GF1A THRU GF1M
SURFACE MOUNT GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 1.0 Ampere
FEATURES
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
Ideal for surface mount automotive applications
High temperature metallurgically bonded construction
Glass passivated cavity-free junction
Capable of meeting environmental standards of
MIL-S-19500
Built-in strain relief
Easy pick and place
High temperature soldering guaranteed: 450C/5 seconds
at terminals
Complete device submersible temperature of 265C for
10 seconds in solder bath
MECHANICAL DATA
Case: JEDEC DO-214BA molded plastic over glass body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0048 ounces, 0.120 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
SYMBOLS
GF1A
GF1B
GF1D
GF1G
GF1J
GF1K
GF1M
UNITS
Device marking code
GA
GB
GD
GG
GJ
GK
GM
Maximum repetitive peak reverse voltage
V
RRM
50
100
200
400
600
800
1000
Volts
Maximum RMS voltage
V
RMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
V
DC
50
100
200
400
600
800
1000
Volts
Maximum average forward rectified current
at T
L
=125C
I
(AV)
1.0
Amp
Peak forward surge current
8.3ms single half sine-wave superimposed on
I
FSM
30.0
Amps
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
V
F
1.10
1.20
Volts
Maximum DC reverse current
T
A
=25C
5.0
at rated DC blocking voltage
T
A
=125C
I
R
50.0
A
Typical reverse recovery time
(NOTE 1)
t
rr
2.0
s
Typical junction capacitance
(NOTE 2)
C
J
15.0
pF
Typical thermal resistance
(NOTE 3)
R
JA
80.0
C/W
R
JL
26.0
Operating junction and storage temperature range
T
J
, T
STG
-65 to +175
C
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied V
R
=4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead
P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas
4/98
0.167 (4.24)
0.187 (4.75)
0.0065 (0.17)
0.0105 (0.27)
0.030 (0.76)
0.060 (1.52)
0.006
0.152
TYP.
0.196 (4.98)
0.226 (5.74)
0.094 (2.39)
0.114 (2.90)
0.106 (2.69)
0.118 (3.00)
0.040 (1.02)
0.060 (1.52)
0.098 (2.49)
0.108 (2.74)
DO-214BA
PA
TENTED*
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead
forming by Patent No. 5,151,846
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.01
0.1
1
10
1
10
100
0
5.0
10
15
20
25
30
1
10
100
1
10
30
0.5
100
110
120
130
140
150
160
175
0
1.0
0
20
40
60
80
100
0.01
0.1
1
10
0.01
0.1
1
10
100
0.1
1
10
100
RATINGS AND CHARACTERISTIC CURVES GF1A THRU GF1M
FIG. 1 - FORWARD CURRENT DERATING CURVE
LEAD TEMPERATURE, C
A
VERA
GE FOR
W
ARD RECTIFIED CURRENT
,
AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
NUMBER OF CYCLES AT 60 H
Z
PEAK FOR
W
ARD SURGE CURRENT
,
AMPERES
FIG. 3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
INST
ANT
ANEOUS FOR
W
ARD CURRENT
,
AMPERES
INST
ANT
ANEOUS REVERSE CURRENT
,
MICR
O
AMPERES
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION CAP
A
CIT
ANCE, pF
REVERSE VOLTAGE, VOLTS
T
J
=T
J
max.
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
T
J
=25C
T
J
=25C
PULSE WIDTH=300
s
1% DUTY CYCLE
T
J
=25C
f=1.0 MH
Z
Vsig=50mVp-p
60 H
Z
RESISTIVE OR
INDUCTIVE LOAD
P.C.B. MOUNTED on
0.2 x 0.2" (5.0 x 5.0mm)
COPPER PAD AREAS
T
J
=100C
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
TRANSIENT
THERMAL IMPED
ANCE (
C/W)
MOUNTED ON 0.20 x 0.27" (5 x 7mm)
COPPER PAD AREAS
t, PULSE DURATION, sec
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