HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6619-C
Issued Date : 1994.07.22
Revised Date : 2000.10.01
Page No. : 1/3
HSMC Product Specification
HBD675
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBD675 is designed for use as output devices in
complementary general purpose amplifier applications.
Absolute Maximum Ratings
(Ta=25
C)
Maximum Temperatures
Storage Temperature ............................................................................................ -50 ~ +150
C
Junction Temperature ................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25
C) .................................................................................... 20 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage ...................................................................................... 45 V
BVCEO Collector to Emitter Voltage................................................................................... 45 V
BVEBO Emitter to Base Voltage ........................................................................................... 5 V
IC Collector Current .............................................................................................................. 4 A
IB Base Current ................................................................................................................ 0.1 A
Electrical Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
45
-
-
V
IC=1mA
BVCEO
45
-
-
V
IC=50mA
BVEBO
5
-
-
V
IE=100uA
ICEO
-
-
500
uA
VCE=25V
ICBO
-
-
200
uA
VCB=45V
IEBO
-
-
2
mA
VBE=5V
*VCE(sat)
-
-
2.5
V
IC=1.5A, IB=30mA
*VBE(on)
-
-
2.5
V
IC=1.5A, VCE=3V
*hFE
750
-
-
IC=1.5A, VCE=3V
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6619-C
Issued Date : 1994.07.22
Revised Date : 2000.10.01
Page No. : 2/3
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
100
1000
10000
100
1000
10000
Collector Current (mA)
hF
E
V
CE
=3V
Saturation Voltage & Collector Current
100
1000
10000
100
1000
10000
Collector Current (mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
V
CE(sat)
@ I
C
=50I
B
On Voltage & Collector Current
0.1
1
10
100
1000
10000
Collector Current (mA)
On
V
o
l
t
a
g
e
(
m
V
)
V
BE(on)
@ VCE=3V
Capacitance & Reverse-Biased Voltage
1
10
100
1000
1
10
100
Reverse Biased Voltage (V)
C
a
p
a
c
i
ta
n
c
e
(
P
f)
Cob
Safe Operating Area
0.01
0.1
1
10
100
1
10
100
1000
Forward Voltage (V)
C
o
l
l
e
c
t
o
r
C
u
rre
n
t
(A
)
P
T
=1 ms
P
T
=100 ms
P
T
=1 s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6619-C
Issued Date : 1994.07.22
Revised Date : 2000.10.01
Page No. : 3/3
HSMC Product Specification
TO-126ML Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1356
0.1457
3.44
3.70
I
-
*0.1795
-
*4.56
B
0.0170
0.0272
0.43
0.69
J
0.0268
0.0331
0.68
0.84
C
0.0344
0.0444
0.87
1.12
K
0.5512
0.5906
14.00
15.00
D
0.0501
0.0601
1.27
1.52
L
0.2903
0.3003
7.37
7.62
E
0.1131
0.1231
2.87
3.12
M
0.1378
0.1478
3.50
3.75
F
0.0737
0.0837
1.87
2.12
N
0.1525
0.1625
3.87
4.12
G
0.0294
0.0494
0.74
1.25
O
0.0740
0.0842
1.88
2.14
H
0.0462
0.0562
1.17
1.42
Notes :
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
N
D
E
M
L
K
F
I
A
B
C
H
J
3
2
1
O
G
Style : Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-126ML Plastic Package
HSMC Package Code : D
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
Ink Marking
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