HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2001.05.01
Page No. : 1/2
HAD825SP
HSMC Product Specification
HAD825SP
NPN EPITAXIAL PLANAR TRANSISTOR
Features
Darlington Transistor
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature .......................................................................................... -55 ~ +150
C
Junction Temperature................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) .............................................................................. 625 mW
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ........................................................................................ 80 V
VCES Collector to Emitter Voltage ..................................................................................... 55 V
VEBO Emitter to Base Voltage ........................................................................................... 12 V
IC Collector Current ...................................................................................................... 600 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
80
-
-
V
IC=100uA, IE=0
BVCES
55
-
-
V
IC=100uA, IB=0
BVEBO
12
-
-
V
IE=10uA, IC=0
ICBO
-
-
100
nA
VCB=60V, IE=0
IEBO
-
-
100
nA
VEB=10V, IC=0
ICES
-
-
500
nA
VCE=50V, IB=0
*VCE(sat)1
-
-
1.2
V
IC=10mA, IB=0.01mA
*VCE(sat)2
-
-
1.5
V
IC=100mA, IB=0.1mA
*VBE(on)
-
-
1.5
V
IC=100mA, VCE=5V
*hFE1
10K
-
-
IC=10mA, VCE=5V
*hFE2
10K
-
100K
IC=100mA, VCE=5V
fT
125
-
-
MHz
VCE=5V, IC=10mA, f =100MHz
Cob
-
-
8
pF
VCB=10V, f=1MHz
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2001.05.01
Page No. : 2/2
HAD825SP
HSMC Product Specification
TO-92SP Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1450
0.1650
3.70
4.20
E
0.0160
0.0240
0.41
0.61
B
0.1063
0.1300
2.70
3.30
F
-
*0.0150
-
*0.38
C
0.5000
-
12.7
-
G
0.0800
0.1050
2.03
2.67
D
-
*0.1000
-
*2.54
Notes :
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056
Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Style : Pin 1.Emitter 2.Collector 3.Base
B
A
C
D
3
2
1
E
G
F
3-Lead TO-92SP Plastic Package, HSMC Package Code : N
PDF 
ZIP