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Электронный компонент: 520LB7C

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LED SPECIFICATION
Page: 1

Features
Single color
High bright output
Low power consumption
High reliability and long life
Descriptions
Dice materialGaN
Emitting Color
Super Bright
Blue
Device Outline
5mm Round Type/ 5mm
Lens Type
Water Clear
Directivity
1. All dimensions are millimeters
2. Tolerance is +/-0.25mm unless otherwise noted
520LB7C
Relative Luminous
0
90
60
0.5
Radiation Angle
30
0
0.5
1.0
Ta=25 C
IF=20mA
0
30
90
1.0
60
LED SPECIFICATION

Absolute maximum ratings
Ta = 25
Value
Parameter
Symbol
Test Condition
Min. Max.
Unit
Reverse Voltage
V
R
I
R
= 30A 5 --
V
Forward Current
I
F
---- ----
30
mA
Power Dissipation
Pd
----
----
105
mW
Pulse Current
Ipeak
Duty=0.1mS1kHz
---- 100
mA
Operating Temperature
Topr
----
-20
+85
Storage Temperature
Tstr
----
-25
+100
Electrical and optical characteristics Ta = 25
Value
Parameter
Symbol
Test Condition
Min. Typ. Max.
Unit
Forward Voltage
V
F
I
F
= 20mA
V7~V9
Reverse Current
I
R
V
R
= 5V
----
----
30
A
Dominate Wavelength
d
I
F
= 20mA
B4~B6
Spectral Line half-width
I
F
=
20mA
---- 22 ---- nm
Luminous Intensity
I
V
I
F
= 20mA
U,V,W
Viewing Angle
2
1/2
I
F
= 20mA
17 23 Deg.
Page:
2
Bin Code
IV(mcd)
Bin Code
IV(mcd) Bin Code
IV(mcd)
Bin Code IV(mcd)
A
0-5.0
H
37.2-52.0
Q
390-550
X
4180--5860
B
5.0-7.0
J
52.0-72.8
R
550-770
Y
5860-8200
C
7.0-9.8
K
72.8-102
S
770-1100
Z1
8-10cd
D
9.8-13.7
L
102-145
T
1100-1520
Z2
10-12cd
E
13.7-19.0
M
145-200
U
1520-2130
Z3
12-14cd
F
19.0-26.6
N
200-280
V
2130-3000
Z4
14-16cd
G
26.6-37.2
P
280-390
W
3000-4180
Z5
16-18cd
Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code Wavel. (nm)
B1
450-455
YG1
555-558
B2
455-460
YG2
558-561
B3
460-465
YG3
561-564
B4
465-470
YG4
564-567
B5
470-475
YG5
567-570
B6
475-480
YG6
570-573
G1
491-494
YG7
573-576
G2
494-497
Y1
582-585
G3
497-500
Y2
585-588
G4
500-503
Y3
588-591
G5
503-506
Y4
591-594
G6
506-509
Y5
594-597
G7
509-512
YO1
597-600
G8
512-515
YO2
600-603
G9
515-518
YO3
603-606
G10
518-521
YO4
606-609
G11
521-524
O1
609-612
G12
524-527
O2
612-615
G13
527-530
O3
615-618
G14
530-533
R1
618-621
G15
533-536
R2
621-624
G16
536-539
R3
624-627
G17
539-542
R4
627-630
G18
542-545
R5
630-633
G19
545-548
R6
633-636
Bin Code
VF (V)
Bin Code
VF (V) Bin Code
VF (V)
Bin Code
VF (V)
V1
1.6-1.8
V5
2.4-2.6
V9
3.2-3.4
V13
4.0-4.2
V2
1.8-2.0
V6
2.6-2.8
V10
3.4-3.6
V14
4.2-4.4
V3
2.0-2.2
V7
2.8-3.0
V11
3.6-3.8
V15
4.4-4.6
V4
2.2-2.4
V8
3.0-3.2
V12
3.8-4.0
V16
4.6-4.8
BRIGHTNESS BIN
YELLOW
YELLOW
ORANGE
PURE
ORANGE
YELLOW
GREEN
BLUE
GREEN
FORWARD VOLTAGE (VF) BIN
RED
BLUE
WAVELENGTH BIN
PURE
GREEN
BIN ranking for LEDs
Page:
3
LED SPECIFICATION
Typical electrical/optical characteristic curves
50
40
30
4.0
0
0
50
FORWARD CURRENT Vs
FORWARD VOLTAGE
LUMINOUS INTENSITY Vs.
FORWARD CURRENT
40
50
2.0
1.5
40
30
0.5
20
10
3.6
0
10
2.4
2.0
2.8
0
3.2
20
Forwar
d Current(
m
A)
Lu
m
i
no
u
s
I
n
tensity
Re
lati
ve Va
lue a
t
IF=
2
0
m
A
1.0
30
2.5
FORWARD CURRENT
DERATING CURVE
2.0
1.5
20
2.5
LUMINOUS INTENSITY Vs.
AMBIENT TEMPERATURE
100
80
60
0.5
20
0
-20
100
-40
60
80
20
40
0
0
Ambient Temperature T
A
( )
Ambient Temperature T
A
( )
40
R
e
l
a
t
i
ve
Lu
m
i
no
us
Intensity
Forward Current(
m
A)
10
1.0
IF-Forward Current (mA)
Forward Voltage(V)
700
650
400
100
R
e
lativ
e
L
u
minou
s

Intensity
Wavelength
(nm)
0
50
25
75
550
600
500
450
Page:
4
LED LAMP
APPLICATION
SOLDERING
METHOD SOLDERING
CONDITIONS
REMARK
DIP
SOLDERING
Bath temperature: 2605
Immersion time: with 5 sec
Solder no closer than 3mm from the
base of the package
Using soldering flux," RESIN FLUX"
is recommended.
SOLDERING
IRON
Soldering iron: 30W or smaller
Temperature at tip of iron: 260 or lower
Soldering time: within 5 sec.
During soldering, take care not to
press the tip of iron against the
lead.
(To prevent heat from being
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.





2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Page : 5
P a n e l
(Fig.1)
L e a d w r i e s
L e a v e a s l i g h t
c l e a r a n c e
L e a d w r i e s
( F i g . 2 )