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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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11
HMC188MS8
GaAs MMIC SMT PASSIVE FREQUENCY
DOUBLER, 1.25 - 3.0 GHz INPUT
v02.1201
General Description
Features
Functional Diagram
Conversion Loss: 15 dB
Fo, 3Fo, 4Fo Isolation: 45 dB
Input Drive Level: 10 to 20 dBm
Electrical Specifi cations,
T
A
= +25 C, As a Function of Drive Level
Typical Applications
The HMC188MS8 is suitable for:
Wireless Local Loop
LMDS, VSAT, and Pt to Pt Radios
UNII & HiperLAN
Test Equipment
The HMC188MS8 is a miniature frequency doubler
in a plastic 8-lead MSOP package. The suppres-
sion of undesired fundamental and higher order har-
monics is 45 dB typical with respect to input signal
levels. The doubler uses the same diode/balun tech-
nology used in Hittite MMIC mixers. The doubler is
ideal for high volume applications where frequency
doubling of a lower frequency is more economical
than directly generating a higher frequency. The
passive Schottky diode doubler technology contrib-
utes no measurable additive phase noise onto the
multiplied signal.
Input = +10 dBm
Input = +15 dBm
Input = +20 dBm
Parameter
Min.
Typ. Max.
Min.
Typ. Max.
Min.
Typ. Max.
Units
Frequency Range, Input
1.75 - 2.75
1.5 - 2.5
1.25 - 3.0
GHz
Frequency Range, Output
3.5 - 5.5
3.0 - 5.0
2.5 - 6.0
GHz
Conversion Loss
19
22
15
18
16
19
dB
FO Isolation
(with respect to input level)
35
45
dB
3FO Isolation
(with respect to input level)
43
50
dB
4FO Isolation
(with respect to input level)
38
45
dB
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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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-50
-40
-30
-20
-10
0
CONVERSION LOSS (dB)
0
1
2
3
4
5
6
7
8
OUTPUT FREQUENCY (GHz)
Input = +10 dBm
Input = +13 dBm
Input = +15 dBm
Input = +20 dBm
GaAs MMIC SUB-HARMONICALLY PUMPED MIXER 17 - 25 GHz
HMC188MS8
Conversion Loss @ +15 dBm Drive Level
Isolation @ +15 dBm Drive Level*
Input Return Loss vs. Drive Level
Output Return Loss vs. Drive Level
v02.1201
GaAs MMIC SMT FREQUENCY
DOUBLER, 1.25 - 3.0 GHz INPUT
*With respect to input level
Note: Output return loss measured at 2fo, with +10dBm,
+15 dBm, and +20 dBm drive levels on input of doubler.
Conversion Loss vs. Drive Level
-50
-40
-30
-20
-10
0
CONVERSION LOSS (dB)
0
1
2
3
4
5
6
7
8
OUTPUT FREQUENCY (GHz)
+25C
-40C
+85C
-25
-20
-15
-10
-5
0
OUTPUT RETURN LOSS (dB)
0
1
2
3
4
5
6
7
8
OUTPUT FREQUENCY (GHz)
Input = +10 dBm
Input = +15 dBm
Input = +20 dBm
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
ISOLATION (dB)
0
5
10
15
20
FREQUENCY (GHz)
Fo
3Fo
4Fo
-25
-20
-15
-10
-5
0
INPUT RETURN LOSS (dB)
0
1
2
3
4
5
6
7
8
INPUT FREQUENCY (GHz)
Input = +10 dBm
Input = +15 dBm
Input = +20 dBm
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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11
Absolute Maximum Ratings
Outline Drawing
v02.1201
HMC188MS8
GaAs MMIC SMT FREQUENCY
DOUBLER, 1.25 - 3.0 GHz INPUT
Input Drive
+27 dBm
Storage Temperature
-65 to +150 C
Operating Temperature
-40 to +85 C
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC
SILICA AND SILICON IMPREGNATED.
2. LEADFRAME MATERIAL: COPPER ALLOY
3. LEADFRAME PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15 mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25 mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB PF GROUND.
MICROWAVE CORPORATION
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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TIPLIERS - SMT
11
v02.1201
HMC188MS8
GaAs MMIC SMT FREQUENCY
DOUBLER, 1.25 - 3.0 GHz INPUT
Evaluation PCB
List of Materials
Item
Description
J1 - J3
PC Mount SMA Connector
C1
1,000 pF Capacitor, 0603 Pkg.
U1
HMC443LP4, x4 Active Multiplier
PCB*
104610 Eval Board
* Circuit Board Material: Rogers 4350
The circuit board used in the fi nal application should be generated with proper RF circuit design techniques.
Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be
connected directly to the ground plane similar to that shown. The evaluation circuit board shown is available from
Hittite upon request.
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