Optical MicroGauge
C8125-01
Recently, with the development of IC cards and 3-
dimensional systems, the technology for uniformly
processing ultrathin, patterned wafers has been in
demand, making accurate and controlled processing
important. For fabrication process control, a system for
measuring the wafer thickness most accurately is
demanded.
Two conventional types of thickness gauges (equipment)
that have been widely used for measuring wafer thickness
in the past are the contact type gauge and the capacitance
type gauge. Using a contact type gauge tends to damage
the front surface of the wafer and to break ultrathin
processed wafers. In addition, when measuring wafers with
protective film, the contact type gauge can only measure
the total of both the wafer and the film, but not the wafer
itself. With a capacitance type gauge the protective film or
patterned wafer may change the capacitance, thus, an
accurate measurement cannot be made.
The C8125-01 measures thickness by using the
interference of light to detect the front and reverse sides
of the wafer. With this feature, wafer thickness can be
measured without being affected by protective film or
patterns. Because this is a non contact type system,
costly patterned wafers cannot be damaged and a highly
accurate thickness measurement can be made.
In addition, when thin processing of the wafer by various
etching processes, it is also possible to carry out the in-
line monitoring of the wafer thickness. Therefore, ultrathin
wafers can be fabricated with stability.
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Non-contact measurement makes
no damage on wafers
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Measures patterned wafers and wafers
with protective film
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Measures thickness distribution of
wafers (C8870-01, -02)
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Wafer thickness during wet etching
can be monitored
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In-line measurement from one side
is possible
FEATURES
Furthermore, the Wafer Thickness Mapping System
C8870 series which combined the automatic stage was
carried out. Two models of C8870-01 (for 5, 6 or 8 inch
wafer) and C8870-02 (for 8 or 12 inch wafer) are available.
The distribution of the wafer thickness can be measured by
adjusting the thickness to the automatic stage. Therefore,
etching and grinding characteristics can be checked and
quality can be controlled.
The C8125-01 is designed to measure the thickness of wafers without contact.
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Wafer Thickness Mapping System C8870-01
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Optical MicroGauge C8125-01
SPECIFICATIONS
SYSTEM CONFIGURATIONS
MEASUREMENT EXAMPLES
Sample:
8-inch bare wafer (Protective film /after grinding process)
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Distribution of an wafer thickness (Display from 70 to 76
m)
Homepage Address http://www.hamamatsu.com
5
Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.
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Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult with our sales office.
.
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Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications and external appearance are subject to change without notice..
2001Hamamatsu Photonics K.K.
ISO 9001
Certificate: 09 105 79045
HAMAMATSU PHOTONICS K.K., Systems Division
812 Joko-cho, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail:export@sys.hpk.co.jp
U.S.A. and Canada: Hamamatsu Photonic Systems: 360 Foothill Road, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1)908-231-1116, Fax: (1)908-231-0852, E-mail: usa@hamamatsu.com
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658, E-mail: info@hamamatsu.de
,
France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10, E-mail: infos@hamamatsu.fr
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire, AL7 1BW, U.K., Telephone: (44) 1707-294888, Fax: (44) 1707-325777, E-mail: info@hamamatsu.co.uk
North Europe: Hamamatsu Photonics Norden AB: Smidesvgen 12, SE-171-41 Solna, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01, E-mail: info@hamamatsu.se
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Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Mois, 1/E 20020 Arese (Milano), Italy, Telephone: (39)02-935 81 733, Fax: (39)02-935 81 741, E-mail: info@hamamatsu.it
Cat. No. SSIS1029E06
DEC/2001 HPK
Created in Japan (PDF)
200
200
400
400
100
300
500
0
300
100
Time (second)
Thic
kness (
m)
P2
P1
0
200
400
600
800
1000 1200
Intensity (count)
0
500
1000
1500
2000
2500
P
osition (
m)
P1
P2
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In-Situ monitoring of wafer thickness during wet etching
LASER SAFETY
Description Label
The C8125-01 complies with Class
laser
product safety requirement (IEC825).
Optical MicroGauge C8125-01
Measurement range
Measurement repeatability
Measurement accuracy
Laser Class
Measurement spot size
Remote control Interface
Line voltage
Power consumption
Dimensional outline / Weight
Wafer Thickness Mapping System C8870-01, -02
Measurement range
Measurement repeatability
Measurement accuracy
Laser Class
Measurement spot size
Wafer size
Stage resolution
Stage accuracy
Line voltage
Power consumption
Dimensional outline / Weight
10
m to 700
m (at the refractive index of 3.5)
0.1
m (Standard deviation when measuring the same point 30 times at the refractive index of 3.5)
Less than
1
m (at the refractive index of 3.5 )*
Class I
Less than 60
m
RS232C
AC100 V to 120 V / 200 V to 240 V
10% 50/60 Hz
250 VA
C8125-01 : 412 mm(W)
124 mm(H)
408 mm(D) / approx. 9 kg
10
m to 700
m (at the refractive index of 3.5)
0.1
m (Standard deviation when measuring the same point 30 times at the refractive index of 3.5)
Less than
1
m (at the refractive index of 3.5)*
Class I
Less than 60
m
C8126-01 : 5, 6, 8 inch / C8126-02 : 8,12 inch
0.1 mm
0.01 mm
AC200 V
10% 50/60 Hz
(including C8125-01)
2.2 kVA
(including C8125-01)
C8125-01 : 412 mm(W)
124 mm(H)
408 mm(D) / approx. 9 kg
Power supply unit for C8126-01(-02) : 172 mm(W)
264 mm(H)
433 mm(D) / approx. 9 kg
Stage unit for C8870-01 : 854 mm(W)
580 mm(H)
600 mm(D) / approx. 65 kg
Stage unit for C8870-02 : Please consult with our sales office.
Data Analyzer
C8125-01
Probe head
SCSI I/F
I/F(RS232-C, I/O)
Optical fiber
Standard
Optional
C8126-01(-02)
Power supply unit
Wafer
C8126-01(-02)
Stage unit
Software
Data Analyzer
Probe head
SCSI I/F
I/F(RS232-C)
Optical fiber
Standard
Optional
Wafer
Software
Etcher or Grinder
C8125-01
Optical MicroGauge C8125-01
Wafer Thickness Mapping System C8870-01, -02
* Calculated from the referactive index of 3.5 and the measurement values of air gap etalons which are known gap length.
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