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Электронный компонент: 2SD1306

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2SD1306
Silicon NPN Epitaxial
ADE-208-1144 (Z)
1st. Edition
Mar. 2001
Application
Low frequency amplifier, Muting
Outline
1
2
3
1. Emitter
2. Base
3. Collector
MPAK
2SD1306
2
Absolute Maximum Ratings (Ta = 25C)
Item
Symbol
Ratings
Unit
Collector to base voltage
V
CBO
30
V
Collector to emitter voltage
V
CEO
15
V
Emitter to base voltage
V
EBO
5
V
Collector current
I
C
0.7
A
Collector power dissipation
P
C
150
mW
Junction temperature
Tj
150
C
Storage temperature
Tstg
55 to +150
C
Electrical Characteristics (Ta = 25C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to base breakdown
voltage
V
(BR)CBO
30
--
--
V
I
C
= 10
A, I
E
= 0
Collector to emitter breakdown
voltage
V
(BR)CEO
15
--
--
V
I
C
= 1 mA, R
BE
=
Emitter to base breakdown
voltage
V
(BR)EBO
5
--
--
V
I
E
= 10
A, I
C
= 0
Collector cutoff current
I
CBO
--
--
1.0
A
V
CB
= 20 V, I
E
= 0
DC current transfer ratio
h
FE
*
1
250
--
800
V
CE
= 1 V, I
C
= 150 mA*
2
Base to emitter voltage
V
BE
--
--
1.0
V
V
CE
= 1 V, I
C
= 150 mA*
2
Collector to emitter saturation
voltage
V
CE(sat)
--
--
0.5
V
I
C
= 500 mA, I
B
= 50 mA*
2
Gain bandwidth product
f
T
--
250
--
MHz
V
CE
= 1 V, I
C
= 150 mA*
2
Notes: 1. The 2SD1306 is grouped by h
FE
as follows.
2. Pulse test
Grade
D
E
Mark
ND
NE
h
FE
250 to 500
400 to 800
See characteristic curves of 2SD1504.
2SD1306
3
0
50
100
150
50
Ambient Temperature Ta (
C)
Collector Power Dissipation P
C
(mW)
Maximum Collector Dissipation Curve
100
150
2SD1306
4
Package Dimensions
0.16
0 0.1
+ 0.10
0.06
0.4
+ 0.10
0.05
0.95
0.95
1.9
0.2
2.95
0.2
2.8
+ 0.2 0.6
0.65
1.5
0.15
0.65
1.1
+ 0.2 0.1
0.3
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
MPAK
--
Conforms
0.011 g
As of January, 2001
Unit: mm
2SD1306
5
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
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intellectual property rights, in connection with use of the information contained in this document.
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi's sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor
products.
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Copyright
Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
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