HI-8585, HI-8586

ARINC 429 LINE DRIVER

DESCRIPTION

Direct ARINC 429 line driver interface
in a small package

On-chip zener to set output levels

On-chip line driver slope control and
selection by logic input

Low current 12 to 15 volt supplies

CMOS / TTL logic pins

Plastic and ceramic package options -
surface mount and DIP

!
!

Thermally enhanced SOIC packages

Mil processing available

FEATURES

PIN CONFIGURATION

SLP1.5

TX0IN

TX1IN

GND

V-

TXAOUT

TXBOUT

V+

SUPPLY VOLTAGES

FUNCTION TABLE

The HI-8585 and HI-8586 are CMOS integrated circuits
designed to directly drive the ARINC 429 bus in an 8-pin
package. Two logic inputs control a differential voltage
between the output pins producing a +10 volt One, a
-10 volt Zero, and a 0 volt Null.

The CMOS/TTL control inputs are translated to ARINC
specified amplitudes using on board zeners. A logic input
is provided to control the slope of the differential output
signal. Timing is set by on-chip resistor and capacitor and
tested to be within ARINC requirements.

The HI-8585 has 37.5 ohms in series with each line driver
output. The HI-8586 provides the option to bypass most of
the output resistance so that external series protection
circuits can add their resistances.

The HI-8585 or the HI-8586 along with the HI-8588 line
receiver offer the smallest options available to get on and
off the ARINC bus.

PIN DESCRIPTION TABLE

V+ =

12V to 15V

V- =

-12V to -15V

2
3
4

February 2003

www.holtic.com

02/03

(DS8585 Rev. F)

PIN

SLP 1.5

TX0IN

TX1IN

GND

V-

TXAOUT

TXBOUT

V+

SYMBOL

LOGIC INPUT

POWER

OUTPUT

POWER

FUNCTION

CMOS OR TTL, V+ IS OK

CMOS OR TTL

GROUND

-12 TO -15 VOLTS

LINE DRIVER TERMINAL A

LINE DRIVER TERMINAL B

+12 TO +15 VOLTS

DESCRIPTION

TX1IN TX0IN SLP1.5

TXAOUT

TXBOUT

SLOPE

-5V

N/A

10 s

1.5 s

10 s

1.5 s

N/A

HOLT INTEGRATED CIRCUITS

Figure 2 shows a possible application
of the HI-8585/86 interfacing an ARINC
transmit channel from the HI-6010.

HI-8585, HI-8586

FUNCTIONAL DESCRIPTION

TXAOUT

CURRENT
CONTROL

-5V

ONE

NULL

ZERO

CONTROL

LOGIC

TXBOUT

CURRENT
CONTROL

-5V

SLP1.5

ESD

PROTECTION

AND

VOLTAGE

TRANSLATION

TX0IN

TX1IN

FIGURE 1 - LINE DRIVER BLOCK DIAGRAM

HI-8585 = 37.5 OHMS
HI-8586 = < 5 OHMS

ONE

NULL

ZERO

CONTROL

LOGIC

"A" SIDE

"B" SIDE

GND

TXBOUT

TXAOUT

TX1IN

TX0IN

ARINC
Channel

RINB

RINA

TESTA

TESTB

{

HARDWIRED

DRIVEN FROM LOGIC

ROUTB

ROUTA

VCC

V-

-15V

SLP1.5

TXD0

TXD1

RXD0

RXD1

HI-6010

8 BIT BUS

ARINC
Channel

HI-8588

FIGURE 2 - APPLICATION DIAGRAM

APPLICATION INFORMATION

15V

V+

HI-8585

Figure 1 is a block diagram of the line driver. The +5V and
-5V levels are generated internally using on-chip zeners.
Currents for slope control are set by zener voltages across
on-chip resistors.

The TX0IN and TX1IN inputs receive logic signals from a
control transmitter chip such as the HI-6010, HI-3282 or
HI-8282. TXAOUT and TXBOUT hold each side of the
ARINC bus at Ground until one of the inputs becomes a
One. If for example TX1IN goes high, a charging path is
enabled to 5V on an "A" side internal capacitor while the
"B" side is enabled to -5V. The charging current is se-
lected by the SLP1.5 pin. If the SLP1.5 pin is high, the
capacitor is nominally charged from 10% to 90% in 1.5�s.
If SLP1.5 is low, the rise and fall times are 10�s.

A unity gain buffer receives the internally generated slopes
and differentially drives the ARINC line. Current is limited
by the series output resistors at each pin. There are no
fuses at the outputs of the HI-8585 as exists on the HI-
8382.

The HI-8585 has 37.5 ohms in series with each output.
The HI-8586 has less than 5 ohms in series. The HI-8586
is for applications where external series resistance is re-
quired, typically for lightning protection devices.

Both the HI-8585 and HI-8586 are built using high-speed
CMOS technology. Care should be taken to ensure the
V+ and V- supplies are locally decoupled and that the
input waveforms are free from negative voltage spikes
which may upset the chip's internal slope control circuitry.

HOLT INTEGRATED CIRCUITS

NOTE: Stresses above absolute maximum
ratings or outside recommended operating
conditions may cause permanent damage to
the device.

These are stress ratings only.

Operation at the limits is not recommended.

HI-8585, HI-8586

Voltages referenced to Ground

Supply voltages

V+....................................................20V
V-....................................................-20V

DC current per input pin................ +10mA

Power dissipation at 25�C

plastic DIL............1.0W, derate 10mW/�C
ceramic DIL..........0.5W, derate 7mW/�C

Solder Temperature ........275�C for 10 sec

Storage Temperature........-65�C to +150�C

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

Supply Voltages

V+....................+12V � 5% or +15V �10%
V-..................... -12V � 5% or -15V �10%

Temperature Range

Industrial Screening.........-40�C to +85�C
Hi-Temp Screening........-55�C to +125�C
Military Screening..........-55�C to +125�C

DC ELECTRICAL CHARACTERISTICS

V+ = +12V to +15V, V- = -12V to -15V, T = Operating Temperature Range (unless otherwise stated)

PARAMETERS

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Input voltage (TX1IN, TX0IN, SLP1.5)

high

2.1

V+

volts

low

0.5

volts

Input current (TX1IN, TX0IN, SLP1.5)

source

= 0V

0.1

sink

= 5V

0.1

ARINC output voltage (Differential)

zero

no load

-11.00

-10.00

-9.00

volts

null

no load

-0.50

0.50

volts

V+

6.0

14.0

V-

-14.0

-6.0

ARINC output impedence

HI-8585

37.5

ohms

HI-8586

ohms

DIFF0

DIFFN

OUT

one

no load; TXAOUT - TXBOUT

9.00

10.00

11.00

volts

; TXAOUT - TXBOUT
; TXAOUT - TXBOUT

ARINC output voltage (Ref. to GND)

one or zero

no load & magnitude at pin

4.50

5.00

5.50

volts

null

no load

-0.25

0.25

volts

Operating supply current

DIFF1

DOUT

NOUT

SLP1.5 = V+
TX1IN & TX0IN = 0V: no load

IN & TX1IN = 0V: no load

TX0

HOLT INTEGRATED CIRCUITS

V+ = 15.0V, V- = -15V, T = Operating Temperature Range (unless otherwise stated)

defined in Figure 3, no load

pin 1 = logic 1

Input capacitance (1)

HI-8585, HI-8586

AC ELECTRICAL CHARACTERISTICS

PARAMETERS

SYMBOL TEST CONDITIONS

MIN

TYP

MAX

UNITS

Line Driver propagation delay

Output high to low

Output low to high

Line Driver transition times

Output high to low

Output low to high

t phlx

plhx

t fx

1.0

2.0

500

1.5

logic

CIN

pin 1 = logic 1

Notes:

1. Guaranteed but not tested

FIGURE 3 - LINE DRIVER TIMING

10V

-10V

t rx

10%

90%

t
t

10%

90%

t rx

phlx

plhx

10%

plhx

pin 3

pin 2

t fx

pin 6 - pin 7

DIFF

SLP 1.5 = V+

HOLT INTEGRATED CIRCUITS

HI-8585, HI-8586

Notes:

1. All data taken in still air on devices soldered to single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF

as this is considered unrealistic for high speed operation.

5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered to the PCB.
6. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink soldered to the PCB.
7. Similar results would be obtained with TXAOUT shorted to TXBOUT.
8. For applications requiring survival with continuous short circuit, operation above Tj = 175�C is not recommended.
9. Data will vary depending on air flow and the method of heat sinking employed.

PACKAGE THERMAL CHARACTERISTICS

SUPPLY CURRENT (mA)

JUNCTION TEMP, Tj (�C)

Ta = 25

Ta = 85

Ta=125

Ta = 25

Ta = 85

Ta=125

Low Speed

16.8

17.2

16.9

116

157

High Speed

27.3

26.7

25.9

132

169

Low Speed

17.4

17.5

16.9

126

166

High Speed

27.6

27.1

25.9

147

186

Low Speed

17.1

17.2

16.7

110

151

High Speed

27.3

27.1

26.2

112

157

SUPPLY CURRENT (mA)

JUNCTION TEMP, Tj (�C)

Ta = 25

Ta = 85

Ta=125

Ta = 25

Ta = 85

Ta=125

Low Speed

53.6

50.7

52.2

131

181

217

High Speed

46.9

38.7

42.5

135

181

219

Low Speed

46.4

47.6

68.1

167

191

221

High Speed

42.1

43.8

67.1

177

212

223

Low Speed

48.5

45.6

46.1

112

161

186

High Speed

46.8

41.1

40.5

116

168

197

8 Lead Plastic ESOIC

ARINC 429

DATA RATE

ARINC 429

DATA RATE

PACKAGE STYLE

8 Lead Plastic DIP

8 Lead Plastic ESOIC

PACKAGE STYLE

MAXIMUM ARINC LOAD

TXAOUT and TXBOUT Shorted to Ground

7, 8, 9

HEAT SINK - ESOIC PACKAGES

An 8-pin thermally enhanced SOIC package is used for the
HI-8585/HI-8586 products. The ESOIC package includes
a metal heat sink located on the bottom surface of the
device. This heat sink should be soldered down to the
printed circuit board for optimum thermal dissipation. The

heat sink is electrically isolated from the chip and can be
soldered to any ground or power plane. However, since
the chip's substrate is at V+, connecting the heat sink to
this power plane is recommended to avoid coupling noise
into the circuit.

HOLT INTEGRATED CIRCUITS

HI-8585, HI-8586

ORDERING INFORMATION

Legend:

- Narrow Body

ESOIC - Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink)

PART

PACKAGE

TEMPERATURE

FLOW

BURN

LEAD

NUMBER

DESCRIPTION

RANGE

FINISH

HI-8585PDI

8 PIN PLASTIC DIP

-40�C T0 +85�C

SOLDER

HI-8585PDT

8 PIN PLASTIC DIP

-55�C T0 +125�C

SOLDER

HI-8585PDM

8 PIN PLASTIC DIP

-55�C T0 +125�C

YES

SOLDER

HI-8585PSI

8 PIN PLASTIC ESOIC - NB

-40�C T0 +85�C

SOLDER

HI-8585PST

8 PIN PLASTIC ESOIC - NB

-55�C T0 +125�C

SOLDER

HI-8585PSM

8 PIN PLASTIC ESOIC - NB

-55�C T0 +125�C

YES

SOLDER

HI-8585CRI

8 PIN CERDIP

-40�C T0 +85�C

SOLDER

HI-8585CRT

8 PIN CERDIP

-55�C T0 +125�C

SOLDER

HI-8585CRM

8 PIN CERDIP

-55�C T0 +125�C

YES

SOLDER

HI-8586PDI

8 PIN PLASTIC DIP

-40�C T0 +85�C

SOLDER

HI-8586PDT

8 PIN PLASTIC DIP

-55�C T0 +125�C

SOLDER

HI-8586PDM

8 PIN PLASTIC DIP

-55�C T0 +125�C

YES

SOLDER

HI-8586PSI

8 PIN PLASTIC ESOIC - NB

-40�C T0 +85�C

SOLDER

HI-8586PST

8 PIN PLASTIC ESOIC - NB

-55�C T0 +125�C

SOLDER

HI-8586PSM

8 PIN PLASTIC ESOIC - NB

-55�C T0 +125�C

YES

SOLDER

HI-8586CRI

8 PIN CERDIP

-40�C T0 +85�C

SOLDER

HI-8586CRT

8 PIN CERDIP

-55�C T0 +125�C

SOLDER

HI-8586CRM

8 PIN CERDIP

-55�C T0 +125�C

YES

SOLDER

HOLT INTEGRATED CIRCUITS

HI-8585 / HI-8586 PACKAGE DIMENSIONS

inches (millimeters)

HOLT INTEGRATED CIRCUITS

8-PIN PLASTIC DIP

Package Type: 8P

.385 � .015

(4.699 � .381)

7� TYP.

.025 � .010

(.635

.254)

�

.335 � .035

(8.509 � .889)

.250

.010

�

(6.350 � .254)

.100 � .010

(3.540 � .254)

.135 � .015

(3.429 � .381)

.055 � .010

(1.397 � .254)

.1375 � .0125

(3.493 � .318)

.019 � .002

(.483 � .102)

.0115 � .0035

(.292 � .089)

.300 � .010

(7.620 � .254)

ETAIL

8-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)

.033 � .017

(.8382 � .4318)

.050 � .010

(1.27 � .254)

Package Type:

0� to 8�

8HNE

P 1

ETAIL

Top View

Bottom View

.1535 � .0035

(3.90 � .09)

.1935 � .0035

(4.915 � .085)

.236 � .008

(5.994 � .203)

.0085 � .0015

(.2159 � .0381)

.0165 � .0035

(.4191 � .0889)

.140 � .010

(3.556 � .254)

.100 � .010

(2.540 � .254)

.0025 � .0015

(.0635 � .0381)

.055 � .005

(1.397 � .127)

Electrically isolated metal

heat sink on bottom of

package

(Connect to any ground or

power plane for optimum

thermal dissipation)

Электронный компонент: HI-8585PDM