MICROWAVE CORPORATION
12 - 22
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - SMT
12
HMC170C8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 2.5 - 4 GHz
v01.0801
General Description
Features
Functional Diagram
Conversion Loss: 9.0 dB
LO to RF Isolation: 45 dB
Surface Mount
Small Size, No DC Bias Required
Electrical Specifi cations,
T
A
= +25 C, LO Drive = +13 dBm
Typical Applications
The HMC170C8 is ideal for:
Microwave Point to Point
RADAR
VSAT
The HMC170C8 is a miniature double-balanced
mixer in a non-hermetic ceramic surface mount
package that can be used as an upconverter,
downconverter or biphase modulator. The device
is a passive diode/balun type mixer with high
dynamic range. Noise fi gure is essentially equal
to the conversion loss. The mixer can handle
larger signal levels than most active mixers due
to the high third order intercept. MMIC implemen-
tation provides exceptional balance in the circuit
resulting in high LO/RF and LO/IF isolations and
unit-to-unit consistency. This mixer has applica-
tions where small size and surface mount com-
patibility are important.
Parameter
Min.
Typ.
Max.
Units
Frequency Range, RF & LO
2.5 - 4.0
GHz
Frequency Range, IF
DC - 2
GHz
Conversion Loss
9
10
dB
Noise Figure (SSB)
9
10
dB
LO to RF Isolation
40
45
dB
LO to IF Isolation
32
36
dB
IP3 (Input)
13
18
dBm
IP2 (Input)
35
40
dBm
1 dB Gain Compression (Input)
7
10
dBm
MICROWAVE CORPORATION
12 - 23
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - SMT
12
-20
-15
-10
-5
0
CONVERSION LOSS (dB)
0
1
2
3
4
5
6
FREQUENCY (GHz)
-60
-50
-40
-30
-20
-10
0
ISOLATION (dB)
0
1
2
3
4
5
6
FREQUENCY (GHz)
RF/IF
LO/IF
LO/RF
Conversion Loss
Isolation
-15
-13
-11
-9
-7
-5
CONVERSION LOSS (dB)
0
1
2
3
4
5
6
FREQUENCY (GHz)
+15 dBm
+13 dBm
+10 dBm
+9 dBm
Conversion Loss vs. LO Drive
v01.0801
HMC170C8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 2.5 - 4 GHz
-25
-20
-15
-10
-5
0
RETURN LOSS (dB)
0
1
2
3
4
5
6
FREQUENCY (GHz)
IF
LO
RF
Return Loss
Distortion and 1dB
Compression vs. LO Drive Level
Isolation vs. LO Drive
S - Paremeters for the RF, LO, IF Ports are Available On-Line at
www.hittite.com
-60
-50
-40
-30
-20
ISOLATION (dB)
0
1
2
3
4
5
6
FREQUENCY (GHz)
+15 dBm
+13 dBm
+10 dBm
+9 dBm
Distortion
LO
Drive
RF (f1) = 3.01 GHz
RF (f2) = 3.00 GHz
LO = 3.5 GHz
RF Level = 0 dBm
1 dB
Compression
(dBm)
IP3 (dBm)
IP2 (dBm)
P1dB (dBm)
+10
16
38
8
+13
18
40
10
+15
18
40
10
MICROWAVE CORPORATION
12 - 24
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - SMT
12
Outline Drawing
Absolute Maximum Ratings
v01.0801
HMC170C8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 2.5 - 4 GHz
RF / IF Input
+13 dBm
LO Drive
+27 dBm
Storage Temperature
-65 to +150 C
Operating Temperature
-55 to +85 C
NOTES:
1. PACKAGE BODY MATERIAL: WHITE ALUMINA 92%
2. LEAD, PACKAGE BOTTOM MATERIAL: COPPER
3. PLATING: ELECTROLYTIC GOLD 100-200 MICROINCHES, OVER
ELECTROLYTIC NICKEL 100-250 MICROINCHES.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. PACKAGE LENGTH AND WIDTH DIMENSIONS DO NOT INCLUDE LID
SEAL PROTRUSION .005 PER SIDE.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
MICROWAVE CORPORATION
12 - 25
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - SMT
12
v01.0801
HMC170C8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 2.5 - 4 GHz
Evaluation PCB
List of Material
Item
Description
J1 - J3
PC Mount SMA RF Connector
U1
HMC170C8 Mixer
PCB*
107214 Evaluation Board
* Circuit Board Material: Rogers 4350
The circuit board used in the fi nal application should
use RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground
leads and exposed paddle should be connected
directly to the ground plane similar to that shown. A
suffi cient number of VIA holes should be used to con-
nect the top and bottom ground planes. The evalua-
tion circuit board shown is available from Hittite upon
request.
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