HI-8585, HI-8586
ARINC 429 LINE DRIVER
DESCRIPTION
!
Direct ARINC 429 line driver
interface in a small package
On-chip zener to set output levels
On-chip line driver slope control and
selection by logic input
Low current 12 to 15 volt supplies
CMOS / TTL logic pins
Plastic and ceramic package options -
surface mount and DIP
!
!
!
!
!
!
!
Themally enhanced SOIC packages
Mil processing available
FEATURES
PIN CONFIGURATION
SLP1.5
TX0IN
TX1IN
GND
V-
TXAOUT
TXBOUT
V+
SUPPLY VOLTAGES
FUNCTION TABLE
The HI-8585 and HI-8586 are CMOS integrated circuits
designed to directly drive the ARINC 429 bus in an 8 pin
package. Two logic inputs control a differential voltage
between the output pins producing a +10 volt One, a
-10 volt Zero, and a 0 volt Null.
The CMOS/TTL control inputs are translated to ARINC
specified amplitudes using on board zeners. A logic input
is provided to control the slope of the differential output
signal. Timing is set by on-chip resistor and capacitor and
tested to be within ARINC requirements.
The HI-8585 has 37.5 ohms in series with each line driver
output. The HI-8586 provides the option to bypass most
of the output resistance so that series protection circuits
can add their resistances.
The HI-8585 or the HI-8586 along with the HI-8588 line
receiver offer the smallest options available to get on and
off the ARINC bus.
PIN DESCRIPTION TABLE
V+ =
12V to 15V
V- = -12V to -15V
1
2
3
4
5
6
7
8
January 2001
P IN
1
SLP1.5
LOGIC INPUT
CMOS OR TTL, V+ IS OK
2
TX0IN
LOGIC INPUT
CMOS OR TTL
3
TX1IN
LOGIC INPUT
CMOS OR TTL
4
GND
POWER
GROUND
5
V-
POWER
-12 TO -15 VOLTS
6
TXAOUT
LOGIC OUTPUT
LINE DRIVER TERM INAL A
7
TXBOUT
LOGIC OUTPUT
LINE DRIVER TERM INAL B
8
V+
POWER
+12 TO +15 VOLTS
SYM B O L
FUNCTION
DESCRIP T ION
TX1IN
TX0IN
SLP1.5
0
0
X
0V
0V
0
1
0
-5V
5V
10s
0
1
1
-5V
5V
1.5s
1
0
0
5V
-5V
10s
1
0
1
5V
-5V
1.5s
1
1
X
0V
0V
N /A
SLOPE
N /A
TXAOUT
TXBOUT
(DS8585 Rev. D)
01/01
HOLT INTEGRATED CIRCUITS
1
Figure 2 shows a possible application
of the HI-8585/86 interfacing an ARINC
transmit channel from the HI-6010.
8
HI-8585, HI-8586
FUNCTIONAL DESCRIPTION
TXAOUT
CURRENT
CONTROL
-5V
5V
ONE
NULL
ZERO
CONTROL
LOGIC
TXBOUT
CURRENT
CONTROL
-5V
5V
SLP1.5
ESD
PROTECTION
AND
VOLTAGE
TRANSLATION
FIGURE 1 - LINE DRIVER BLOCK DIAGRAM
HI-8585 = 37.5 OHMS
HI-8586 = 10.0 OHMS
HI-8585 = 37.5 OHMS
HI-8556 = 10.0 OHMS
ONE
NULL
ZERO
CONTROL
LOGIC
1
2
8
6
7
4
3
4
5
6
7
2
3
FIGURE 2 - APPLICATION DIAGRAM
APPLICATION INFORMATION
1
5
Figure 1 is a block diagram of the line driver. The +5V and
-5V levels are generated internally using on-chip zeners.
Currents for slope control are set by zener voltages across
on-chip resistors.
The TX0IN and TX1IN inputs receive logic signals from a
control transmitter chip such as the HI-6010 or HI-8282.
TXAOUT and TXBOUT hold each side of the ARINC bus at
Ground until one of the inputs becomes a One. If for exam-
ple TX1IN goes high, a charging path is enabled to 5V on an
"A" side internal capacitor while the "B" side is enabled to
-5V. The charging current is selected by the SLP1.5 pin. If
the SLP1.5 pin is high, the capacitor is nominally charged
from 10% to 90% in 1.5s. If SLP1.5 is low, the rise and fall
times are 10s.
A unity gain buffer receives the internally generated slopes
and differentially drives the ARINC line. Current is limited
by the series output resistors at each pin. There are no
fuses at the outputs of the HI-8585 as exists on the HI-8382.
The HI-8585 has 37.5 ohms in series with each output. The
HI-8586 has 10 ohms in series. The HI-8586 is for applica-
tions where more series resistance is added externally,
typically for lightning protection devices.
HOLT INTEGRATED CIRCUITS
2
"A" SIDE
"B" SIDE
NOTE: Stresses above absolute maximum
ratings or outside recommended operating
conditions may cause permanent damage to
the device.
These are stress ratings only.
Operation at the limits is not recommended.
HI-8585, HI-8586
Voltages referenced to Ground
Supply voltages
V+....................................................20V
V-....................................................-20V
DC current per input pin................ +10mA
Power dissipation at 25C
plastic DIL............1.0W, derate 10mW/C
ceramic DIL..........0.5W, derate 7mW/C
Solder Temperature ........275C for 10 sec
Storage Temperature........-65C to +150C
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
Supply Voltages
V+....................+12V 5% or +15V 10%
V-..................... -12V 5% or -15V 10%
Temperature Range
Industrial Screening.........-40C to +85C
Hi-Temp Screening........-55C to +125C
Military Screening..........-55C to +125C
DC ELECTRICAL CHARACTERISTICS
NOTE :
1. The output resistance is checked by measuring the momentary short circuit current at each ARINC output pin.
V+ = +12V to +15V, V- = -12V to -15V, T = Operating Temperature Range (unless otherwise stated)
A
PARAMETERS
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Input voltage (TX1IN, TX0IN, SLP1.5)
high
V
2.1
-
V+
volts
low
V
-
-
0.5
volts
Input current (TX1IN, TX0IN, SLP1.5)
source
I
V
= 0V
-
-
0.1
A
sink
I
V
= 5V
-
-
0.1
A
ARINC output voltage (Differential)
zero
V
no load
-11.00
-10.00
-9.00
volts
null
V
no load
-0.50
0
0.50
volts
V+
I
-
6.0
14.0
mA
V-
I
-14.0
-6.0
-
mA
ARINC output impedence
Z
Note1
HI-8585
-
37.5
-
ohms
HI-8586
-
10
-
ohms
IH
IL
IH
IN
IL
IN
DIFF0
DIFFN
DD
EE
OUT
one
V
no load; TXAOUT - TXBOUT
9.00
10.00
11.00
volts
; TXAOUT - TXBOUT
; TXAOUT - TXBOUT
ARINC output voltage (Ref. to GND)
one or zero
V
no load & magnitude at pin
4.50
5.00
5.50
volts
null
V
no load
-0.25
0
0.25
volts
Operating supply current
DIFF1
DOUT
NOUT
SLP1.5 = V+
TX1IN & TX0IN = 0V: no load
IN & TX1IN = 0V: no load
TX0
HOLT INTEGRATED CIRCUITS
3
A
defined in Figure 3, no load
pin 1 = logic 1
HI-8585, HI-8586
Notes:
1. All data taken in still air on devices soldered to single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
5. 8 Lead Plastic SOIC (Thermally enhanced with built in heat sink). Heat sink not soldered to the PCB.
6. 8 Lead Plastic SOIC (Thermally enhanced with built in heat sink). Heat sink soldered to the PCB.
7. Similar results would be obtained with TXAOUT shorted to TXBOUT.
8. For applications requiring survival with continuous short circuit, operation above Tj = 175C is not recommended.
9. Data will vary depending on air flow and the method of heat sinking employed.
pin 1 = logic 1
PACKAGE THERMAL CHARACTERISTICS
SUPPLY CURRENT (mA)
2
JUNCTION TEMP, Tj (C)
Ta = 25
o
C
Ta = 85
o
C
Ta=125
o
C
Ta = 25
o
C
Ta = 85
o
C
Ta=125
o
C
Low Speed
3
16.8
17.2
16.9
58
116
157
High Speed
4
27.3
26.7
25.9
75
132
169
Low Speed
17.4
17.5
16.9
68
126
166
High Speed
27.6
27.1
25.9
97
147
186
Low Speed
17.1
17.2
16.7
52
110
151
High Speed
27.3
27.1
26.2
57
112
157
SUPPLY CURRENT (mA)
2
JUNCTION TEMP, Tj (C)
Ta = 25
o
C
Ta = 85
o
C
Ta=125
o
C
Ta = 25
o
C
Ta = 85
o
C
Ta=125
o
C
Low Speed
3
53.6
50.7
52.2
131
181
217
High Speed
4
46.9
38.7
42.5
135
181
219
Low Speed
46.4
47.6
68.1
167
191
221
High Speed
42.1
43.8
67.1
177
212
223
Low Speed
48.5
45.6
46.1
112
161
186
High Speed
46.8
41.1
40.5
116
168
197
8 Le a d Pla stic SOIC
6
PACKAGE STYLE
1
M AXIM U M ARINC LOAD
9
TXAOUT and TXBOUT Shorted to Ground
7, 8, 9
8 Le a d Pla stic SOIC
5
8 Le a d Pla stic SOIC
6
ARINC 429
DATA RATE
ARINC 429
DATA RATE
PACKAGE STYLE
1
8 Le a d Plastic DIP
8 Le a d Plastic DIP
8 Le a d Pla stic SOIC
5
Notes:
1. Guaranteed but not tested
HOLT INTEGRATED CIRCUITS
4
HI-8585, HI-8586
0V
10V
-10V
5V
0V
5V
0V
t rx
t
10%
90%
t
t
10%
90%
t rx
t
phlx
t
phlx
t
plhx
t
10%
plhx
t
pin 3
pin 2
FIGURE 3 - LINE DRIVER TIMING
t fx
t
fx
DIFF
PART
PACKAGE
TEMPERATURE
BURN
LEAD
NUMBER
DESCRIPTION
RANGE
FLOW
IN
FINISH
HI-8585PDI
8 PIN PLASTIC DIP
-40C TO +85C
I
NO
SOLDER
HI-8585PDT
8 PIN PLASTIC DIP
-55C TO +125C
T
NO
SOLDER
HI-8585PSI
8 PIN PLASTIC ESOIC - NB
-40C TO +85C
I
NO
SOLDER
HI-8585PST
8 PIN PLASTIC ESOIC - NB
-55C TO +125C
T
NO
SOLDER
HI-8585CDI
8 PIN CERAMIC SIDE BRAZED DIP
-40C TO +85C
I
NO
GOLD
HI-8585CDT
8 PIN CERAMIC SIDE BRAZED DIP
-55C TO +125C
T
NO
GOLD
HI-8585CDM 8 PIN CERAMIC SIDE BRAZED DIP
-55C TO +125C
M
YES
SOLDER
HI-8585CRI
8 PIN CERDIP
-40C TO +85C
I
NO
SOLDER
HI-8585CRT
8 PIN CERDIP
-55C TO +125C
T
NO
SOLDER
HI-8585CRM 8 PIN CERDIP
-55C TO +125C
M
YES
SOLDER
HI-8586PDI
8 PIN PLASTIC DIP
-40C TO +85C
I
NO
SOLDER
HI-8586PDT
8 PIN PLASTIC DIP
-55C TO +125C
T
NO
SOLDER
HI-8586PSI
8 PIN PLASTIC ESOIC - NB
-40C TO +85C
I
NO
SOLDER
HI-8586PST
8 PIN PLASTIC ESOIC - NB
-55C TO +125C
T
NO
SOLDER
HI-8586CDI
8 PIN CERAMIC SIDE BRAZED DIP
-40C TO +85C
I
NO
GOLD
HI-8586CDT
8 PIN CERAMIC SIDE BRAZED DIP
-55C TO +125C
T
NO
GOLD
HI-8586CDM 8 PIN CERAMIC SIDE BRAZED DIP
-55C TO +125C
M
YES
SOLDER
HI-8586CRI
8 PIN CERDIP
-40C TO +85C
I
NO
SOLDER
HI-8586CRT
8 PIN CERDIP
-55C TO +125C
T
NO
SOLDER
HI-8586CRM 8 PIN CERDIP
-55C TO +125C
M
YES
SOLDER
Legend:
NB
- Narrow Body
ESOIC - Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink)
HOLT INTEGRATED CIRCUITS
5
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