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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
SWITCHES - SMT
14
HMC232LP4
GaAs MMIC SPDT NON-REFLECTIVE
SWITCH, DC - 12.0 GHz
v02.0604
General Description
Features
Functional Diagram
The HMC232LP4 is a broadband high isolation
non-refl ective GaAs MESFET SPDT switch in
a low cost leadless QFN surface mount plastic
package. Covering DC to 12 GHz, the switch
features >60 dB isolation up to 3 GHz and >42
dB isolation up to 12 GHz. Input P1dB compres-
sion is +27 dBm typical, while input IP3 is +50
dBm. The switch operates using complementary
negative control voltage logic lines of -5/0V and
requires no bias supply.
Isolation: 60 dB @ 3 GHz
52 dB @ 6 GHz
+27 dBm Input P1dB
Insertion Loss: 1.5 dB Typical @ 6 GHz
Non-Refl ective Design
4 x 4 x 1 mm QFN SMT Package
Electrical Specifi cations,
T
A
= +25 C, With 0/-5V Control, 50 Ohm System
Typical Applications
The HMC232LP4 is ideal for:
Telecom Infrastructure
Microwave Radio & VSAT
Military Radios, Radar & ECM
Test Instrumentation
Parameter
Frequency
Min.
Typ.
Max.
Units
Insertion Loss
DC - 3.0 GHz
DC - 6.0 GHz
DC - 9.0 GHz
DC - 12.0 GHz
1.4
1.5
2.0
2.7
1.7
1.8
2.3
3.1
dB
dB
dB
dB
Isolation
DC - 3.0 GHz
DC - 6.0 GHz
DC - 9.0 GHz
DC - 12.0 GHz
55
47
40
37
60
52
45
42
dB
dB
dB
dB
Return Loss
"On State"
DC - 6.0 GHz
DC - 9.0 GHz
DC - 12.0 GHz
18
16
11
dB
dB
dB
Return Loss RF1, RF2
"Off State"
DC - 12.0 GHz
14
dB
Input Power for 1 dB Compression
0.5 - 12.0 GHz
24
27
dBm
Input Third Order Intercept
(Two-Tone Input Power= +7 dBm Each Tone, 1 MHz Tone Separation)
0.5 - 12.0 GHz
45
50
dBm
Switching Characteristics
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
DC - 12.0 GHz
3
6
ns
ns
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SWITCHES - SMT
GaAs MMIC SUB-HARMONICALLY PUMPED MIXER 17 - 25 GHz
Input Third Order Intercept Point
Return Loss
0.1 and 1 dB Input Compression Point
Insertion Loss
Isolation
HMC232LP4
GaAs MMIC SPDT NON-REFLECTIVE
SWITCH, DC - 12.0 GHz
v02.0604
-6
-5
-4
-3
-2
-1
0
0
1
2
3
4
5
6
7
8
9
10
11
12
13
+25 C
+85 C
-40 C
INSERTION LOSS (dB)
FREQUENCY (GHz)
-80
-70
-60
-50
-40
-30
-20
-10
0
1
2
3
4
5
6
7
8
9
10
11
12
13
RF1
RF2
ISOLATION (dB)
FREQUENCY (GHz)
-25
-20
-15
-10
-5
0
0
1
2
3
4
5
6
7
8
9
10
11
12
13
RFC
RF1, RF2 ON
RF1, RF2 OFF
RETURN LOSS (dB)
FREQUENCY (GHz)
10
15
20
25
30
0
1
2
3
4
5
6
7
8
9
10
11
12
13
0.1 dB Compression Point
1 dB Compression Point
INPUIT P1dB (dBm)
FREQUENCY (GHz)
30
35
40
45
50
55
60
0
1
2
3
4
5
6
7
8
9
10
11
12
13
+25 C
+85 C
-40 C
IN
PU
IT
IP3 (dBm
)
FREQUENCY (GHz)
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SWITCHES - SMT
14
Truth Table
Absolute Maximum Ratings
Control Voltages
Outline Drawing
Control Input
Signal Path State
A
B
RFC to RF1
RFC to RF2
High
Low
ON
OFF
Low
High
OFF
ON
State
Bias Condition
Low
0 to -0.2V @ 10 uA Max.
High
-5V @ 10 uA Typ. to -7V @ 45 uA Typ. (
0.5 Vdc)
RF Input Power (Vctl= -5V)
(0.5 - 12 GHz)
+30 dBm (@ +50 C)
Control Voltage Range (A & B)
+1.0V to -7.5 Vdc
Channel Temperature
150 C
Thermal Resistance (R
TH
)
(junction to lead)
94 C/W
Storage Temperature
-65 to +150 C
Operating Temperature
-40 to +85 C
Caution: Do not "Hot Switch" power levels greater than
+27 dBm (Vctl = 0/-5 Vdc).
NOTES:
1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY
3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB
LAND
PATTERN.
HMC232LP4
GaAs MMIC SPDT NON-REFLECTIVE
SWITCH, DC - 12.0 GHz
v02.0604
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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
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14
SWITCHES - SMT
Pin Descriptions
Suggested Driver Circuit
Pin Number
Function
Description
Interface Schematic
1, 2, 6, 7, 11, 12,
13, 14, 17, 18, 19,
20, 24
N/C
This pin should be connected to PCB RF ground to maximize
isolation.
3, 5, 8, 10, 21, 23
GND
Package bottom must also
be connected to PCB RF ground.
4, 9, 22
RFC, RF1, RF2
This pin is DC coupled and matched to 50 Ohm. Blocking
capacitors are required if RF line potential is not equal to 0V.
15
B
See truth table and control voltage table.
16
A
See truth table and control voltage table.
HMC232LP4
GaAs MMIC SPDT NON-REFLECTIVE
SWITCH, DC - 12.0 GHz
v02.0604
MICROWAVE CORPORATION
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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
SWITCHES - SMT
14
HMC232LP4
GaAs MMIC SPDT NON-REFLECTIVE
SWITCH, DC - 12.0 GHz
v02.0604
Evaluation PCB
The circuit board used in the fi nal application should be
generated with proper RF circuit design techniques. Signal
lines at the RF port should have 50 ohm impedance and
the package ground leads and package bottom should be
connected directly to the ground plane similar to that shown
above. The evaluation circuit board shown above is avail-
able from Hittite Microwave Corporation upon request.
List of Material
Item
Description
J1 - J3
PC Mount SMA RF Connector
J4 - J6
DC Pin
C1, C2
100 pF, 0603 Pkg.
U1
HMC232LP4 SPDT Switch
PCB*
107602 Evaluation PCB
* Circuit Board Material: Rogers 4350
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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
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14
SWITCHES - SMT
HMC232LP4
GaAs MMIC SPDT NON-REFLECTIVE
SWITCH, DC - 12.0 GHz
v02.0604
Notes:
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