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Электронный компонент: HAD826SP

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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2000.10.01
Page No. : 1/3
HSMC Product Specification
HAD826SP
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HAD826SP is designed for general purpose amplifier and high speed, medium-power switching
applications.
Features
Low Collector Saturation Voltage
High Speed Switching
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature....................................................................................................... -55 ~ +150
C
Junction Temperature ................................................................................................. 150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C)........................................................................................... 500 mW
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage..................................................................................................... 75 V
VCEO Collector to Emitter Voltage ................................................................................................. 40 V
VEBO Emitter to Base Voltage ......................................................................................................... 6 V
IC Collector Current .................................................................................................................. 500 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
75
-
-
V
IC=10uA, IE=0
BVCEO
40
-
-
V
IC=10mA, IB=0
BVEBO
6
-
-
V
IE=10uA, IC=0
ICBO
-
-
10
nA
VCB=60V, IE=0
ICEX
-
-
10
nA
VCB=60V, VEB(OFF)=3V
IEBO
-
-
50
nA
VEB=3V, IC=0
*VCE(sat)1
-
-
300
mv
IC=150mA, IB=15mA
*VCE(sat)2
-
-
1
V
IC=500mA, IB=50mA
*VBE(sat)1
-
-
1.2
V
IC=150mA, IB=15mA
*VBE(sat)2
-
-
2
V
IC=500mA, IB=50mA
*hFE1
35
-
-
VCE=10V, IC=100uA
*hFE2
50
-
-
VCE=10V, IC=1mA
*hFE3
75
-
-
VCE=10V, IC=10mA
*hFE4
100
-
300
VCE=10V, IC=150mA
*hFE5
40
-
-
VCE=10V, IC=500mA
*hFE6
50
-
-
VCE=1V, IC=150mA
fT
300
-
-
MHz
VCE=20V, IC=20mA, f =100MHz
Cob
-
-
8
pF
VCB=10V, f=1MHz
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2000.10.01
Page No. : 2/3
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
10
100
1000
0.1
1
10
100
1000
Collector Current (mA)
hF
E
V
CE
=10V
V
CE
=1V
Saturation Voltage & Collector Current
10
100
1000
10000
0.1
1
10
100
1000
Collector Current (mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
V
BE(sat)
@ I
C
=10I
B
V
CE(sat)
@ I
C
=10I
B
Capacitance & Reverse-Biased Voltage
1
10
100
0.1
1
10
100
1000
Reverse Biased Voltage (V)
Ca
p
a
c
i
t
a
n
c
e
(
p
F
)
Cob
Cutoff Frequency & Collector Current
1
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
y
(
M
H
z
)
fT
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2000.10.01
Page No. : 3/3
HSMC Product Specification
TO-92SP Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1450
0.1650
3.70
4.20
E
0.0160
0.0240
0.41
0.61
B
0.1063
0.1300
2.70
3.30
F
-
*0.0150
-
*0.38
C
0.5000
-
12.7
-
G
0.0800
0.1050
2.03
2.67
D
-
*0.1000
-
*2.54
Notes :
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056
Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
Style : Pin 1.Emitter 2.Collector 3.Base
B
A
C
D
3
2
1
E
G
F
3-Lead TO-92SP Plastic Package, HSMC Package Code : N