HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 1/4
HBC327
HSMC Product Specification
HBC327
PNP EPITAXIAL PLANAR TRANSISTOR
Description
This HBC327 is designed for driver and output-stages of audio
amplifiers.
Features
High DC Current Gain: 100-600 at IC=100mA,VCE=1V
Complementary to HBC337
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature .................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ................................................................................ 625 mW
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ........................................................................................ -50 V
VCEO Collector to Emitter Voltage ..................................................................................... -45 V
VEBO Emitter to Base Voltage ............................................................................................. -5 V
IC Collector Current ...................................................................................................... -500 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
-50
-
-
V
IC=-100uA, IE=0
BVCEO
-45
-
-
V
IC=-10mA, IB=0
BVEBO
-5
-
-
V
IE=-100uA, IC=0
ICBO
-
-
-100
nA
VCB=-30V, IE=0
IEBO
-
-
-100
nA
VEB=-5V, IC=0
*hFE1
100
-
600
VCE=-1V, IC=-100Ma
*hFE2
40
-
-
VCE=-1V, IC=-300mA
*VCE(sat)1
-
-
-0.7
V
IC=-500mA, IB=-50mA
VBE(on)
-
-
-1.2
V
VCE=-1V, IC=-300mA,
fT
-
100
-
MHZ
VCE=-5V, IC=-10mA, f=100MHZ
Cob
-
4
-
PF
VCB=-10V, f=1MHZ, IC=0
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
Classification of hFE1
Rank
16
25
40
Range
100-250
160-400
250-600
TO-92
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 2/4
HBC327
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
10
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
hFE
hFE @ V
CE
=1V
25
o
C
75
o
C
125
o
C
Saturation Voltage & Collector Current
10
100
1000
0.1
1
10
100
1000
Collector Current-I
C
(mA)
Sa
t
u
r
a
t
i
o
n
Vo
l
t
a
g
e
(
m
V)
25
o
C
75
o
C
125
o
C
V
CE(sat)
@ I
C
=10I
B
ON Voltage & Collector Current
100
1000
0.1
1
10
100
1000
Collector Current-I
C
(mA)
O
N
V
o
l
t
age (
m
V
)
125
o
C
75
o
C
25
o
C
V
BE(ON)
@ V
CE
=1V
Cutoff Frequency & Collector Current
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
y
(
M
H
z
)
...
V
CE
=5V
Capacitance & Reverse-Biased Voltage
1
10
100
0.1
1
10
100
Reverse Biased Voltage (V)
C
apa
c
i
t
anc
e (
p
F
)
Cob
Safe Operating Area
1
10
100
1000
10000
1
10
100
Forward Voltage-V
CE
(V)
Co
lle
c
t
o
r
Cu
r
r
e
n
t
-
I
C
(m
A
)
PT=1ms
PT=100ms
PT=1s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 4/4
HBC327
HSMC Product Specification
TO-92 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1704
0.1902
4.33
4.83
G
0.0142
0.0220
0.36
0.56
B
0.1704
0.1902
4.33
4.83
H
-
*
0.1000
-
*
2.54
C
0.5000
-
12.70
-
I
-
*
0.0500
-
*
1.27
D
0.0142
0.0220
0.36
0.56
1
-
*
5
-
*
5
E
-
*
0.0500
-
*
1.27
2
-
*
2
-
*
2
F
0.1323
0.1480
3.36
3.76
3
-
*
2
-
*
2
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
3
1
A
D
B
C
I
1
E
F
2
3
G
H
2
Style: Pin 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package
HSMC Package Code: A
Marking:
H
C
2
3
7
Date Code
Control Code
B
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