HI-3182, HI-3183, HI-3184, HI-3185

HI-3186, HI-3187, HI-3188

The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and
HI-3188 bus interface products are silicon gate CMOS devices
designed as a line driver in accordance with the ARINC 429 bus
specifications. In addition to being functional upgrades of Holt's
HI-8382 & HI-8383 products, they are also alternate sources for
the HS-3182 ( Intersil/Harris), the RM3182 (Fairchild /Raytheon)
and a variety of similar line driver products from other manufac-
turers.

Inputs are provided for clocking and synchronization. These
signals are AND'd with the DATA inputs to enhance system
performance and allow the HI-318X series of products to be
used in a variety of applications. Both logic and synchronization
inputs feature built-in 2,000V minimum ESD input protection as
well as TTL and CMOS compatibility.

The differential outputs of the HI-318X series of products are
programmable to either the high speed or low speed ARINC 429
output rise and fall time specifications through the use of two
external capacitors. The output voltage swing is also adjustable
by the application of an external voltage to the VREF input.
Products with 0, 13 or 37.5 ohm resistors in series with each
ARINC output are available. In addition, the

fuse in series with each

output.

The HI-318X series of line drivers are intended for use where
logic signals must be converted to ARINC 429 levels such as
when using an ASIC, the HI-3282/HI-8282A ARINC 429 Serial
Transmitter/Dual Receiver, the HI-6010 ARINC 429 Transmit-
ter/Receiver or the HI-8783 ARINC Interface Device.

Holt

products are readily available for both industrial and military
applications. Please contact the Holt Sales Department for
additional information.

HI-3182, HI-3184

and HI-3187 products also have a

PIN CONFIGURATION

(Top View)

GENERAL DESCRIPTION

!
!
!

Low power CMOS

TTL and CMOS compatible inputs

Programmable output voltage swing

Plastic 14 & 16-pin thermally enhanced SOIC
packages available

Pin-for-Pin alternative for Intersil/Fairchild

applications

Operates at data rates up to 100 Kbits

Overvoltage protection

Industrial and Military temperature ranges

!
!

Adjustable ARINC rise and fall times

FEATURES

HI-3184PS, HI-3185PS, HI-3186PS

& HI-3187PS

14 - PIN PLASTIC SMALL OUTLINE (ESOIC)

FUNCTION

ARINC 429 DIFFERENTIAL LINE DRIVER

TRUTH TABLE

SYNC CLOCK DATA(A) DATA(B) AOUT

BOUT COMMENTS

NULL

-V

LOW

-V

HIGH

NULL

REF

February 2003

ARINC 429 DIFFERENTIAL LINE DRIVER

14 V

13 CLOCK

12 DATA (B)

11 C

10 B

GND

OUT

GND (See Note * )

SYNC

DATA (A)

-V

REF

OUT

(See Page 6 for additional package pin configurations)

Notes: * Pin 2 may be left floating

** Thermally Enhanced SOIC Package

(DS3182 Rev. D )

02/03

HOLT INTEGRATED CIRCUITS

www.holtic.com

FUNCTIONAL DESCRIPTION

The SYNC and CLOCK inputs establish data synchronization
utilizing two AND gates, one for each data input (figure 2).
Each logic input, including the power enable (

) input,

are TTL/CMOS compatible.

Figure 1 illustrates a typical ARINC 429 bus application.
Three power supplies are necessary to operate the HI-3182;
typically +15V, -15V and +5V. The chip also works with �12V
supplies. The +5V supply can also provide a reference
voltage that determines the output voltage swing.

The

differential output voltage swing will equal 2V

. If a value of

other than +5V is needed, a separate +5V power supply

is required for pin V .

With the DATA (A) input at a logic high and DATA (B) input at a
logic low, A

will switch to the +V

rail and B

will

switch to the -V

rail (ARINC HIGH state). With both data

input signals at a logic low state, the outputs will both switch to
0V (ARINC NULL state).

The driver output impedance, R

, is nominally 75, 26 or 0

ohms depending on the option chosen. The rise and fall times
of the outputs can be calibrated through the selection of two
external capacitor values th

re connected to the C and C

input pins. Typical values for high-speed operation
(100KBPS) are C = C = 75pF and for low-speed operation
(12.5 to 14KBPS) C = C = 500pF.

STROBE

REF

OUT

REF

OUT

REF

OUT

at a

The C and C pins swing between +5V and ground allowing
the switching of capacitor values with an external single-
supply analog switch.

The ARINC outputs can be put in a tri-state mode by applying
a logic high to the

input pin. If this feature is not

being used, the pin should be tied to ground. The

STROBE

function is not available in the 14 & 16-pin SOIC package
configurations where the pin is internally connected to
ground.

The ARINC outputs of the HI-3182, HI-3184 and HI-3187 are
protected by internal fuses capable of sinking between 800 -
900 mA for short periods of time (125 s).

The Vref pin has an internal pull-up resistor to V+, allowing the
use of a simple external zener diode to set the reference
voltage.

POWER SUPPLY SEQUENCING

The power supplies should be controlled to prevent large
currents during supply turn-on and turn-off. The
recommended sequence is +V followed by V , always
ensuring that +V is the most positive supply. The -V supply
is not critical and can be asserted at any time.

HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188

DATA (A)

OUT

DATA (B)

INPUTS

TO ARINC BUS

OUT

REF

SYNC

CLOCK

-V

STROBE

GND

-15V

+15V

+5V

Figure 1.

ARINC 429 BUS APPLICATION

Figure 2.

FUNCTIONAL BLOCK DIAGRAM

OUT

Shorted on

HI-3186, HI-3187, HI-3188

REF

OUT

OUTPUT

DRIVER (B)

OUTPUT

DRIVER (A)

GND

-V

DATA (A)

DATA (B)

SYNC

CLOCK

STROBE

LEVEL SHIFTER

AND SLOPE

CONTROL (B)

LEVEL SHIFTER

AND SLOPE

CONTROL (A)

CURRENT

REGULATOR

24.5

Shorted on

HI-3183, HI-3186
HI-3187, HI-3188

Shorted on

HI-3183, HI-3185
HI-3186, HI-3188

24.5

HOLT INTEGRATED CIRCUITS

SYMBOL

FUNCTION

DESCRIPTION

ANALOG

Ref. voltage used to determine output voltage swing. Pin sources current to allow use of a zener reference.

INPUT

A logic high tri-states the ARINC outputs. Not available in the 14-pin SOIC package (tied to GND internally).

SYNC

INPUT

Synchronizes data inputs

DATA (A)

INPUT

Data input terminal A

INPUT

Connection for DATA (A) slew-rate capacitor

OUTPUT

ARINC output terminal A

-V

POWER

-12V to -15V

GND

POWER

0.0V

POWER

+12V to +15V

OUTPUT

INPUT

DATA (B)

INPUT

CLOCK

INPUT

Synchronizes data inputs

POWER

+5V �5%

REF

OUT

STROBE

ARINC output terminal

Connection for DATA (B) slew-rate capacitor

Data input terminal

PARAMETER

SYMBOL

CONDITIONS

OPERATING RANGE

MAXIMUM

UNIT

Differential Voltage

Voltage between +V and -V terminals

Supply Voltage

+10.8 to +16.5

-V

-10.8 to -16.5

+5 �5%

Voltage Reference

For ARINC 429

+5 �5%

For Applications other than ARINC

1.5 to 6

Input Voltage Range

GND -0.3

V1 +0.3

Output Short-Circuit Duration

See Note: 1

Output Overvoltage Protection

See Note: 2

Operating Temperature Range

High-temp & Military

-55 to +125

�C

Industrial

-40 to +85

�C

Storage Temperature Range

Ceramic & Plastic

-65 to +150

�C

Lead Temperature

Soldering, 10 seconds

+275

�C

Junction Temperature

+175

�C

Note 1. Heatsinking may be required for continuous Output Short Circuit at +125�C and for 100KBPS at +125�C.
Note 2. The fuses used for Output Overvoltage Protection may be blown by the presence of a voltage at either output that is greater

than �12.0V with respect to GND. (HI-3182, 3184 & 3187 only)

DIF

REF

STG

ABSOLUTE MAXIMUM RATINGS

All Voltages referenced to GND, TA = Operating Temperature Range (unless otherwise specified)

PIN DESCRIPTIONS

NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188

HOLT INTEGRATED CIRCUITS

PARAMETER

SYMBOL

CONDITION

MIN

TYP

MAX UNITS

Supply Current +V (Operating)

(+V)

No Load

(0 - 100KBPS)

+16

Supply Current -V (Operating)

(-V)

No Load

(0 - 100KBPS)

-16

Supply Current

(Operating)

(

)

No Load

(0 - 100KBPS)

500

�A

Reference Pin Current

(Operating)

(

)

No Load,

REF = 5V (0 - 100KBPS)

-1.0

-0.63

-0.5

Supply Current +V (During Short Circuit Test)

(+V)

Short to Ground

(See Note: 1)

150

Supply Current -V (During Short Circuit Test)

(-V)

Short to Ground

(See Note: 1)

-150

Output Short Circuit Current (Output High)

Short to Ground

=0 (See Note: 2)

-80

Output Short Circuit Current (Output Low)

Short to Ground

=0 (See Note: 2)

+80

Input Current (Input High)

1.0

�A

Input Current (Input Low)

-1.0

�A

Input Voltage High

2.0

Input Voltage Low

0.5

Output Voltage High (Output to Ground)

No Load

(0 -100KBPS)

Output Voltage Low (Output to Ground)

No Load

(0 -100KBPS)

-V

Output Voltage Null

No Load

(0-100KBPS)

-250

+250

Input Capacitance

CCOP

REF

CCOP

REF

OHSC

MIN

OLSC

MIN

NULL

See Note 1

REF

Note 1. Not tested, but characterized at initial device design and after major process and/or design change which affects this parameter.
Note 2. Interchangeability of force and sense is acceptable.

DC ELECTRICAL CHARACTERISTICS

AC ELECTRICAL CHARACTERISTICS

+V = +15V, -V = -15V, V = V

= +5.0V, T

= Operating Temperature Range (unless otherwise specified).

REF

PARAMETER

SYMBOL

CONDITION

MIN

TYP

MAX UNITS

Rise Time (

)

= 75pF

See Figure 3.

1.0

2.0

�s

Fall Time (

)

= 75pF

See Figure 3.

1.0

2.0

�s

Propagtion Delay Input to Output

= 75pF

See Figure 3.

3.0

�s

Propagtion Delay Input to Output

= 75pF

See Figure 3.

3.0

�s

OUT

PLH

PHL

Figure 3. SWITCHING WAVEFORMS

-9.5V to -10.5V

+9.5V to +10.5V

-4.75V to -5.25V

2.0V

+4.75V to +5.25V

2.0V

0.5V

-4.75V to -5.25V

+4.75V to +5.25V

DATA (A) 0V

DATA (B) 0V

OUT

DIFFERENTIAL

OUTPUT 0V

(

)

OUT -

OUT

50%

REF

ADJUST

PHL

ADJUST

-V

REF

50%

PLH

REF

-V

REF

ADJUST

REF

-2V

REF

HIGH

NULL

LOW

NOTE: OUTPUTS UNLOADED

+V = +15V, -V = -15V, V = V

= +5.0V, T

= Operating Temperature Range (unless otherwise specified).

REF

HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188

HOLT INTEGRATED CIRCUITS

Notes:

1. All data taken

on devices soldered to a single layer copper PCB (3" X 4.5" X .062").

2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF

as this is considered unrealistic for high speed operation.

4. Similar results would be obtained with A

shorted to B

5. For applications requiring survival with continuous short circuit, operation above Tj = 175�C is not recommended.
6. Data will vary depending on air flow and the method of heat sinking employed.

in still air

OUT

HI-318X PACKAGE THERMAL CHARACTERISTICS

JUNCTION TEMPERATURE, Tj

A = 25

A = 85

A=125

Unsoldered

57�C

117�C

157�C

Soldered

51�C

111�C

151�C

Unsoldered

45�C

105�C

145�C

Soldered

36�C

96�C

136�C

JUNCTION TEMPERATURE, Tj

A = 25

A = 85

A=125

Unsoldered

87�C

147�C

187�C

Soldered

78�C

138�C

178�C

Unsoldered

64�C

124�C

164�C

Soldered

53�C

113�C

153�C

PACKAGE STYLE

MAXIMUM ARINC LOAD

3, 6

OUT

and B

OUT

Shorted to Ground

3, 4, 5, 6

HEAT SINK

PACKAGE STYLE

SUPPLY CURRENT

20 mA

�

(�C/W )

14-pin Thermally

Enhanced Plastic

SOIC (ESOIC)

20 mA

�

(�C/W )

SUPPLY CURRENT

16-pin Thermally

Enhanced Plastic

SOIC (ESOIC)

14-pin Thermally

Enhanced Plastic

SOIC (ESOIC)

36 mA

16-pin Thermally

Enhanced Plastic

SOIC (ESOIC)

40 mA

HEAT SINK - ESOIC PACKAGES

Both the 14-pin and 16-pin thermally enhanced SOIC
packages are used for HI-318X products. These ESOIC
packages include a metal heat sink located on the bottom
surface of the device. This heat sink should be soldered
down to the printed circuit board for optimum thermal

dissipation. The heat sink is electrically isolated from the
chip and can be soldered to any ground or power plane.
However, since the chip's substrate is at +V, connecting
the heat sink to this power plane is recommended to avoid
coupling noise into the circuit.

HOLT INTEGRATED CIRCUITS

HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188

ADDITIONAL PIN CONFIGURATIONS

(See page 1 for 14-Pin Small Outline SOIC)

VREF

STROBE

SYNC

DATA(A)

AOUT

-V

GND

N/C

BOUT

DATA(B)

CLOCK

N/C

1
2
3
4
5
6
7
8

HI-3182CD
HI-3183CD

16 - PIN

CERAMIC

SIDE BRAZED

DIP

- 1

GND (See Note * ) - 2

SYNC - 3

DATA(A) - 4

- 5

- 6

-V - 7

GND - 8

REF

OUT

16 - V

15 - N/C

14 - CLOCK

13 - DATA(B)

12 - C

11 - B

10 - N/C

9 - +V

OUT

HI-3182PS, HI-3183PS, HI-3188PS

Notes:

** Thermally Enhanced SOIC package

* Pin 2 may be left floating

HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188

VREF

STROBE

SYNC

DATA(A)

AOUT

-V

GND

N/C

BOUT

DATA(B)

CLOCK

N/C

1
2
3
4
5
6
7
8

HI-3182CR
HI-3183CR

16 - PIN

CERDIP

8 9 10 11 12 13

N/C
N/C
+V
GND
N/C
-V
N/C

CLOCK

N/C

SYNC

N/C

REF

STROBE

N/C

A(B)

N/C

OUT

N/C

A(A)

N/C

OUT

HI-3182CJ
HI-3183CJ

29 28 27 26 25 24 23 22 21

32 - PIN CERQUAD

1 28 27 26

12 13 14 15 16 17 18

CLOCK

N/C

DATA (B)

N/C

DATA (A)

N/C

SYNC

N/C

STROBE

REF

N/C

-V

GND

N/C

OUT

HI-3182CL
HI-3183CL

28 - PIN CERAMIC LCC

16 - PIN PLASTIC SMALL OUTLINE (ESOIC)**

CLOCK
N/C
DATA (B)
C
N/C
N/C
N/C

12 13 14 15 16 17 18

N/C

DATA (A)

N/C
N/C

HI-3182PJ
HI-3183PJ

1 28 27 26

SYNC

N/C

STROBE

REF

N/C

-V

GND

N/C

OUT

28 - PIN PLASTIC PLCC

HOLT INTEGRATED CIRCUITS

ORDERING INFORMATION

Legend:

- Narrow Body

ESOIC - Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink)

- Wide Body

HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188

NUMBER

PACKAGE DESCRIPTION

RANGE

RESISTANCE FUSE

FLOW

FINISH

PART

TEMPERATURE

BURN

LEAD

OUTPUT SERIES

HI-3182CDI

16 PIN CERAMIC SIDE BRAZED DIP

-40�C T0 +85�C

37.5

YES

GOLD

HI-3182CDT

16 PIN CERAMIC SIDE BRAZED DIP

-55�C T0 +125�C

37.5

YES

GOLD

HI-3182CDM 16 PIN CERAMIC SIDE BRAZED DIP

-55�C T0 +125�C

37.5

YES

SOLDER

HI-3182CJI

32 PIN J-LEAD CERQUAD

-40�C T0 +85�C

37.5

YES

SOLDER

HI-3182CJT

32 PIN J-LEAD CERQUAD

-55�C T0 +125�C

37.5

YES

SOLDER

HI-3182CLI

28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC)

-40�C T0 +85�C

37.5

YES

GOLD

HI-3182CLT

28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC)

-55�C T0 +125�C

37.5

YES

GOLD

HI-3182CLM

28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC)

-55�C T0 +125�C

37.5

YES

SOLDER

HI-3182CRI

32 PIN CERDIP

-40�C T0 +85�C

37.5

YES

SOLDER

HI-3182CRT

32 PIN CERDIP

-55�C T0 +125�C

37.5

YES

SOLDER

HI-3182PJI

28 PIN PLASTIC J-LEAD PLCC

-40�C T0 +85�C

37.5

YES

SOLDER

HI-3182PJT

28 PIN PLASTIC J-LEAD PLCC

-55�C T0 +125�C

37.5

YES

SOLDER

HI-3182PSI

16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)

-40�C T0 +85�C

37.5

YES

SOLDER

HI-3182PST

16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)

-55�C T0 +125�C

37.5

YES

SOLDER

HI-3183CDI

16 PIN CERAMIC SIDE BRAZED DIP

-40�C T0 +85�C

GOLD

HI-3183CDT

16 PIN CERAMIC SIDE BRAZED DIP

-55�C T0 +125�C

GOLD

HI-3183CDM 16 PIN CERAMIC SIDE BRAZED DIP

-55�C T0 +125�C

YES

SOLDER

HI-3183CJI

32 PIN J-LEAD CERQUAD

-40�C T0 +85�C

SOLDER

HI-3183CJT

32 PIN J-LEAD CERQUAD

-55�C T0 +125�C

SOLDER

HI-3183CLI

28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC)

-40�C T0 +85�C

GOLD

HI-3183CLT

28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC)

-55�C T0 +125�C

GOLD

HI-3183CLM

28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC)

-55�C T0 +125�C

YES

SOLDER

HI-3183CRI

32 PIN CERDIP

-40�C T0 +85�C

SOLDER

HI-3183CRT

32 PIN CERDIP

-55�C T0 +125�C

SOLDER

HI-3183PJI

28 PIN PLASTIC J-LEAD PLCC

-40�C T0 +85�C

SOLDER

HI-3183PJT

28 PIN PLASTIC J-LEAD PLCC

-55�C T0 +125�C

SOLDER

HI-3183PSI

16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)

-40�C T0 +85�C

SOLDER

HI-3183PST

16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)

-55�C T0 +125�C

SOLDER

HI-3184PSI