6-11
FIGURE 2. LOW CURRENT SCR FORWARD VOLTAGE DROP
CURVE
FIGURE 3. HIGH CURRENT SCR FORWARD VOLTAGE DROP
CURVE
FIGURE 4. TYPICAL APPLICATION OF THE SP721 AS AN INPUT CLAMP FOR OVER-VOLTAGE, GREATER THAN 1V
BE
ABOVE V+ OR
LESS THAN -1V
BE
BELOW V-
600
800
1000
1200
FORWARD SCR VOLTAGE DROP (mV)
100
80
60
40
20
0
FOR
W
ARD SCR CURRENT (mA)
T
A
= 25
o
C
SINGLE PULSE
2.5
2
1.5
1
0.5
0
FOR
W
A
RD SCR CURRENT (A)
T
A
= 25
o
C
SINGLE PULSE
V
FWD
I
FWD
0
1
2
3
FORWARD SCR VOLTAGE DROP (V)
EQUIV. SAT. ON
THRESHOLD ~ 1.1V
+V
CC
INPUT
DRIVERS
SP721 INPUT PROTECTION CIRCUIT (1 OF 6 SHOWN)
OR
SIGNAL
SOURCES
IN 5 - 7
IN 1 - 3
SP721
V-
TO +V
CC
LINEAR OR
DIGITAL IC
INTERFACE
V+
+V
CC
SP721
6-12
Peak Transient Current Capability of the SP721
The peak transient current capability rises sharply as the
width of the current pulse narrows. Destructive testing was
done to fully evaluate the SP721's ability to withstand a wide
range of peak current pulses vs time. The circuit used to
generate current pulses is shown in Figure 5.
The test circuit of Figure 5 is shown with a positive pulse
input. For a negative pulse input, the (-) current pulse input
goes to an SP721 `IN' input pin and the (+) current pulse
input goes to the SP721 V- pin. The V+ to V- supply of the
SP721 must be allowed to float. (i.e., It is not tied to the
ground reference of the current pulse generator.) Figure 6
shows the point of overstress as defined by increased
leakage in excess of the data sheet published limits.
The maximum peak input current capability is dependent on
the ambient temperature, improving as the temperature is
reduced. Peak current curves are shown for ambient
temperatures of 25
o
C and 105
o
C and a 15V power supply
condition. The safe operating range of the transient peak
current should be limited to no more than 75% of the
measured overstress level for any given pulse width as
shown in the curves of Figure 6.
Note that adjacent input pins of the SP721 may be
paralleled to improve current (and ESD) capability. The
sustained peak current capability is increased to nearly
twice that of a single pin.
+
-
VOLTAGE
PROBE
+
-
R
1
~ 10
TYPICAL
V
X
V
X
ADJ. 10V/A TYPICAL
R
1
(-)
(+)
C1 ~ 100
F
C1
VARIABLE TIME DURATION
CURRENT PULSE GENERATOR
1
2
3
4
8
7
6
5
V+
IN
IN
IN
IN
IN
IN
V-
SP721
CURRENT
SENSE
FIGURE 5. TYPICAL SP721 PEAK CURRENT TEST CIRCUIT
WITH A VARIABLE PULSE WIDTH INPUT
0.001
0.01
0.1
1
PULSE WIDTH TIME (ms)
PEAK CURRENT (A)
10
7
6
5
4
3
2
1
0
T
A
= 105
o
C
100 1000
CAUTION: SAFE OPERATING CONDITIONS LIMIT
OF THE VALUES SHOWN ON EACH CURVE.
PULSE WIDTH TO BE NO GREATER THAN 75%
THE MAXIMUM PEAK CURRENT FOR A GIVEN
V+ TO V- SUPPLY = 15V
T
A
= 25
o
C
FIGURE 6. SP721 TYPICAL SINGLE PULSE PEAK CURRENT CURVES SHOWING THE MEASURED POINT OF OVERSTRESS IN
AMPERES vs PULSE WIDTH TIME IN MILLISECONDS
SP721
6-13
SP721
Dual-In-Line Plastic Packages (PDIP)
C
L
E
e
A
C
e
B
e
C
-B-
E1
INDEX
1 2 3
N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A
1
-A-
0.010 (0.25)
C
A
M
B S
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the "MO Series Symbol List" in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and
are measured with the leads constrained to be per-
pendicular to datum
.
7. e
B
and e
C
are measured at the lead tips with the leads uncon-
strained. e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
e
A
-C-
E8.3
(JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.355
0.400
9.01
10.16
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
e
A
0.300 BSC
7.62 BSC
6
e
B
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N
8
8
9
Rev. 0 12/93
6-14
SP721
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
NOTES:
1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension "E" does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. "L" is the length of terminal for soldering to a substrate.
7. "N" is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width "B", as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15
(JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
8
8
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
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