HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6831
Issued Date : 1994.01.25
Revised Date : 2002.10.24
Page No. : 1/3
HBC817
HSMC Product Specification
HBC817
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBC817 is designed for switching and AF amplifier amplification
suitable for driver stages and low power output stages.
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature .......................................................................................... -55 to +150
C
Junction Temperature.................................................................................................... +150
C
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ............................................................................... 225 mW
Maximum Voltages and Currents (Ta=25
C)
VCES Collector to Base Voltage ......................................................................................... 50 V
VCEO Collector to Emitter Voltage...................................................................................... 45 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current ....................................................................................................... 800 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCEO
45
-
-
V
IC=10mA
BVCES
50
-
-
V
IC=100uA
BVEBO
5
-
-
V
IE=100uA
ICES
-
-
100
nA
VCE=25V
IEBO
-
-
100
nA
VEB=4V
*VCE(sat)
-
-
700
mV
IC=500mA, IB=50mA
VBE(on)
-
-
1.2
V
VCE=1V, IC=300mA
*hFE
100
-
630
VCE=1V, IC=100mA
fT
-
100
-
MHz
VCE=5V, IC=10mA. f=100MHz
Cob
-
-
12
pF
VCB=10V, f=1.0MHz, IE=0
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
Classification Of hFE
Rank
8FA(16)
8FB(25)
8FC(40)
hFE
100-250
160-400
250-630
SOT-23
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6831
Issued Date : 1994.01.25
Revised Date : 2002.10.24
Page No. : 2/3
HBC817
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
10
100
1000
0.1
1
10
100
1000
Collector Current (mA)
hF
E
hFE @ V
CE
=1V
Saturation Voltage & Collector Current
10
100
1000
0.1
1
10
100
1000
Collector Current (mA)
S
a
t
u
r
a
t
i
on V
o
lt
age (
m
V
)
V
CE(sat)
@ I
C
=10IB
On Voltage & Collector Current
100
1000
10000
0.1
1
10
100
1000
Collector Current (mA)
O
n
V
o
l
t
age (
m
V
)
V
BE(on)
@ V
CE
=1V
Capacitance & Reverse-Biased Voltage
1
10
100
0.1
1
10
100
Reverse-Biased Voltage (V)
C
apac
it
anc
e (
p
F
)
Cob
Cutoff Frequency & Collector Current
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
t
o
f
f
F
r
equenc
e (
M
H
z
)
V
CE
=5V
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6831
Issued Date : 1994.01.25
Revised Date : 2002.10.24
Page No. : 3/3
HBC817
HSMC Product Specification
SOT-23 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1102
0.1204
2.80
3.04
J
0.0034
0.0070
0.085
0.177
B
0.0472
0.0630
1.20
1.60
K
0.0128
0.0266
0.32
0.67
C
0.0335
0.0512
0.89
1.30
L
0.0335
0.0453
0.85
1.15
D
0.0118
0.0197
0.30
0.50
S
0.0830
0.1083
2.10
2.75
G
0.0669
0.0910
1.70
2.30
V
0.0098
0.0256
0.25
0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Style: Pin 1.Base 2.Emitter 3.Collector
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Marking:
Rank Code
8 F
Control Code
PDF 
ZIP