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Электронный компонент: HT1621D

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HT1621
RAM Mapping 324 LCD Controller for I/O mC
Selection Table
HT162X
HT1620
HT1621
HT1622
HT16220
HT1623
HT1625 HT1626
COM
4
4
8
8
8
8
16
SEG
32
32
32
32
48
64
48
Built-in Osc.
Crystal Osc.
1
January 10, 2001
Features
Operating voltage : 2.4V~5.2V
Built-in 256kHz RC oscillator
External 32.768kHz crystal or 256kHz
frequency source input
Selection of 1/2 or 1/3 bias, and selection of
1/2 or 1/3 or 1/4 duty LCD applications
Internal time base frequency sources
Two selectable buzzer frequencies
(2kHz/4kHz)
Power down command reduces power
consumption
Built-in time base generator and WDT
Time base or WDT overflow output
8 kinds of time base/WDT clock sources
324 LCD driver
Built-in 324 bit display RAM
3-wire serial interface
Internal LCD driving frequency source
Software configuration feature
Data mode and command mode
instructions
R/W address auto increment
Three data accessing modes
VLCD pin for adjusting LCD operating
voltage
General Description
The HT1621 is a 128 pattern (324), memory
mapping, and multi-function LCD driver. The
S/W configuration feature of the HT1621
makes it suitable for multiple LCD applica-
tions including LCD modules and display sub-
systems. Only three or four lines are required
for the interface between the host controller
and the HT1621. The HT1621 contains a power
down command to reduce power consumption.
Block Diagram
Note: CS: Chip selection
BZ, BZ: Tone outputs
WR, RD, DATA: Serial interface
COM0~COM3, SEG0~SEG31: LCD outputs
IRQ: Time base or WDT overflow output
HT1621
2
January 10, 2001
W a t c h d o g T i m e r
a n d
T i m e B a s e G e n e r a t o r
D i s p l a y R A M
L C D D r i v e r /
B i a s C i r c u i t
C o n t r o l
a n d
T i m i n g
C i r c u i t
D A T A
W R
O S C O
O S C I
C S
R D
C O M 0
C O M 3
S E G 0
S E G 3 1
T o n e F r e q u e n c y
G e n e r a t o r
B Z
B Z
I R Q
V S S
V D D
V L C D
Pin Assignment
HT1621
3
January 10, 2001
S E G 7
S E G 6
S E G 5
S E G 4
S E G 3
S E G 2
S E G 1
S E G 0
C S
R D
W R
D A T A
V S S
O S C O
N C
O S C I
V D D / V L C D
I R Q
B Z
B Z
C O M 0
C O M 1
C O M 2
C O M 3
S E G 8
S E G 9
S E G 1 0
S E G 1 1
S E G 1 2
S E G 1 3
S E G 1 4
S E G 1 5
S E G 1 6
S E G 1 7
S E G 1 8
S E G 1 9
S E G 2 0
S E G 2 1
S E G 2 2
S E G 2 3
S E G 2 4
S E G 2 5
S E G 2 6
S E G 2 7
S E G 2 8
S E G 2 9
S E G 3 0
S E G 3 1
H T 1 6 2 1
4 8 S S O P
S E G 7
S E G 6
S E G 5
S E G 4
S E G 3
S E G 2
S E G 1
S E G 0
C S
R D
W R
D A T A
V S S
O S C O
O S C I
V L C D
V D D
I R Q
B Z
B Z
C O M 0
C O M 1
C O M 2
C O M 3
S E G 8
S E G 9
S E G 1 0
S E G 1 1
S E G 1 2
S E G 1 3
S E G 1 4
S E G 1 5
S E G 1 6
S E G 1 7
S E G 1 8
S E G 1 9
S E G 2 0
S E G 2 1
S E G 2 2
S E G 2 3
S E G 2 4
S E G 2 5
S E G 2 6
S E G 2 7
S E G 2 8
S E G 2 9
S E G 3 0
S E G 3 1
H T 1 6 2 1 B
4 8 S S O P / D I P
4 8
4 7
4 6
4 5
4 4
4 3
4 2
4 1
4 0
3 9
3 8
3 7
3 6
3 5
3 4
3 3
3 2
3 1
3 0
2 9
2 8
2 7
2 6
2 5
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
2 0
2 1
2 2
2 3
2 4
4 8
4 7
4 6
4 5
4 4
4 3
4 2
4 1
4 0
3 9
3 8
3 7
3 6
3 5
3 4
3 3
3 2
3 1
3 0
2 9
2 8
2 7
2 6
2 5
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
2 0
2 1
2 2
2 3
2 4
S E G 5
S E G 3
S E G 1
C S
R D
W R
D A T A
V S S
V L C D
V D D
I R Q
B Z
C O M 0
C O M 1
H T 1 6 2 1 D
2 8 S K D I P
S E G 7
S E G 9
S E G 1 1
S E G 1 3
S E G 1 5
S E G 1 7
S E G 1 9
S E G 2 1
S E G 2 3
S E G 2 5
S E G 2 7
S E G 2 9
S E G 3 1
C O M 2
2 8
2 7
2 6
2 5
2 4
2 3
2 2
2 1
2 0
1 9
1 8
1 7
1 6
1 5
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
Pad Assignment
Chip size: 127 129 (mil)
2
* The IC substrate should be connected to VDD in the PCB layout artwork.
HT1621
4
January 10, 2001
IR
Q
BZ
CS
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4 1 5
1 6 1 7 1 8
1 9
2 0
2 1
2 2
2 3
2 4
2 5
2 6
2 7
2 8
2 9
3 0
3 1
3 2
3 3
3 4
3 5
3 6
3 7
3 8
3 9
4 0
4 1
4 2
4 3
4 4
4 5
4 6
4 7
4 8
( 0 , 0 )
R D
W R
D A T A
V S S
O S C O
O S C I
V L C D
V D D
BZ
CO
M
0
CO
M
1
CO
M
2
CO
M
3
SEG
3
1
SEG
3
0
SEG
2
9
S E G 2 8
S E G 2 7
S E G 2 6
S E G 2 5
S E G 2 4
S E G 2 3
S E G 2 2
S E G 2 1
S E G 2 0
S E G 1 9
S E G 1 8
S E G 1 7
S E G 1 6
SEG
1
5
SEG
1
4
SEG
1
3
SEG
1
2
SEG
1
1
SEG
1
0
SEG
9
SEG
8
SEG
7
SEG
6
SEG
5
SEG
4
SEG
3
SEG
2
SEG
1
SEG
0
Pad Coordinates
Unit:mil
Pad No.
X
Y
Pad No.
X
Y
1
-55.04
59.46
25
58.14
-25.29
2
-58.52
22.18
26
58.14
-18.66
3
-58.52
15.56
27
58.14
-11.94
4
-58.52
5.36
28
58.14
-5.31
5
-58.52
-4.51
29
58.14
1.32
6
-58.52
-11.14
30
58.14
7.95
7
-58.52
-34.76
31
58.14
14.58
8
-58.52
-41.90
32
58.14
21.21
9
-58.52
-49.13
33
55.55
59.46
10
-58.52
-59.08
34
48.92
59.46
11
-44.07
-59.08
35
42.29
59.46
12
-31.58
-59.08
36
35.66
59.46
13
-20.70
-59.08
37
29.03
59.46
14
-13.98
-59.08
38
22.40
59.46
15
-7.05
-59.08
39
15.77
59.46
16
-0.34
-59.08
40
9.14
59.46
17
6.33
-59.08
41
2.42
59.46
18
12.96
-59.08
42
-4.21
59.46
19
19.59
-59.08
43
-10.84
59.46
20
58.14
-58.44
44
-17.47
59.46
21
58.14
-51.81
45
-24.10
59.46
22
58.14
-45.18
46
-30.73
59.46
23
58.14
-38.55
47
-38.17
59.46
24
58.14
-31.92
48
-45.39
59.46
HT1621
5
January 10, 2001