HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6446-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 1/4
HSMC Product Specification
HBC237
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBC237 is primarily intended for in driver stage of audio
amplifiers.
Features
High Breakdown Voltage: 45V at IC=2mA
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature ................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ............................................................................... 400 mW
Maximum Voltages and Currents (Ta=25
C)
VCES Collector to Emitter Voltage...................................................................................... 50 V
VCEO Collector to Emitter Voltage ..................................................................................... 45 V
VEBO Emitter to Base Voltage ............................................................................................. 5 V
IC Collector Current ...................................................................................................... 100 mA
Characteristics
(Ta=25
C,
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCES
50
-
-
V
IC=100uA, VEB=0
BVCEO
45
-
-
V
IC=2mA, IB=0
BVEBO
6
-
-
V
IE=100uA, IC=0
ICES
-
-
15
nA
VCB=50V, IE=0
IEBO
-
-
100
nA
VEB=4V, IC=0
VBE(on)
550
-
700
mV
IC=2mA, VCE=5V
*VCE(sat)1
-
-
200
mV
IC=10mA, IB=0.5mA
*VCE(sat)2
-
-
600
mV
IC=100mA, IB=5mA
*VBE(sat)1
-
-
1.05
V
IC=100mA, IB=5mA
*VBE(sat)2
-
-
830
mV
IC=10mA, IB=0.5mA
*hFE1
50
-
-
VCE=5V, IC=10uA
*hFE2
120
-
800
VCE=5V, IC=2mA
*hFE3
60
-
-
VCE=5V, IC=100mA
fT
150
-
-
MHz
VCE=5V, IC=10mA, f=100MHz
Cob
-
-
4.5
PF
VCB=10V, IE=0, f=1MHz
Classification of hFE2
Rank
A
B
C
Range
120-220
180-460
300-800
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6446-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 2/4
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
10
100
1000
1
10
100
1000
Collector Current (mA)
hF
E
V
CE
=5V
Saturation Voltage & Collector Current
0.01
0.1
1
10
100
1
10
100
1000
10000
Collector Current (mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
VCE(sat)
@ I
C
=10I
B
V
BE(sat)
@ I
C
=10I
B
On Voltage & Collector Current
0.1
1
10
1
10
100
1000
Collector Current (mA)
On
V
o
l
t
a
g
e
(
m
V
)
V
BE(on)
@ V
CE
=5V
Cutoff Frequency & Collector Current
1
10
100
1000
1
10
100
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
y
(
M
H
z
)
V
CE
=5V
Capacitance & Reverse-Biased Voltage
1
10
1
10
100
Reverse Biased Voltage (V)
C
a
pa
c
i
t
a
n
c
e (
P
f
)
Cob
Safe Operating Area
0.01
0.1
1
10
1
10
100
Forward Voltage (V)
C
o
l
l
e
c
t
o
r
C
u
rre
n
t
(mA
)
PT=1s
PT=100ms
PT=1ms
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6446-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 4/4
HSMC Product Specification
TO-92 Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1704
0.1902
4.33
4.83
G
0.0142
0.0220
0.36
0.56
B
0.1704
0.1902
4.33
4.83
H
-
*
0.1000
-
*
2.54
C
0.5000
-
12.70
-
I
-
*
0.0500
-
*
1.27
D
0.0142
0.0220
0.36
0.56
1
-
*
5
-
*
5
E
-
*
0.0500
-
*
1.27
2
-
*
2
-
*
2
F
0.1323
0.1480
3.36
3.76
3
-
*
2
-
*
2
Notes :
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
3
1
A
D
B
C
I
1
E
F
2
3
G
H
2
Style : Pin 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package
HSMC Package Code : A
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
Laser Mark
HSMC Logo
Part Number
Product Series
Ink Mark
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