single 3.0 V power supply operation for both read and write functions. Internally generated
and regulated voltages are provided for the program and erase operations. A low V
CC
detector automatically
inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ
7
,
by the Toggle Bit feature on DQ
6
, or the RY/BY output pin. Once the end of a program or erase cycle has been
completed, the devices internally reset to the read mode.
Fujitsu's Flash technology combines years of EPROM and E
2
PROM experience to produce the highest levels
of quality, reliability, and cost effectiveness. The MBM29DL16XTD/BD memories electrically erase the entire
chip or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed
one byte/word at a time using the EPROM programming mechanism of hot electron injection.
MBM29DL16XTD
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/MBM29DL16XBD
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4
Table 1 MBM29DL16XTD/BD Device Bank Divisions
Device
Part Number
Organization
Bank 1
Bank 2
Megabits
Sector Sizes
Megabits
Sector Sizes
MBM29DL161TD/BD
8/
16
0.5 Mbit
Eight 8K byte/4K word
15.5 Mbit
Thirty-one
64K byte/32K word
MBM29DL162TD/BD
2 Mbit
Eight 8K byte/4K word,
three 64K byte/32K word
14 Mbit
Twenty-eight
64K byte/32K word
MBM29DL163TD/BD
4 Mbit
Eight 8K byte/4K word,
seven 64K byte/32K word
12 Mbit
Twenty-four
64K byte/32K word
MBM29DL164TD/BD
8 Mbit
Eight 8K byte/4K word,
fifteen 64K byte/32K word
8 Mbit
Sixteen
64K byte/32K word
5
MBM29DL16XTD
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/MBM29DL16XBD
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Note: The address range is A
19
: A
-1
if in byte mode (BYTE = V
IL
).
The address range is A
19
: A
0
if in word mode (BYTE = V
IH
)
Table 2 .1 Sector Address Tables (MBM29DL161TD)
Bank
Sector
Sector Address
Sector
Size
(Kbytes/
Kwords
)
(
8)
Address Range
(
16)
Address Range
Bank Address
A
19
A
18
A
17
A
16
A
15
A
14
A
13
A
12
Bank 2
SA0
0
0
0
0
0
X
X
X
64/32
000000H to 00FFFFH
000000H to 007FFFH
SA1
0
0
0
0
1
X
X
X
64/32
010000H to 01FFFFH
008000H to 00FFFFH
SA2
0
0
0
1
0
X
X
X
64/32
020000H to 02FFFFH
010000H to 017FFFH
SA3
0
0
0
1
1
X
X
X
64/32
030000H to 03FFFFH
018000H to 01FFFFH
SA4
0
0
1
0
0
X
X
X
64/32
040000H to 04FFFFH
020000H to 027FFFH
SA5
0
0
1
0
1
X
X
X
64/32
050000H to 05FFFFH
028000H to 02FFFFH
SA6
0
0
1
1
0
X
X
X
64/32
060000H to 06FFFFH
030000H to 037FFFH
SA7
0
0
1
1
1
X
X
X
64/32
070000H to 07FFFFH
038000H to 03FFFFH
SA8
0
1
0
0
0
X
X
X
64/32
080000H to 08FFFFH
040000H to 048000H
SA9
0
1
0
0
1
X
X
X
64/32
090000H to 09FFFFH
048000H to 04FFFFH
SA10
0
1
0
1
0
X
X
X
64/32
0A0000H to 0AFFFFH
050000H to 058000H
SA11
0
1
0
1
1
X
X
X
64/32
0B0000H to 0BFFFFH
058000H to 05FFFFH
SA12
0
1
1
0
0
X
X
X
64/32
0C0000H to 0CFFFFH
060000H to 068000H
SA13
0
1
1
0
1
X
X
X
64/32
0D0000H to 0DFFFFH 068000H to 06FFFFH
SA14
0
1
1
1
0
X
X
X
64/32
0E0000H to 0EFFFFH
070000H to 078FFFH
SA15
0
1
1
1
1
X
X
X
64/32
0F0000H to 0FFFFFH
078000H to 07FFFFH
SA16
1
0
0
0
0
X
X
X
64/32
100000H to 10FFFFH
080000H to 088000H
SA17
1
0
0
0
1
X
X
X
64/32
110000H to 11FFFFH
088000H to 08FFFFH
SA18
1
0
0
1
0
X
X
X
64/32
120000H to 12FFFFH
090000H to 098000H
SA19
1
0
0
1
1
X
X
X
64/32
130000H to 13FFFFH
098000H to 09FFFFH
SA20
1
0
1
0
0
X
X
X
64/32
140000H to 14FFFFH
0A0000H to 0A7FFFH
SA21
1
0
1
0
1
X
X
X
64/32
150000H to 15FFFFH
0A8000H to 00AFFFH
SA22
1
0
1
1
0
X
X
X
64/32
160000H to 16FFFFH
0B0000H to 0B7000H
SA23
1
0
1
1
1
X
X
X
64/32
170000H to 17FFFFH
0B8000H to 0BFFFFH
SA24
1
1
0
0
0
X
X
X
64/32
180000H to 18FFFFH 0C0000H to 0C7FFFH
SA25
1
1
0
0
1
X
X
X
64/32
190000H to 19FFFFH 0C8000H to 0CFFFFH
SA26
1
1
0
1
0
X
X
X
64/32
1A0000H to 1AFFFFH 0D0000H to 0D7FFFH
SA27
1
1
0
1
1
X
X
X
64/32
1B0000H to 1BFFFFH 0D8000H to 0DFFFFH
SA28
1
1
1
0
0
X
X
X
64/32
1C0000H to 1CFFFFH 0E0000H to 0E7FFFH
SA29
1
1
1
0
1
X
X
X
64/32
1D0000H to 1DFFFFH 0E8000H to 0EFFFFH
SA30
1
1
1
1
0
X
X
X
64/32
1E0000H to 1EFFFFH
0F0000H to 0F7000H
Bank 1
SA31
1
1
1
1
1
0
0
0
8/4
1F0000H to 1F1FFFH
0F8000H to 0F8FFFH
SA32
1
1
1
1
1
0
0
1
8/4
1F2000H to 1F3FFFH
0F9000H to 0F9FFFH
SA33
1
1
1
1
1
0
1
0
8/4
1F4000H to 1F5FFFH 0FA000H to 0FAFFFH
SA34
1
1
1
1
1
0
1
1
8/4
1F6000H to 1F7FFFH 0FB000H to 0FBFFFH
SA35
1
1
1
1
1
1
0
0
8/4
1F8000H to 1F9FFFH 0FC000H to 0FCFFFH
SA36
1
1
1
1
1
1
0
1
8/4
1FA000H to 1FBFFFH 0FD000H to 0FDFFFH
SA37
1
1
1
1
1
1
1
0
8/4
1FC000H to 1FDFFFH 0FE000H to 0FEFFFH
SA38
1
1
1
1
1
1
1
1
8/4
1FE000H to 1FFFFFH 0FF000H to 0FFFFFH
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