HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6834
Issued Date : 1998.02.01
Revised Date : 2002.10.24
Page No. : 1/3
HBAV99
HSMC Product Specification
HBAV99
HIGH-SPEED SWITCHING DIODE
Description
The HBAV99 consists of two diodes in a plastic surface mount
package. The diodes are connected in series and the unit is
designed for high-speed switching application in hybrid thick and
thin-film circuits.
Features
Small SMD Package (SOT-23)
Ultra-high Speed
Low Forward Voltage
Fast Reverse Recovery Time
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -65 ~ +150
C
Junction Temperature .................................................................................................... +150
C
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ................................................................................ 250 mW
Maximum Voltages and Currents (Ta=25
C)
Reverse Voltage .................................................................................................................. 70 V
Repetitive Reverse Voltage ................................................................................................. 70 V
Forward Current ............................................................................................................. 150 mA
Repetitive Forward Current ............................................................................................ 500 mA
Forward Surge Current (1ms)....................................................................................... 1000 mA
Characteristics
(Ta=25
C)
Characteristic
Symbol
Condition
Min
Max
Unit
Reverse Breakdown Voltage
V(BR)
IR=100uA
70
-
V
VF(1)
IF=1mA
-
715
mV
VF(2)
IF=10mA
-
855
mV
VF(3)
IF=50mA
-
1000
mV
Forward Voltage
VF(4)
IF=150mA
-
1250
mV
Reverse Current
IR
VR=70
-
2.5
uA
Total Capacitance
CT
VR=0, f=1MHz
-
1.5
pF
Reverse Recovery Time
Trr
IF=IR=10mA, RL=100
measured at IR=1mA
-
6
nS
SOT-23
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6834
Issued Date : 1998.02.01
Revised Date : 2002.10.24
Page No. : 2/3
HBAV99
HSMC Product Specification
Characteristics Curve
Forward Biased Voltage & Forward Current
0
150
300
450
0
500
1000
1500
2000
Forward Biased Voltage-VF (mV)
Cu
r
r
e
n
t
-
I
F
(m
A
)
Capacitance & Reverse-Biased Voltage
0.1
1
0.1
1
10
100
Reverse Biased Voltage-V
R
(V)
Ca
p
a
c
i
t
a
n
c
e
-
Cd
(
p
F
)
Power Derating
0
50
100
150
200
250
300
0
20
40
60
80
100
120
140
160
Ta(
o
C ), Ambient Temperature
P
D
(mW
),
P
o
w
e
r D
i
s
s
i
p
a
t
i
o
n
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6834
Issued Date : 1998.02.01
Revised Date : 2002.10.24
Page No. : 3/3
HBAV99
HSMC Product Specification
SOT-23 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1102
0.1204
2.80
3.04
J
0.0034
0.0070
0.085
0.177
B
0.0472
0.0630
1.20
1.60
K
0.0128
0.0266
0.32
0.67
C
0.0335
0.0512
0.89
1.30
L
0.0335
0.0453
0.85
1.15
D
0.0118
0.0197
0.30
0.50
S
0.0830
0.1083
2.10
2.75
G
0.0669
0.0910
1.70
2.30
V
0.0098
0.0256
0.25
0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Style: Pin 1.Anode 2.Cathode
3.Common Connection
3-Lead SOT-23 Plastic Surface Mounted Package
HSMC Package Code: N
Marking:
Rank Code
A 7
Control Code
Diagram:
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